Summary of Conference Call Notes Company and Industry Involved - **Company**: 长江电子 (Changjiang Electronics) - **Industry**: PCB (Printed Circuit Board) Technology Core Points and Arguments - **Emerging PCB Technologies**: The market is currently flooded with various new PCB technology solutions as the Rubin cabinet approaches shipment and the RubinUltra cabinet plan becomes clearer. There is still no definitive choice between orthogonal backplane and copper cable technology paths for the RubinUltra cabinet [1] - **Focus on CoWoP Technology**: Among the various PCB technology solutions, the CoWoP (Chip-on-Wafer-on-Panel) technology has a strong likelihood of successful implementation and is progressing rapidly. It is expected to transition from the laboratory phase to small-scale production by the end of 2027 and to gradually ramp up to mass production in 2028 [2] - **Cost and Efficiency Benefits**: CoWoP technology allows chips to be directly bonded to PCBs via a silicon interposer, which reduces signal transfer losses, enhances heat dissipation efficiency, and eliminates the need for ABF substrates, thereby lowering costs and addressing substrate capacity shortages [2] - **Value Increase of SLP Products**: The value of SLP (Substrate-like PCB) products used in CoWoP technology is projected to exceed 400,000 yuan per square meter for 24-layer and above SLPs, which is nearly ten times the price of HDI (High-Density Interconnect) and high-layer count products currently used in AI servers [3] Additional Important Content - **Key Players in CoWoP Development**: - **鹏鼎控股 (Pegatron)**: Has a stable mass production capability for high-end SLP products and is actively involved in the CoWoP technology development for NVIDIA [3] - **深南电路 (Shennan Circuits)**: Gradually entering overseas computing power supply due to steady release of substrate capacity and participation in CoWoP technology development [3] - **兴森科技 (XingSen Technology)**: Has strong technical capabilities in substrate technology and is deeply involved in CoWoP technology development since July 2025, anticipating product volume growth [3] - **Other Companies to Watch**: - **沪电股份 (Unimicron)**: Recently announced a $300 million capital expenditure directed towards PCB substrate technology [3] - **胜宏科技 (Shenghong Technology)**: Preparing for production with mSAP equipment, expecting an annual output value of over 1.5 billion yuan [3] - **景旺电子 (Jingwang Electronics)**: Currently ramping up SLP production capacity at its Zhuhai Jinwan factory [3]

Investment Rating - The report maintains a "Positive" investment rating for the industry [6]. Core Viewpoints - The introduction of the Rubin CPX technology presents significant investment opportunities in PCB equipment, driven by increased demand for advanced computing capabilities [14][35]. - The Rubin CPX system is designed to enhance performance for large context processing, achieving up to 7.5 times the performance of the current flagship systems [14]. - The report highlights the expected increase in PCB demand due to the integration of new technologies and materials, which will benefit upstream equipment and consumables [35][36]. Summary by Sections Rubin CPX Technology Overview - Rubin CPX integrates 36 Vera CPUs, 144 Rubin GPUs, and 144 Rubin CPX GPUs, optimized for handling large context windows [14]. - The expected shipment of Rubin CPX is projected by the end of 2026 [14]. Performance and Design Enhancements - The Rubin CPX architecture significantly improves power density and cooling solutions, with a power budget of approximately 370 kW for the VR NVL144 CPX [24]. - The design includes a wireless configuration and enhanced PCB midplane for better signal integrity and reduced cable complexity [29][31]. PCB Demand and Equipment Insights - The report anticipates a rise in PCB demand due to the introduction of CPX chips and the need for upgraded materials to support advanced signal transmission [31][35]. - Key production processes for PCBs include drilling, exposure, plating, and testing, with a focus on leading companies in drilling and exposure equipment [36]. Market Outlook - The global scale of PCB production equipment is expected to grow, with significant opportunities in the drilling and plating segments [36]. - The report suggests monitoring leading companies in the PCB equipment sector for potential investment opportunities [36].

Investment Rating - The industry investment rating is "Positive" (maintained) [1] Core Insights - The report highlights a recovery in capital expenditure (Capex) among domestic internet companies, indicating a potential upward trend in the industry [3] - The report discusses the upcoming changes in materials and technologies in the PCB sector, emphasizing the need for new materials to meet the demands of advanced applications [4][5] Summary by Sections New Materials - The M9 level copper-clad laminate (CCL) is expected to undergo significant upgrades, with upstream materials needing to evolve to meet requirements for low dielectric constant and low expansion coefficient [3][4] - Key materials such as quartz fabric, PPO, and hydrocarbon resin are anticipated to become important choices in the future [3] New Architectures - Orthogonal backplanes may replace copper cables as a crucial connection method within cabinets, offering advantages in high-speed transmission and reduced heat generation [4] - The use of orthogonal backplanes is expected to increase PCB usage per cabinet, thereby boosting upstream material demand [4] New Packaging Technologies - Advanced packaging techniques such as PCB process substrate, embedded components, and glass-based materials are evolving to reduce signal loss and improve power integrity [5] - The new packaging methods will require higher specifications for PCB dimensions and will necessitate collaboration across multiple stages, including testing and packaging [5] Investment Recommendations - The report suggests focusing on various aspects such as technological capabilities, production expansion pace, and customer development [6] - Beneficiary stocks in the upstream materials segment include companies like Feilihua, Honghe Technology, and Zhongcai Technology [6] - Beneficiary stocks in the CCL segment include Shengyi Technology and Nanya New Materials [6] - Beneficiary stocks in the PCB segment include companies like Huitian Technology, Shenchao Technology, and Jingsheng Electronics [6]