Group 1 - The core viewpoint of the article is that Huylv Ecological is currently in the research and development phase of its CPO technology and will advance based on customer demand [2] Group 2 - The company responded to investor inquiries on October 9, indicating its commitment to developing CPO technology [2] - The company is actively engaging with investors regarding its technological advancements and future plans [2]

Core Viewpoint - Cambridge Technology (603083.SH) acknowledges that CPO technology is a key pathway to overcoming speed and power consumption bottlenecks in the optical communication field, but its commercialization process remains uncertain [1] Summary by Relevant Categories Technology Development - The company has initiated preliminary research and development related to CPO technology and has completed the development of some core technology samples [1] - Customer validation processes for CPO technology are currently underway [1] Market Uncertainty - There is significant uncertainty regarding the timeline from prototype to commercial deployment of CPO technology [1] - The impact of CPO technology on supply chain division and structure also carries considerable uncertainty [1]

Core Viewpoint - CPO technology is seen as a key technological path to break through the bottlenecks of speed and power consumption in the optical communication field, but its commercialization process remains uncertain [1] Company Summary - The company has laid out preliminary research and development related to CPO technology and has completed the development of some core technology samples while advancing customer validation [1] - There is uncertainty regarding the cycle from prototype to commercial deployment of CPO technology, which also significantly impacts the supply chain division and landscape [1]

● 本报记者郑萃颖 AI算力需求高速增长，推动核心器件、封装技术快速迭代。在近日举办的第二十六届中国国际光电博 览会上，AI与光通信的深度融合成为展会焦点。与此同时，上市公司积极回应光模块、共封装光学 (CPO)技术进展。 财报显示，受需求驱动，光模块企业上半年业绩增长。行业专家预计，AI产业发展将直接推动光模块 需求激增，1.6T模块成为竞争焦点，但行业还需经历产能与良率爬坡过程。 头部厂商引领技术变革 在中国国际光电博览会上，光通信领域头部企业集中亮相。如光迅科技（002281）展出产品生态矩阵及 多款通感一体化创新产品。立讯技术带来以光电产品为核心的数据中心互连整体方案，并展示了CPO、 1.6T光模块、LPO/LRO低功耗方案等。针对下一代数据中心需求，爱德泰在展会中首次公开展示了CPO 内连解决方案，把多个核心组件集成于CPO混纤模块中，推动光互联向高集成化、小型化方向发展。 新易盛（300502）半年报显示，今年上半年公司实现营业收入104.37亿元，同比增长282.64%；净利润 39.42亿元，同比增长355.68%。高速光模块需求快速增长，今年上半年，新易盛点对点光模块销量695 万只，相比 ...

Core Insights - The core viewpoint of the articles highlights the impressive performance of the two leading companies in the optical module industry, Zhongji Xuchuang and Xinyi Sheng, in the first half of 2025, with net profits of 3.995 billion and 3.942 billion yuan respectively, showcasing significant growth rates of 69.4% and 355.68% [1][3]. Financial Performance - Zhongji Xuchuang achieved a revenue of 14.789 billion yuan, a year-on-year increase of 36.95%, with a net profit of 3.995 billion yuan, reflecting a growth of 69.4% [3][4]. - Xinyi Sheng reported a revenue of 10.437 billion yuan, which is 4.352 billion yuan less than Zhongji Xuchuang, but with a remarkable year-on-year growth rate of 282.64%, and a net profit of 3.942 billion yuan, only 0.53 billion yuan lower than Zhongji Xuchuang, with a growth rate of 355.68% [3][5]. Growth Drivers - Zhongji Xuchuang's growth is attributed to a stable increase in volume and price, with a focus on high-end products, particularly the 800G and 400G optical modules [4][10]. - Xinyi Sheng's rapid growth is driven by an increase in the proportion of high-speed optical modules, improved internal cost control, and aggressive market expansion [5][6]. Profitability and Cost Structure - Zhongji Xuchuang's overall gross margin was 39.33%, with the optical module business gross margin around 40%, showing significant improvement compared to the previous year [7]. - Xinyi Sheng's point-to-point optical module gross margin was 47.48%, an increase of 4.12 percentage points year-on-year [8]. Cash Flow and Expense Management - Zhongji Xuchuang reported a net operating cash flow of 3.218 billion yuan, a year-on-year increase of 232.45%, primarily due to increased customer payments [9]. - Xinyi Sheng's net operating cash flow improved significantly to 0.953 billion yuan, a 427.67% increase year-on-year, reflecting enhanced cash flow management under high growth [9]. Market Trends and Future Outlook - The optical module industry is experiencing a shift towards the widespread adoption of 800G modules and the transition of 1.6T modules from testing to mass production, with CPO technology entering a critical development phase [2][10]. - Both companies are benefiting from the growing demand for AI computing power, particularly in the data center market, which is outpacing traditional telecom markets [10][11]. International Expansion - Zhongji Xuchuang's overseas sales accounted for 86.34% of total revenue, with significant investments in AI infrastructure from key overseas clients [12]. - Xinyi Sheng's overseas sales represented 94.4% of total revenue, with ongoing expansion of production capacity in Thailand [13].

Investment Rating - The report maintains a rating of "Buy" for the industry, specifically highlighting companies such as Zhongji Xuchuang, Xinyi Sheng, and Tianfu Communication as key investment targets [3][10][14]. Core Insights - The global optical communication industry is undergoing a significant transformation driven by AI computing demand, as evidenced by Corning's Q2 financial report showing a 42% year-on-year increase in optical communication revenue and Amphenol's $10.5 billion acquisition of CommScope's CCS business, marking the largest acquisition in the company's history [1][22]. - The transition from Scale-out to Scale-up architecture is fundamentally reshaping the optical communication landscape, emphasizing higher computational density per node rather than merely increasing the number of server nodes [2][23]. Summary by Sections Financial Performance - Corning reported Q2 2025 optical communication revenue of $1.57 billion, a 42% increase year-on-year, with a net profit of $247 million, up 73% year-on-year [4][23]. Industry Trends - The Scale-up strategy is expected to create 2-3 times the market space for Corning's existing $2 billion enterprise network business, with ongoing collaborations with partners like Broadcom to advance CPO technology [4][23]. - Amphenol's acquisition of CommScope's CCS business enhances its vertical competition with Corning, establishing a comprehensive product chain from high-speed fiber connectors to data center cabling [4][23]. Technical Requirements - The Scale-up architecture demands stricter performance requirements for bandwidth and latency, necessitating support for high-frequency data transmission between GPUs and fine-grained memory semantic communication [24][25]. - The transition to Scale-up architecture is pushing optical communication technology towards higher energy efficiency and integration levels, as traditional copper interconnects face physical limits [24][25]. Market Opportunities - The demand for high-density optical interconnects is driving the need for high-speed VCSEL/EML laser chips and silicon photonic engines, with multimode fibers expected to see significant growth due to their cost advantages in short-distance high-density scenarios [11][24]. - The integration capabilities of optical communication equipment vendors are becoming increasingly important, with leading companies leveraging mergers and acquisitions to enhance their comprehensive solution offerings [11][25]. Recommended Stocks - The report recommends focusing on companies within the computing power sector, particularly in optical communication, such as Zhongji Xuchuang, Xinyi Sheng, and Tianfu Communication, as well as companies involved in liquid cooling and edge computing platforms [7][14].

Group 1: Market Performance - The computing power sector experienced significant gains on July 31, with stocks such as Invec, Changfei Fiber, and Hewei Electric seeing consecutive increases, while Chunzhong Technology and Siquan New Materials reached their daily limit [1] - Notable stock performances included Invec (002837.SZ) with a price of 40.21, up 10.01%, and a market cap of 338.70 billion; Hewei Electric (603063.SS) at 37.90, also up 10.01%, with a market cap of 172.28 billion [2] Group 2: Industry Developments - Meta announced an increase in its capital expenditure forecast for 2025 to between 66 billion and 72 billion, driven by investments in talent, infrastructure, data centers, and energy to support the evolving AI competition [4] - Microsoft reported fourth-quarter revenue of 76.44 billion, exceeding analyst expectations, and projected capital expenditures for the next fiscal year to exceed 30 billion [4] - The Ministry of Industry and Information Technology in China emphasized the acceleration of high-quality development in computing power infrastructure during the release of the National Information Development Report (2024) [4] Group 3: Institutional Insights - Guosheng Securities noted that some CSP manufacturers have revised their annual expenditure forecasts upward, indicating a high demand for computing power, with light communication becoming a crucial component of AI infrastructure [5] - According to招商证券, there is a noticeable trend of computing power demand overflow from leading overseas manufacturers, with significant growth in international business for top IDC companies [5] - Huachuang Securities highlighted the rapid iteration of AI large models and smart hardware applications driving a surge in demand for high-performance servers, GPUs, and advanced PCBs [5]

Market Overview - The market experienced a strong upward trend throughout the day, with the ChiNext Index leading the gains. The total trading volume in the Shanghai and Shenzhen markets reached 1.8 trillion yuan, an increase of 609 billion yuan compared to the previous trading day. The Shanghai Composite Index rose by 0.33%, the Shenzhen Component Index by 0.64%, and the ChiNext Index by 1.86% [1]. Sector Performance - The innovative drug and CRO sectors continued their strong performance, with multiple stocks such as Ruizhi Pharmaceutical, Zhongsheng Pharmaceutical, and Chenshin Pharmaceutical hitting the daily limit. WuXi AppTec reported a revenue of 20.799 billion yuan for the first half of 2025, a year-on-year increase of 20.64%, and a net profit of 8.561 billion yuan, up 101.92%. The company raised its full-year revenue forecast to between 42.5 billion and 43.5 billion yuan, indicating strong confidence in the industry's prospects [2][8]. - The CPO and computing hardware sectors also showed strength, with stocks like Dekoli and Tianfu Communication rising over 10%. Companies such as Zhongji Xuchuang and Xin Yisheng reached new historical highs [2][3]. Investment Opportunities - The innovative drug sector remains a clear trend with significant growth potential. The valuation of this sector is still attractive, and foreign investment in Hong Kong's innovative drugs is expected to increase. The focus on performance recovery in specific sub-sectors or stocks is recommended [2][8]. - The CPO technology is projected to penetrate 30% of the market by 2027, addressing high computing transmission bottlenecks. The sector may expand into data centers and other related areas, presenting additional investment opportunities [3]. Individual Stock Highlights - The stability coin concept was active, with stocks like Hengsheng Electronics hitting the daily limit and Guotou Intelligent rising over 18%. The upcoming implementation of the "Stablecoin Regulations" in August 2025 is expected to benefit major companies like Ant Group and JD.com, which may be among the first to obtain stablecoin licenses [4][12]. - The market saw a slight increase in the number of stocks with consecutive gains, with Xizang Tourism being the only stock with more than two consecutive gains, reaching seven [6]. Future Market Analysis - The overall market is expected to continue its upward trend, supported by the computing hardware and innovative drug sectors. The trading volume has increased, indicating a healthy market rotation. Investors are advised to look for low-entry opportunities in core stocks within previously popular sectors [8].

Core Viewpoint - The article discusses the advancements in semiconductor technology, particularly in AI applications, focusing on key trends such as advanced packaging, CPO technology, and cooling solutions to address performance and efficiency challenges in AI accelerators [2][3]. Advanced Packaging Technology - Advanced packaging is evolving through Chiplet technology and hybrid bonding to enhance AI processor performance. The shift from silicon interposers to silicon bridges and organic RDL is aimed at cost reduction, with a future transition to panel-level packaging expected by 2028-2029 [4][5]. - Hybrid bonding is crucial for improving performance by reducing the bonding area through enhanced alignment precision [5]. CPO Technology - CPO (Co-Packaged Optics) is identified as the next-generation connection technology for AI data center servers, effectively reducing power consumption in high-bandwidth scenarios. However, high costs and the complexity of precise assembly remain significant challenges [6]. - The introduction of next-generation 448Gb SerDes technology may increase CPO adoption, as it addresses signal degradation issues by minimizing transmission distances [6]. Client Device Packaging - In client devices, semiconductor manufacturers are carefully selecting between Chiplet and monolithic architectures based on cost and performance considerations. For instance, AMD's latest Radeon series GPU has integrated previously Chiplet-based SRAM into a monolithic design [7]. - Apple's Vision Pro features a Chiplet package with two high-bandwidth custom DRAM chips, showcasing the trend towards specialized high-performance processors [7]. Cooling Solutions - Traditional cooling methods like air and water cooling are becoming less effective due to increasing power density in AI accelerators. Two-phase liquid cooling is emerging as a key solution due to its high energy efficiency and broad applicability [3][9]. - Different cooling technologies are suited for varying thermal densities: air cooling for below 10W/cm², two-phase liquid cooling for 10-100W/cm², and water cooling for above 100W/cm². The next-generation 3nm AI data center GPUs are expected to have thermal densities around 100W/cm², making two-phase liquid cooling particularly relevant [10][11][12].

Core Viewpoint - The article emphasizes the importance of interconnect architecture in AI infrastructure, highlighting that while GPUs are crucial, the ability to train and run large models relies heavily on effective interconnect systems [1]. Group 1: Interconnect Architecture - Interconnect architecture encompasses various levels, including chip-to-chip communication within packages and system-level networks that support thousands of accelerators [1]. - Nvidia's dominance in the industry is attributed to its expertise in developing and integrating these interconnect architectures [1]. - Broadcom has been quietly advancing various technologies related to interconnect architecture, including Ethernet architectures for large-scale expansion and internal chip interconnect technologies [1][3]. Group 2: Ethernet Switch Technology - Broadcom has introduced high-capacity switches, such as the 51.2Tbps Tomahawk 5 and the recently launched 102.4Tbps Tomahawk 6, which can significantly reduce the number of switches needed for large GPU clusters [3]. - The number of switches required decreases as the switch's port count increases, allowing for more efficient connections among GPUs [3]. - Nvidia has also announced its own 102.4Tbps Ethernet switch, indicating a competitive landscape in high-capacity switch technology [4]. Group 3: Scalable Ethernet Solutions - Broadcom's Tomahawk 6 switches are positioned as a shortcut for rack-level architectures, supporting between 8 to 72 GPUs, with future designs expected to support up to 576 GPUs by 2027 [6]. - Ethernet technology is being utilized for both scalable and large-scale networks, with Intel and AMD also planning to implement Ethernet for their systems [7]. Group 4: Co-Packaged Optics (CPO) Technology - Broadcom has invested in co-packaged optics (CPO) technology, which integrates components typically found in pluggable transceivers into the same package as the switch ASIC, significantly reducing power consumption [9][10]. - The efficiency of Broadcom's CPO technology is reported to be over 3.5 times that of traditional pluggable devices [10]. - The third generation of CPO technology is expected to support up to 512 200Gbps optical ports, with future developments aiming for 400Gbps channels by 2028 [11]. Group 5: Multi-Chip Architecture - As Moore's Law slows, the industry is shifting towards multi-chip architectures, allowing for higher yields and optimized costs by using smaller chips [14]. - Broadcom has developed a 3.5D eXtreme Dimension System in Package (3.5D XDSiP) technology to facilitate the design of multi-chip processors, which is open for licensing to other companies [15]. - The first products based on this design are expected to enter production by 2026, although the specific applications of Broadcom's technology in AI chips may remain undisclosed [15].