Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is actively expanding its business in the semiconductor industry, particularly in advanced packaging and storage chip sectors, benefiting from the demand surge driven by AI infrastructure [2][3]. Group 1: Company Developments - On October 14, 2025, the company announced a strategic investment in Hefei Xinfeng Technology Co., Ltd., acquiring a 27.5445% stake and forming a partnership to develop 3D DRAM and other storage chip packaging services [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 3D, and SiP, leveraging its expertise in bump manufacturing as a foundational technology [2]. - As of September 30, 2025, the company reported a revenue of 1.295 billion yuan, a year-on-year increase of 21.05%, and a net profit of 124 million yuan, up 23.21% [9]. Group 2: Business Operations - The main business of Hefei Xinhui Microelectronics is high-end integrated circuit packaging and testing services, with a revenue composition of 90.25% from display driver chip packaging [3][8]. - The company has established a significant customer base in the OLED sector, including major players like Novatek and Raydium [2]. - As of the latest report, overseas revenue accounted for 54.15% of total revenue, benefiting from the depreciation of the Chinese yuan [4]. Group 3: Market Performance - On January 8, the company's stock rose by 8.98%, with a trading volume of 1.332 billion yuan and a market capitalization of 15.815 billion yuan [1]. - The average trading cost of the stock is 16.54 yuan, with the stock price approaching a resistance level of 18.38 yuan, indicating potential for upward movement if the resistance is broken [7].

来源：新浪证券-红岸工作室 12月31日，汇成股份涨0.00%，成交额8.93亿元，换手率6.22%，总市值140.53亿元。 异动分析 存储芯片+先进封装+OLED+芯片概念+人民币贬值受益 1、2025年10月14日公司，合肥新汇成微电子股份有限公司举办特定对象调研活动，向舟资本、兴全基 金、平安资管等多家机构投资者披露重磅布局：公司通过直接与间接投资相结合，拿下合肥鑫丰科技有 限公司（简称 "鑫丰科技"）27.5445% 股权，并与鑫丰科技股东华东科技（苏州）有限公司（简称 "华 东科技"）达成战略合作，共同拓展 3D DRAM 等存储芯片封测业务，瞄准 AI 基建时代下存储芯片的爆 发式需求。 2、据2023年2月投资者关系活动记录表： Chiplet先进封装技术是凸块制造、Fan-out、3D、SiP等高端先 进封装技术的集合，公司掌握的凸块制造技术是Chiplet的基础之一。在研发端，公司将以客户需求为导 向，基于凸块制造技术，纵向拓展技术边界，积极布局Fan-out、2.5D/3D、SiP等高端先进封装技术。 3、2024年7月3日公司投资者关系活动记录表：公司目前OLED客户主要包括联咏、瑞鼎 ...

Core Viewpoint - The article highlights the progress of domestic EDA (Electronic Design Automation) companies in China, particularly focusing on the IPO process of Chip and Semiconductor Technology (Shanghai) Co., Ltd., which has completed its IPO counseling and is now entering the Sci-Tech Innovation Board application process, indicating a rapid acceleration in the industry's capitalization process [1]. Group 1: Company Overview - Chip and Semiconductor Technology specializes in EDA software development, covering a full chain of business from chip design to system-level design, with a core focus on advanced packaging simulation and system-level EDA tools [2][3]. - The company has developed multi-physical engine technologies for SI/PI/electromagnetic/thermal/stress simulations, creating a comprehensive EDA solution that supports high-performance computing chip design, applicable in sectors like 5G, smartphones, IoT, AI, and data centers [3]. Group 2: Industry Recognition and Partnerships - The company has received recognition as a national-level "specialized and innovative" small giant enterprise and has won the National Science and Technology Progress Award for its project on RF system design automation, establishing itself as a benchmark in the domestic EDA field [4]. - Partnerships have been formed with notable companies such as SMIC and Samsung, and it is the first domestic EDA company to join the UCIe Chiplet industry alliance, enhancing its influence in the industry [4]. Group 3: Financial Performance and Growth - The company has completed multiple rounds of financing, with over 100 million yuan raised in its B round in 2021, and the latest round in October 2022 involved investments from various notable institutions, providing strong support for its technological development [4]. - Projected revenues for 2023 and 2024 are 106 million yuan and 265 million yuan respectively, with the latter year expected to achieve profitability, indicating significant improvement in its commercial capabilities [4]. Group 4: Market Context - The A-share market has seen the emergence of three listed EDA companies, forming a capitalization ladder for domestic EDA enterprises, with combined revenues exceeding 900 million yuan in the first half of 2025, showcasing a strong growth trend in the industry [6]. - However, there is a noticeable differentiation in growth structure and profitability among these companies, reflecting the evolving competitive landscape within the rapidly developing domestic EDA sector [6].

12月11日，汇成股份涨0.20%，成交额3.21亿元，换手率2.42%，总市值131.78亿元。 2、据2023年2月投资者关系活动记录表： Chiplet先进封装技术是凸块制造、Fan-out、3D、SiP等高端先 进封装技术的集合，公司掌握的凸块制造技术是Chiplet的基础之一。在研发端，公司将以客户需求为导 向，基于凸块制造技术，纵向拓展技术边界，积极布局Fan-out、2.5D/3D、SiP等高端先进封装技术。 3、合肥新汇成微电子股份有限公司的主营业务是集成电路高端先进封装测试服务。公司的主要产品是 集成电路封装测试。 来源：新浪证券-红岸工作室 异动分析 存储芯片+先进封装+芯片概念+人民币贬值受益+专精特新 1、2025年10月14日公司，合肥新汇成微电子股份有限公司举办特定对象调研活动，向舟资本、兴全基 金、平安资管等多家机构投资者披露重磅布局：公司通过直接与间接投资相结合，拿下合肥鑫丰科技有 限公司（简称 "鑫丰科技"）27.5445% 股权，并与鑫丰科技股东华东科技（苏州）有限公司（简称 "华 东科技"）达成战略合作，共同拓展 3D DRAM 等存储芯片封测业务，瞄准 AI 基建时代下 ...

Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically investing in the storage chip and advanced packaging sectors to capitalize on the growing demand driven by AI infrastructure [2][3]. Group 1: Company Overview - Hefei Xinhui Microelectronics Co., Ltd. specializes in high-end integrated circuit packaging and testing services, with its main products being integrated circuit packaging tests [3]. - The company was established on December 18, 2015, and went public on August 18, 2022. Its primary business involves gold bumping, wafer testing, and various packaging processes, contributing to a comprehensive service capability for display driver chips [8]. Group 2: Financial Performance - For the period from January to September 2025, the company achieved a revenue of 1.295 billion yuan, representing a year-on-year growth of 21.05%, and a net profit attributable to shareholders of 124 million yuan, with a year-on-year increase of 23.21% [9]. - As of September 30, 2025, the company had a total of 23,500 shareholders, an increase of 15.93% from the previous period, with an average of 36,445 circulating shares per person, up by 27.82% [9]. Group 3: Strategic Investments - The company has acquired a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd. and has formed a strategic partnership with East China Technology (Suzhou) Co., Ltd. to expand into 3D DRAM and other storage chip packaging businesses [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 2.5D/3D, and SiP, to meet customer demands and enhance its technological capabilities [2]. Group 4: Market Position and Trends - The company benefits from a significant overseas revenue share of 54.15%, largely due to the depreciation of the Chinese yuan [4]. - The main customers for the company's OLED products include several notable firms, indicating a strong market presence in the OLED sector [2].

Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is experiencing growth in its advanced packaging and testing services for integrated circuits, benefiting from the depreciation of the RMB and its recognition as a "specialized, refined, distinctive, and innovative" enterprise [2][3][5]. Group 1: Company Overview - Hefei Xinhui Microelectronics was established on December 18, 2015, and went public on August 18, 2022, focusing on advanced packaging and testing services for display driver chips [7]. - The company's main revenue source comes from display driver chip testing, accounting for 90.25% of total revenue, with other services making up 9.75% [7]. - As of June 30, 2025, the company reported a revenue of 866 million yuan, representing a year-on-year growth of 28.58%, and a net profit of approximately 96.04 million yuan, up 60.94% year-on-year [8]. Group 2: Market Position and Recognition - The company has been recognized as a national-level "specialized, refined, distinctive, and innovative" small giant enterprise, which enhances its competitiveness and stability within the industry [3][5]. - The company has a significant overseas revenue share of 54.15%, benefiting from the depreciation of the RMB [4][5]. Group 3: Technical and Financial Analysis - The company is actively expanding its technology boundaries in advanced packaging, focusing on customer needs and developing high-end packaging technologies such as Fan-out, 2.5D/3D, and SiP [2]. - The average trading cost of the company's shares is 13.15 yuan, with current price levels between resistance at 14.42 yuan and support at 10.80 yuan, indicating potential for range trading [6].