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Chiplet先进封装技术
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汇成股份涨0.20%,成交额3.21亿元,近3日主力净流入-1644.81万
Xin Lang Cai Jing· 2025-12-11 08:32
12月11日,汇成股份涨0.20%,成交额3.21亿元,换手率2.42%,总市值131.78亿元。 2、据2023年2月投资者关系活动记录表: Chiplet先进封装技术是凸块制造、Fan-out、3D、SiP等高端先 进封装技术的集合,公司掌握的凸块制造技术是Chiplet的基础之一。在研发端,公司将以客户需求为导 向,基于凸块制造技术,纵向拓展技术边界,积极布局Fan-out、2.5D/3D、SiP等高端先进封装技术。 3、合肥新汇成微电子股份有限公司的主营业务是集成电路高端先进封装测试服务。公司的主要产品是 集成电路封装测试。 来源:新浪证券-红岸工作室 异动分析 存储芯片+先进封装+芯片概念+人民币贬值受益+专精特新 1、2025年10月14日公司,合肥新汇成微电子股份有限公司举办特定对象调研活动,向舟资本、兴全基 金、平安资管等多家机构投资者披露重磅布局:公司通过直接与间接投资相结合,拿下合肥鑫丰科技有 限公司(简称 "鑫丰科技")27.5445% 股权,并与鑫丰科技股东华东科技(苏州)有限公司(简称 "华 东科技")达成战略合作,共同拓展 3D DRAM 等存储芯片封测业务,瞄准 AI 基建时代下 ...
汇成股份跌1.38%,成交额4.62亿元,近3日主力净流入-2623.56万
Xin Lang Cai Jing· 2025-11-04 07:44
Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically investing in the storage chip and advanced packaging sectors to capitalize on the growing demand driven by AI infrastructure [2][3]. Group 1: Company Overview - Hefei Xinhui Microelectronics Co., Ltd. specializes in high-end integrated circuit packaging and testing services, with its main products being integrated circuit packaging tests [3]. - The company was established on December 18, 2015, and went public on August 18, 2022. Its primary business involves gold bumping, wafer testing, and various packaging processes, contributing to a comprehensive service capability for display driver chips [8]. Group 2: Financial Performance - For the period from January to September 2025, the company achieved a revenue of 1.295 billion yuan, representing a year-on-year growth of 21.05%, and a net profit attributable to shareholders of 124 million yuan, with a year-on-year increase of 23.21% [9]. - As of September 30, 2025, the company had a total of 23,500 shareholders, an increase of 15.93% from the previous period, with an average of 36,445 circulating shares per person, up by 27.82% [9]. Group 3: Strategic Investments - The company has acquired a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd. and has formed a strategic partnership with East China Technology (Suzhou) Co., Ltd. to expand into 3D DRAM and other storage chip packaging businesses [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 2.5D/3D, and SiP, to meet customer demands and enhance its technological capabilities [2]. Group 4: Market Position and Trends - The company benefits from a significant overseas revenue share of 54.15%, largely due to the depreciation of the Chinese yuan [4]. - The main customers for the company's OLED products include several notable firms, indicating a strong market presence in the OLED sector [2].
汇成股份涨1.09%,成交额2.76亿元,近3日主力净流入-8245.33万
Xin Lang Cai Jing· 2025-09-03 08:04
Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is experiencing growth in its advanced packaging and testing services for integrated circuits, benefiting from the depreciation of the RMB and its recognition as a "specialized, refined, distinctive, and innovative" enterprise [2][3][5]. Group 1: Company Overview - Hefei Xinhui Microelectronics was established on December 18, 2015, and went public on August 18, 2022, focusing on advanced packaging and testing services for display driver chips [7]. - The company's main revenue source comes from display driver chip testing, accounting for 90.25% of total revenue, with other services making up 9.75% [7]. - As of June 30, 2025, the company reported a revenue of 866 million yuan, representing a year-on-year growth of 28.58%, and a net profit of approximately 96.04 million yuan, up 60.94% year-on-year [8]. Group 2: Market Position and Recognition - The company has been recognized as a national-level "specialized, refined, distinctive, and innovative" small giant enterprise, which enhances its competitiveness and stability within the industry [3][5]. - The company has a significant overseas revenue share of 54.15%, benefiting from the depreciation of the RMB [4][5]. Group 3: Technical and Financial Analysis - The company is actively expanding its technology boundaries in advanced packaging, focusing on customer needs and developing high-end packaging technologies such as Fan-out, 2.5D/3D, and SiP [2]. - The average trading cost of the company's shares is 13.15 yuan, with current price levels between resistance at 14.42 yuan and support at 10.80 yuan, indicating potential for range trading [6].