Core Viewpoint - The report highlights that the evolution of AI computing hardware is driving structural growth opportunities in the PCB (Printed Circuit Board) industry, with significant demand for high-layer and HDI boards due to the increasing requirements of AI applications and high-performance computing [1][27]. Industry Overview - The global PCB market size is projected to grow from $62 billion in 2020 to $75 billion in 2024, with a compound annual growth rate (CAGR) of 4.9%. By 2029, the market is expected to reach $93.7 billion, with a CAGR of 4.6% from 2024 to 2029 [1][27]. - The AI and high-performance computing sectors are anticipated to see substantial growth, with the market size expected to reach $15 billion by 2029, reflecting a CAGR of 20.1% from 2024 to 2029 [1][27]. Demand Drivers - The demand for high-layer PCBs and HDI boards is rapidly increasing, driven by the need for high-frequency, low-signal loss, and high-heat dissipation performance in AI servers. The value of a single AI server PCB is significantly higher than that of traditional servers [1][27]. - The market for high-layer PCBs is projected to reach $171 billion by 2029, while the share of high-end HDI boards in the global HDI market is expected to rise from 47% in 2024 to 57% in 2029, with a market size of $9.6 billion [1][27]. Technological Advancements - AI server requirements are pushing PCB technology upgrades, necessitating the use of high-layer (14-30 layers) and low-loss materials. This includes the adoption of low roughness reverse (RTF) copper foil and very low loss materials to minimize signal distortion [1][27]. - The report emphasizes the importance of material upgrades, such as the transition from traditional fiberglass cloth to low dielectric constant Q cloth, to meet the evolving demands of high-frequency applications [1][27]. Company Strategies - Companies in the PCB sector are actively expanding their capabilities. For instance, companies like Huadian Co. are advancing high-end PCB production, while Shenghong Technology has the capacity for mass production of high-layer boards and HDI boards [1][27]. - Equipment manufacturers like Chip Microelectronics and Dazhu CNC are introducing laser equipment tailored for high-end PCB processing, while material suppliers like Honghe Technology and Feilihua are developing low-dielectric electronic fabrics and high-end copper foils [1][27].

登录新浪财经APP 搜索【信披】查看更多考评等级 证券代码：000823 证券简称：超声电子 公告编号：2025-037 债券代码：127026 债券简称：超声转债 广东汕头超声电子股份有限公司 第十届董事会第十三次会议决议公告 本公司及董事会全体成员保证信息披露内容的真实、准确、完整，没有虚假记载、误导性陈述或重大遗 漏。 广东汕头超声电子股份有限公司第十届董事会第十三次会议通知于2025年9月24日以电子邮件方式发给 董事会成员，并电话确认，会议于2025年9月29日上午以通讯表决方式召开，由董事长主持，应有9名董 事参加表决，实际参加表决董事9名，3位监事及董秘参加审议，符合《公司法》及《公司章程》的规 定，经审议通过了以下议案： 四、关于修改《公司股东大会议事规则》的议案 一、关于对控股子公司汕头超声印制板公司增资的议案（见公告编号2025-038《广东汕头超声电子股份 有限公司关于对控股子公司汕头超声印制板公司增资的公告》） 该项议案表决情况：9票同意，获得通过。 二、关于变更公司注册资本的议案 经中国证券监督管理委员会"证监许可[2020]2781号"核准，公司于2020年12月8日公开发行了70 ...

证券日报网讯超声电子（000823）9月30日在互动平台回答投资者提问时表示，目前公司具备1阶-6阶任 意层HDI量产能力；技术壁垒：高端产品对精细线路加工、层间对位、材料特性、可靠性要求极高，需 要长期的技术沉淀和经验积累；公司拥有国际先进的印制板制造设备、雄厚的技术力量、先进的管理机 制和良好的市场网络，已掌握高频高速印制线路板技术、任意层互连印制板技术、汽车微波雷达印制板 技术等核心技术，公司在行业的竞争力强；公司印制板产品广泛应用于移动互联、车载、工业控制、智 能制造等领域。 ...

证券日报网讯中富电路（300814）9月30日在互动平台回答投资者提问时表示，截至2025年9月19日，公 司股东总户数为20583户。 ...

Core Viewpoint - The stock of Si Hui Fu Shi has experienced a significant increase of 58.47% year-to-date, but has recently seen a decline of 3.66% over the past five trading days, indicating volatility in its performance [2]. Group 1: Stock Performance - As of September 30, Si Hui Fu Shi's stock price was 41.33 CNY per share, with a market capitalization of 5.919 billion CNY [1]. - The stock has seen a trading volume of 201 million CNY and a turnover rate of 3.48% [1]. - Year-to-date, the stock has risen by 58.47%, with a 10.48% increase over the past 20 days and a 24.75% increase over the past 60 days [2]. Group 2: Financial Performance - For the first half of 2025, Si Hui Fu Shi reported a revenue of 860 million CNY, representing a year-on-year growth of 31.63% [2]. - The net profit attributable to shareholders was 75.39 million CNY, which reflects a year-on-year decrease of 15.89% [2]. - The company has distributed a total of 140 million CNY in dividends since its A-share listing, with 83.80 million CNY distributed over the last three years [3]. Group 3: Shareholder Information - As of June 30, 2025, the number of shareholders increased by 11.48% to 13,800, with an average of 9,913 circulating shares per shareholder, a decrease of 10.30% [2]. - Among the top ten circulating shareholders, Ping An Advanced Manufacturing Theme Stock A holds 1.579 million shares, an increase of 188,700 shares from the previous period [3]. - Huashang Advantage Industry Mixed A is a new entrant among the top ten shareholders, holding 760,600 shares [3].

9月30日，科翔股份盘中上涨2.10%，截至13:17，报13.13元/股，成交1.84亿元，换手率4.34%，总市值 54.45亿元。 机构持仓方面，截止2025年6月30日，科翔股份十大流通股东中，大成中证360互联网+指数A （002236）位居第八大流通股东，持股163.60万股，为新进股东。 责任编辑：小浪快报 资料显示，广东科翔电子科技股份有限公司位于广东省惠州市大亚湾西区龙山八路9号，成立日期2001 年11月2日，上市日期2020年11月5日，公司主营业务涉及高密度印制电路板的研发、生产和销售业务。 主营业务收入构成为：线路板产品收入90.56%，其他9.39%，正极材料产品收入0.05%。 科翔股份所属申万行业为：电子-元件-印制电路板。所属概念板块包括：机器人概念、比亚迪概念、新 能源车、高送转、储能等。 截至6月30日，科翔股份股东户数4.99万，较上期增加96.07%；人均流通股6582股，较上期减少 49.04%。2025年1月-6月，科翔股份实现营业收入18.06亿元，同比增长16.04%；归母净利润-6203.42万 元，同比增长36.96%。 分红方面，科翔股份A股上市后累计派 ...

Core Viewpoint - Dongshan Precision's stock has experienced significant fluctuations, with a year-to-date increase of 146.82% but a recent decline of 6.01% over the past five trading days [1] Group 1: Stock Performance - As of September 30, Dongshan Precision's stock price was 71.90 CNY per share, with a market capitalization of 131.69 billion CNY [1] - The stock has seen a trading volume of 1.5 billion CNY, with a turnover rate of 1.49% [1] - The company has appeared on the "龙虎榜" (a trading board for stocks with significant trading activity) eight times this year, with the most recent appearance on September 11, where it recorded a net buy of 487 million CNY [1] Group 2: Financial Performance - For the first half of 2025, Dongshan Precision reported a revenue of 16.955 billion CNY, representing a year-on-year growth of 1.96%, and a net profit attributable to shareholders of 758 million CNY, which is a 35.21% increase year-on-year [2] - The company has distributed a total of 1.544 billion CNY in dividends since its A-share listing, with 731 million CNY distributed over the past three years [3] Group 3: Shareholder Information - As of September 19, the number of shareholders for Dongshan Precision reached 99,600, an increase of 18.14% from the previous period [2] - The largest circulating shareholder is Hong Kong Central Clearing Limited, holding 63.4631 million shares, an increase of 14.0925 million shares from the previous period [3] - New institutional investors include Morgan Emerging Markets Fund, which holds 12.4684 million shares [3]

沪电股份所属申万行业为：电子-元件-印制电路板。所属概念板块包括：5G、PCB概念、英伟达概念、 电池管理、新基建等。 截至6月30日，沪电股份股东户数12.82万，较上期减少40.16%；人均流通股14997股，较上期增加 67.18%。2025年1月-6月，沪电股份实现营业收入84.94亿元，同比增长56.59%；归母净利润16.83亿元， 同比增长47.50%。 分红方面，沪电股份A股上市后累计派现41.12亿元。近三年，累计派现22.04亿元。 机构持仓方面，截止2025年6月30日，沪电股份十大流通股东中，香港中央结算有限公司位居第三大流 通股东，持股1.23亿股，相比上期增加4719.71万股。华泰柏瑞沪深300ETF（510300）位居第四大流通 股东，持股2404.05万股，相比上期增加211.67万股。易方达沪深300ETF（510310）位居第六大流通股 东，持股1711.12万股，相比上期增加171.29万股。易方达上证50增强A（110003）位居第七大流通股 东，持股1458.78万股，为新进股东。华夏沪深300ETF（510330）位居第九大流通股东，持股1254.33万 股，相比 ...

9月30日，中京电子盘中上涨2.16%，截至09:51，报12.30元/股，成交6350.22万元，换手率0.89%，总市 值75.35亿元。 分红方面，中京电子A股上市后累计派现3.29亿元。近三年，累计派现4900.95万元。 资金流向方面，主力资金净流入110.75万元，大单买入755.71万元，占比11.90%，卖出644.97万元，占 比10.16%。 机构持仓方面，截止2025年6月30日，中京电子十大流通股东中，香港中央结算有限公司位居第六大流 通股东，持股317.27万股，相比上期增加29.41万股。大成中证360互联网+指数A（002236）退出十大流 通股东之列。 中京电子今年以来股价涨55.70%，近5个交易日跌4.06%，近20日跌1.84%，近60日跌20.80%。 责任编辑：小浪快报 今年以来中京电子已经14次登上龙虎榜，最近一次登上龙虎榜为7月10日，当日龙虎榜净买入-11.89万 元；买入总计1.87亿元 ，占总成交额比7.93%；卖出总计1.87亿元 ，占总成交额比7.94%。 资料显示，惠州中京电子科技股份有限公司位于广东省惠州市仲恺高新区陈江街道东升南路6号，成立 日期2 ...

PCB 作为电子元器件关键互联件，属于二级封装环节，承担支撑、互联功能，其技术演进正朝着高密度、高 电气性能方向快速发展。当前， AI 服务器、高速通信及汽车电子等下游需求驱动 PCB 技术从材料、工艺和架 构三大维度全面升级 ： 1) 材料端， M9/PTFE 树脂、 Rz ≤ 0.4 微米的 HVLP 铜箔及低损耗石英布等高端材料成为实现 224G 高速传输 的关键 ; 2) 工艺端， mSAP/SAP 工艺将线宽 / 线距推向 10 微米以下，激光钻孔背钻及高多层堆叠工艺支撑高密度互连 ; 3) 架构端， CoWoP 封装通过去除 ABF 基板将芯片直连 PCB ，对板面平整度、尺寸稳定性及制造良率提出极 高要求 ，正交背板方案为满足 224GSerDes 传输需采用 M9 或 PTFE 等低损耗材料，埋嵌式工艺则通过将功率 芯片嵌入板内，实现去散热器化与系统级降本，但需引入半导体级洁净室与 IC 工艺。 点击 最 下方 "在看"和" "并分享，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 正文 内容目录（8部分）： 投资要点、PCB技术演进、PCB上游（树脂、铜箔、玻纤布）、PCB市场、国内 ...