Group 1: Semiconductor Industry - The semiconductor industry is experiencing structural opportunities driven by AI demand and domestic substitution, characterized by capacity expansion and supply chain security [1][16]. - Global silicon wafer shipments are expected to reach 12.824 billion square inches in 2025, with a year-on-year growth of 5.4%, and this growth trend is projected to continue until 2028 [16]. - The advanced process capacity (≤7nm) is expected to grow from 850,000 wafers per month in 2024 to 1.4 million wafers per month by 2028, with a compound annual growth rate (CAGR) of 14% [16]. Group 2: AI Computing - AI capital expenditures are surging, with major cloud service providers (CSPs) increasing their investments in AI infrastructure, leading to growth opportunities in PCB, liquid cooling, optical modules, and HVDC [2][48]. - CSPs' capital expenditures are expected to continue rising, with North American companies like Microsoft, Amazon, Google, and Meta showing significant year-on-year increases in their capital spending [48][52]. - The demand for AI computing is driving the need for high-end PCB products, particularly in GPU acceleration cards, with a clear trend towards advanced technologies such as HDI and CoWoP [56]. Group 3: Storage - The storage industry is entering a "super cycle" driven by AI demand, breaking traditional storage cycle models, with prices rising and technological innovations leading the investment narrative [3]. - Despite expectations of a downturn in 2024, the market is rebounding in the first half of 2025 due to high enterprise storage demand from AI servers and strict capacity control by leading manufacturers [3]. - The transition from planar to 3D DRAM technology is becoming crucial, with the 4F² combined with CBA technology expected to increase bit density by approximately 30% [3]. Group 4: Consumer Electronics - The consumer electronics sector is witnessing a significant shift as major companies like Apple and Meta transition from technology layout to market realization, with AI innovations providing macroeconomic momentum for the industry [9]. - The global sales of AI smart glasses surged by 370% year-on-year in Q3 2025, indicating that the industry has entered a high-growth phase [9]. - The market for optical displays and storage components is expected to benefit from the increasing demand for smart glasses and other AI-driven consumer electronics [9].

Core Viewpoint - Morgan Stanley believes that the transition from CoWoS to CoWoP faces significant technical challenges, and the reliance on ABF substrates is unlikely to change in the short term [1][2][8] Group 1: Technical Challenges - The CoWoP technology requires PCB line/space (L/S) to be reduced to below 10/10 microns, which is significantly more challenging than the current standards of ABF substrates [5][6] - The current high-density interconnect (HDI) PCB has an L/S of 40/50 microns, and even the PCB used in iPhone motherboards only reaches 20/35 microns, making the transition to CoWoP technically difficult [5][6] Group 2: Supply Chain Risks - Transitioning from CoWoS to CoWoP could introduce significant yield risks and necessitate a reconfiguration of the supply chain, which is not commercially logical given the timeline for mass production [8] - TSMC's CoWoS yield rate is nearly 100%, making a switch to a new technology unnecessarily risky [8] Group 3: Potential Advantages of CoWoP - Despite the short-term challenges, CoWoP technology has potential advantages, including shorter signal paths, improved thermal performance suitable for >1000W GPUs, better power integrity, and addressing organic substrate capacity bottlenecks [10] - The goals of adopting CoWoP include solving substrate warping issues, increasing NVLink coverage on PCBs without additional substrates, achieving higher thermal efficiency without packaging lids, and eliminating bottlenecks in certain packaging materials [10]