Investment Rating - The report maintains a "Positive" investment rating for the industry [6]. Core Viewpoints - The introduction of the Rubin CPX technology presents significant investment opportunities in PCB equipment, driven by increased demand for advanced computing capabilities [14][35]. - The Rubin CPX system is designed to enhance performance for large context processing, achieving up to 7.5 times the performance of the current flagship systems [14]. - The report highlights the expected increase in PCB demand due to the integration of new technologies and materials, which will benefit upstream equipment and consumables [35][36]. Summary by Sections Rubin CPX Technology Overview - Rubin CPX integrates 36 Vera CPUs, 144 Rubin GPUs, and 144 Rubin CPX GPUs, optimized for handling large context windows [14]. - The expected shipment of Rubin CPX is projected by the end of 2026 [14]. Performance and Design Enhancements - The Rubin CPX architecture significantly improves power density and cooling solutions, with a power budget of approximately 370 kW for the VR NVL144 CPX [24]. - The design includes a wireless configuration and enhanced PCB midplane for better signal integrity and reduced cable complexity [29][31]. PCB Demand and Equipment Insights - The report anticipates a rise in PCB demand due to the introduction of CPX chips and the need for upgraded materials to support advanced signal transmission [31][35]. - Key production processes for PCBs include drilling, exposure, plating, and testing, with a focus on leading companies in drilling and exposure equipment [36]. Market Outlook - The global scale of PCB production equipment is expected to grow, with significant opportunities in the drilling and plating segments [36]. - The report suggests monitoring leading companies in the PCB equipment sector for potential investment opportunities [36].

Investment Rating - The industry investment rating is "Positive" (maintained) [1] Core Insights - The report highlights a recovery in capital expenditure (Capex) among domestic internet companies, indicating a potential upward trend in the industry [3] - The report discusses the upcoming changes in materials and technologies in the PCB sector, emphasizing the need for new materials to meet the demands of advanced applications [4][5] Summary by Sections New Materials - The M9 level copper-clad laminate (CCL) is expected to undergo significant upgrades, with upstream materials needing to evolve to meet requirements for low dielectric constant and low expansion coefficient [3][4] - Key materials such as quartz fabric, PPO, and hydrocarbon resin are anticipated to become important choices in the future [3] New Architectures - Orthogonal backplanes may replace copper cables as a crucial connection method within cabinets, offering advantages in high-speed transmission and reduced heat generation [4] - The use of orthogonal backplanes is expected to increase PCB usage per cabinet, thereby boosting upstream material demand [4] New Packaging Technologies - Advanced packaging techniques such as PCB process substrate, embedded components, and glass-based materials are evolving to reduce signal loss and improve power integrity [5] - The new packaging methods will require higher specifications for PCB dimensions and will necessitate collaboration across multiple stages, including testing and packaging [5] Investment Recommendations - The report suggests focusing on various aspects such as technological capabilities, production expansion pace, and customer development [6] - Beneficiary stocks in the upstream materials segment include companies like Feilihua, Honghe Technology, and Zhongcai Technology [6] - Beneficiary stocks in the CCL segment include Shengyi Technology and Nanya New Materials [6] - Beneficiary stocks in the PCB segment include companies like Huitian Technology, Shenchao Technology, and Jingsheng Electronics [6]