Core Insights - The North American large CSPs are the main drivers of AI Server market demand expansion, with a forecasted 24.3% year-on-year growth in global AI Server shipments for this year, slightly revised down due to international circumstances [1][4] Group 1: North American CSPs - Microsoft is focusing on AI investments, which has somewhat suppressed the procurement of general-purpose servers, primarily utilizing NVIDIA's GPU AI solutions for AI Server deployment [1] - Meta has significantly increased its demand for general-purpose servers due to new data center openings, primarily using AMD platforms, and is actively expanding its AI Server infrastructure with self-developed ASICs expected to double in shipments by 2026 [1] - Google has benefited from sovereign cloud projects and new data centers in Southeast Asia, significantly boosting server demand, and has begun mainstream production of its TPU v6e for AI inference [2] - AWS is focusing on its self-developed Trainium v2 platform, with plans for Trainium v3 development expected to launch in 2026, anticipating a doubling of its self-developed ASIC shipments by 2025 [2] - Oracle is emphasizing the procurement of AI Servers and In-Memory Database Servers, actively integrating its core cloud database and AI applications [3] Group 2: Market Outlook - Due to international circumstances, many Server Enterprise OEMs are reassessing their market plans for the second half of 2025, with an overall forecast of approximately 5% year-on-year growth in total server shipments, including both general-purpose and AI Servers [4]

Core Viewpoint - The Internet of Things (IoT) chip market in China is experiencing significant growth, with projections indicating a market size of approximately 4.3 trillion yuan in 2024 and 5.1 trillion yuan in 2025, driven by the increasing number of IoT connected devices and advancements in technology such as 5G and AI [1][4][8]. Industry Definition and Classification - IoT chips are integrated circuits specifically designed for IoT devices, serving as core hardware components that connect physical devices to the internet. They are categorized into various types, including security chips, mobile payment chips, communication RF chips, and identity recognition chips [2][4]. Current Development Status - The number of IoT connected devices in China is expected to grow from 2.43 billion in 2019 to 15.11 billion in 2024, with the market size increasing from 1.7556 trillion yuan to 4.307 trillion yuan during the same period. By 2025, the number of devices is projected to reach approximately 17.34 billion, with a market size of about 5.0608 trillion yuan [4][6]. Industry Chain - The IoT chip industry chain consists of upstream raw materials (silicon wafers, packaging materials), midstream chip manufacturing (design, testing), and downstream applications (smart cities, smart homes, industrial IoT) [10][12]. Competitive Landscape - The competitive landscape of the IoT chip market is characterized by international giants dominating the high-end sector (e.g., Qualcomm, Intel) while domestic companies focus on the mid-to-low-end market. Key domestic players include Huawei, ZTE Microelectronics, and several others [16][19]. Industry Development Trends - The IoT chip industry is expected to see continuous advancements in performance and quality, with a significant focus on low power consumption as a key development direction. The integration of microprocessors, memory, and network interfaces in IoT chips facilitates data collection, processing, and transmission [23].

SoftBank’s acquisition of semiconductor designer Ampere is facing a potentially lengthy probe by the US government https://t.co/T6N9vlNscV ...

Group 1 - The core viewpoint highlights that while Chinese mainland wafer foundries are aggressively expanding capacity, Taiwanese manufacturers like TSMC are focusing on advanced processes and maintaining dominance in the global market by securing orders from major clients such as Apple, AMD, NVIDIA, and Qualcomm [1] - TSMC continues to lead in advanced process technology, while other Taiwanese foundries like UMC, GlobalFoundries, and Powerchip are forming alliances with international companies or enhancing niche products to avoid direct price competition with Chinese counterparts [1] - UMC is collaborating with Intel to develop 12nm technology in the U.S. and is considering entering advanced processes with a focus on 6nm technology for producing advanced WiFi, wireless RF, Bluetooth components, AI accelerators, and core processing chips for automotive applications [1] Group 2 - GlobalFoundries has been developing special process applications, focusing on silicon carbide (SiC) and gallium nitride (GaN) technologies, with plans to start mass production of 8-inch SiC wafers by the second half of 2026, targeting industrial control and consumer products initially, and later expanding into electric vehicles, AI data centers, and green energy applications [1] - Powerchip is gradually moving away from low-margin processes and seeking high-value product lines, having initiated the Wafer-on-Wafer (WoW) 3D stacking technology since 2019, particularly suitable for edge AI, automotive electronics, and high-performance computing (HPC) [2] - Motech is clearly positioning itself in the niche application market, focusing on high flexibility and customized orders, thereby strengthening its relationships with automotive and industrial control clients [2]

TrendForce：DDR4价格第四季度或将触顶回落 金十数据7月1日讯，TrendForce最新发布的存储芯片市场观察指出，DDR4价格或将在第四季度触顶回 落。TrendForce表示，DDR4近期的强劲涨势，主要来自供应商削减产出与市场抢货潮，但这波动能可 能难以延续至年底。其渠道调查显示，随着价格进入高档区间，供应商正逐步释放库存，预期第四季整 体供应将逐步改善。DDR5方面，目前价格趋势稳定，2025年第二、三季价格季增幅度预估介于3%至 8%之间。不过部分二线OEM厂商反映，因供应商预期价格持续上扬，谈判空间有限，导致议价困难。 ...

Investment Rating - The report initiates coverage of K&S (KLIC US) with a Buy rating, and BE Semiconductor (BESI NA) with a Neutral rating, while maintaining a Buy rating on ASMPT (522 HK) [3][6][11]. Core Insights - Advanced packaging (AP) is expected to evolve significantly from 2025 onwards, with a shift from CoWoS-S to CoWoS-L/R, increased adoption of SoIC driven by HBM5, and potential upgrades in InFO technology led by Apple [3][6]. - The semiconductor cycle's recovery is a key catalyst for K&S and ASMPT, given their substantial sales exposure to conventional packaging [3][6]. CoWoS Technology - CoWoS technology is transitioning from CoWoS-S to CoWoS-L, with TSMC expected to increase its CoWoS-L capacity from approximately 20% in 2024 to nearly 60% in 2025 [7][21]. - CoWoS-S is anticipated to face oversupply due to non-TSMC supply chain expansions, while CoWoS-L is expected to be in demand for high-end GPUs [7][28]. SoIC Technology - SoIC is projected to gain importance with the adoption of high-NA EUV technology, although headwinds are expected in 2025 due to limited new adopters and potential capex constraints from Intel [8][14]. - AMD is currently the major adopter of SoIC, with potential future demand driven by Apple and HBM technologies [8][14]. InFO Technology - Apple is likely to adopt upgraded InFO technology from 2026 onwards, necessitating capacity upgrades to accommodate new application processor designs [9][20]. - The transition from InFO-PoP to InFO-M is expected as the I/O count between DRAM and application processors becomes insufficient [9][20]. Company-Specific Insights - K&S is positioned to be the primary TCB supplier for TSMC's on-wafer process starting in 2025, benefiting from the shift towards CoWoS-L technology [3][6]. - ASMPT is expected to gain market share in the HBM market from a low base, with its TCB potentially adopted by TSMC and Apple in the future [3][6]. - BE Semiconductor faces challenges due to rich valuations and potentially disappointing hybrid bonding orders in 2025 [3][6].

Core Viewpoint - The research team from Tianjin University has developed a groundbreaking method for non-destructive testing of micro-LED wafers, addressing significant challenges in the production and quality assurance of next-generation display technologies [1][2]. Group 1: Technology Development - The team introduced a novel non-destructive testing method using a flexible probe system, which can adapt to the micro-scale variations of the wafer surface with a gentle pressure of only 0.9 MPa [2]. - This flexible probe system, composed of an elastic micro-pillar array and extendable electrodes, demonstrates remarkable durability, maintaining functionality after 1 million contacts, which is ten times longer than traditional rigid probes [2][3]. - The unique three-dimensional pressure-reducing structure of the probe ensures that internal stress remains safe and controllable even under extreme deformation [2]. Group 2: System Integration - An intelligent detection system was developed to complement the flexible probes, ensuring perfect alignment with the wafer and enabling real-time capture of LED activation states while measuring electrical parameters and contact pressure [2][3]. - The system includes a spherical leveling device that guarantees parallelism between the probe and the wafer, enhancing measurement accuracy [2]. Group 3: Industry Impact - The research has led to the creation of a high-density flexible probe array capable of handling ultra-small dimensions of 10×30 micrometers, paving the way for next-generation high-speed wafer testing [3]. - The technology addresses critical pain points in the LED industry and opens new pathways for complex wafer testing, with plans for industrialization to provide cost-effective testing solutions for the domestic LED sector [3]. - Additionally, this advancement lays the groundwork for improving yield rates in high-end display panels used in augmented reality (AR) and virtual reality (VR) applications [3].

Market Performance & Sentiment - The first half of the year saw an extraordinary market bounce from the April lows, with significant intra-quarter swings [1][2][3] - Sentiment change was notable, with Meta up almost 30% and JP Morgan up almost 20% [2] - The NASDAQ is on the verge of making a new relative high against the S&P, a key indicator for market players [7] - The S&P and NASDAQ made brief new highs, closing the first half near all-time highs with a VIX below 17 [8][9] Economic Factors & Risks - The first half of the year was one of the worst for the US dollar since the 1970s, with a nearly 7% move lower in the dollar index during Q2 [5] - A weaker dollar is beneficial for multinationals and the big tech trade [9] - The Fed lowered its growth target for the US for the second half of the year [10] - There is confusion regarding the Fed's next move, with scenarios for both lowering and maintaining interest rates [11][12] Sector Performance & Concerns - The reemergence of big tech companies has been a significant driver [6] - While tech may continue to drive the market higher, caution is advised due to potential shifts in the dollar or crude oil prices [9] - Energy, materials, home builders, retail, and pharma sectors are underperforming, indicating a lack of broad-based rally [9][10]

Market Overview - Wall Street is experiencing one of the strongest monthly advances in 2025, driven by optimism in global trade and reduced tariff fears, with the S&P 500 and Nasdaq Composite Index reaching all-time highs [1][2] - The S&P 500 has increased by 4.4%, the Nasdaq by nearly 6%, and the Dow Jones Industrial Average by 3.7% as the month comes to a close [2] ETF Performance - Five top-performing ETFs that contributed to the market rally in June include ARK Innovation ETF (ARKK), Valkyrie Bitcoin Miners ETF (WGMI), Global X Hydrogen ETF (HYDR), Global X Uranium ETF (URA), and Xtrackers Semiconductor Select Equity ETF (CHPS) [3] Key Drivers of Market Rally - The market's recovery is attributed to renewed investor optimism, particularly from the "Magnificent Seven" tech companies, which collectively added $4.7 trillion in market capitalization since April [4] - The Federal Reserve maintained interest rates at 4.25-4.50% on June 18, with dovish signals suggesting potential rate cuts as early as July [4] Geopolitical and Trade Factors - Geopolitical risks have diminished, particularly regarding the Israel-Iran conflict and U.S.-Canada trade tensions, which have eased following Canada’s removal of a digital-services tax [5] - However, uncertainty remains as a pause on retaliatory tariffs is set to expire in July, which could impact market sentiment if new tariffs are imposed [5] Detailed ETF Analysis - **ARK Innovation ETF (ARKK)**: Up 24.6%, focuses on companies benefiting from technological advancements, with an asset base of $6.7 billion and an average daily volume of 12 million shares [6] - **Valkyrie Bitcoin Miners ETF (WGMI)**: Up 23.3%, targets North America's Bitcoin mining industry, with $155.4 million in assets and an average daily volume of 612,000 shares [7] - **Global X Hydrogen ETF (HYDR)**: Up 19.9%, invests in the hydrogen industry, holding $31.4 million in assets and trading 17,000 shares daily [8] - **Global X Uranium ETF (URA)**: Up 19.6%, provides access to uranium mining companies, with an asset base of $3.7 billion and an average daily volume of 5 million shares [10] - **Xtrackers Semiconductor Select Equity ETF (CHPS)**: Up 18.3%, targets the semiconductor industry, with $8.1 million in assets and an average daily volume of 1,000 shares [11]

Core Viewpoint - Changjiang Storage's parent company, Changjiang Storage Technology Holding Co., Ltd. (Chang控集团), has undergone a change in its business registration, increasing its registered capital from 111.81207 billion to 113.27896 billion yuan, marking an increase of approximately 1.467 billion yuan [1]. Group 1: Shareholder Changes - New shareholders include Wuhan Smart Chip Plan No. 1 Enterprise Management Partnership (Limited Partnership) holding 0.2295% and Wuhan Smart Chip Plans No. 2 to No. 6, each holding 0.2131%, totaling 1.295% with a subscribed capital of 1.4668966 million yuan [2]. - The new shareholders are structured in a dual-layer nested format, with the second to fifth partnerships having a total of 24 underlying partnerships, all named under the "Smart Chip Plan" [2]. Group 2: Employee Stock Ownership Plan - The newly added Smart Chip Plan serves as an employee stock ownership platform primarily for senior management and technical staff of Chang控集团 [5]. - An increase of 2.127 billion yuan (1.295% of total registered capital) is planned for the employee stock ownership platform, which is currently in preparation [5]. Group 3: Company Valuation and Business Overview - Chang控集团's valuation is estimated to reach 164.25 billion yuan, with its core business encompassing the R&D and production of 3D NAND flash memory, embedded storage chips, and solid-state drives [5]. - Changjiang Storage has been recognized as a significant flash memory manufacturer in China, recently entering the Hurun Research Institute's 2025 Global Unicorn List with a valuation of 160 billion yuan [5]. Group 4: Recent Investments - On April 25, 2023, Huangyuan Zhihui Beverage Co., Ltd. announced a 1.6 billion yuan investment in Chang控集团, resulting in a 0.99% stake [6]. - Following the entry of the employee stock ownership platform, the number of shareholders in Chang控集团 has expanded to 29, diluting the holdings of existing shareholders [6].