Summary of Key Points Core Viewpoint - The Hong Kong Stock Exchange (HKEX) reported that seven companies submitted applications for listing, with two companies passing the hearing and one company currently in the process of an initial public offering (IPO) without any new stocks listed during the week. Group 1: Companies Submitting Applications - **Wenzhi Traditional Chinese Medicine**: The largest AI-assisted TCM service provider in mainland China, with projected revenues of approximately 621.69 million RMB in 2022 and a loss of about 154 million RMB in the same year [2] - **Zhengpin Holdings Limited**: Engaged in the development and distribution of health and beauty supplements in Hong Kong, with revenues projected to reach approximately 110 million HKD in 2025 and a profit of about 35.5 million HKD in the same year [3] - **YunTian LiFei Technology Co., Ltd.**: A leading AI company focusing on AI inference chips, with revenues expected to be around 5.46 billion RMB in 2022 and a loss of approximately 4.47 billion RMB [4] - **Xinnengda Electronics Co., Ltd.**: A global leader in lithium battery technology, with projected revenues of about 521.62 billion RMB in 2022 and a profit of approximately 7.63 billion RMB [5] - **Danno Pharmaceutical (Suzhou) Co., Ltd.**: A biotech company focused on innovative drug development, with losses projected to be around 1.22 billion RMB in 2023 [6] - **Innovation International Industrial Group**: Engaged in the production of aluminum products, with revenues expected to reach approximately 134.90 billion RMB in 2022 and a profit of about 9.13 billion RMB [7] - **Wangshan Wangshui Biopharmaceutical Co., Ltd.**: Focused on small molecule drug development, with revenues projected to be around 200 million RMB in 2023 [8] Group 2: Companies Passing Hearings - **Shandong Tianyue Advanced Technology Co., Ltd.**: A leading manufacturer of silicon carbide substrates, with revenues projected to be approximately 4.17 billion RMB in 2022 and a loss of about 1.76 billion RMB [8] - **Guangzhou Yinnuo Pharmaceutical Group Co., Ltd.**: Focused on innovative drug development for metabolic disorders, with no recorded revenue in 2023 and a loss of approximately 733 million RMB [9] Group 3: IPO and Market Updates - **Zhonghui Biotechnology-B**: Plans to offer 33.44 million H-shares with a price range of 12.9 to 15.5 HKD per share, aiming for a total of approximately 1.02 billion HKD from cornerstone investors [10] - **HKEX New IPO Regulations**: New rules effective from August 4 aim to enhance the pricing and allocation framework for IPOs, requiring at least 40% of shares to be allocated to book-building investors [11] - **A+H Listing Trends**: Regulatory considerations are underway to increase the minimum market capitalization requirement for A-share companies seeking to list in Hong Kong from 10 billion to 20 billion RMB [12]

Core Viewpoint - Shandong Tianyue Advanced Technology Co., Ltd. is a leading player in the wide bandgap semiconductor materials industry, focusing on the research and industrialization of silicon carbide substrates, and is ranked among the top three global manufacturers in this sector with a market share of 16.7% as of 2024 [1][3]. Company Overview - Tianyue Advanced specializes in silicon carbide substrates, which are essential for the new energy and AI industries, with applications in electric vehicles, AI data centers, photovoltaic systems, and more [1][2]. - The company has established business relationships with over half of the top ten power semiconductor device manufacturers globally, leveraging its silicon carbide substrates for power and RF devices [2]. Product Development - Tianyue Advanced is one of the few companies capable of mass-producing 8-inch silicon carbide substrates and is set to launch the industry's first 12-inch silicon carbide substrate in 2024 [1][2]. - The transition to larger substrate sizes enhances production efficiency and cost-effectiveness by increasing the number of chips produced per substrate and reducing edge waste [2]. Market Dynamics - The global silicon carbide substrate market is highly competitive, characterized by rapid technological advancements and evolving customer demands, with the top five market players holding a combined market share of 68.0% as of 2024 [3]. - The power semiconductor device market is projected to reach $19.7 billion by 2030, with a compound annual growth rate of 35.8% from 2024 to 2030 [3]. Financial Performance - Tianyue Advanced reported revenues of approximately 417 million RMB, 1.251 billion RMB, 1.768 billion RMB, and 408 million RMB for the fiscal years 2022, 2023, 2024, and the three months ending March 31, 2025, respectively [3]. - The company experienced losses in the first two fiscal years, with profits of 179 million RMB and 9 million RMB in 2024 and the first quarter of 2025, respectively [3].

Core Viewpoint - Shandong Tianyue Advanced Technology Co., Ltd. is a leading player in the wide bandgap semiconductor materials industry, focusing on the research and industrialization of silicon carbide substrates, and is ranked among the top three global manufacturers in this sector with a market share of 16.7% as of 2024 [1][3]. Company Overview - The company has established itself as a significant supplier to international semiconductor firms, having formed business partnerships with over half of the top ten power semiconductor device manufacturers globally by revenue as of March 31, 2025 [2]. - Tianyue Advanced is recognized for its pioneering efforts in the industrialization of semi-insulating silicon carbide substrates and has successfully scaled production from 2-inch to 8-inch substrates, with plans to launch the first 12-inch silicon carbide substrate in 2024 [2]. Market Dynamics - The global silicon carbide substrate market is characterized by intense competition, rapid technological advancements, and evolving customer demands, with the top five market participants holding a combined market share of 68.0% as of 2024 [3]. - Silicon carbide materials are gaining traction due to their superior characteristics compared to traditional silicon materials, particularly in power semiconductor devices, with the global power semiconductor device market expected to reach $19.7 billion by 2030, growing at a compound annual growth rate of 35.8% from 2024 to 2030 [3]. Financial Performance - The company reported revenues of approximately 417 million RMB, 1.251 billion RMB, 1.768 billion RMB, and 408 million RMB for the fiscal years 2022, 2023, 2024, and the three months ending March 31, 2025, respectively [3]. - Profit figures for the same periods were approximately -176 million RMB, -46 million RMB, 179 million RMB, and 9 million RMB [3].

据港交所7月30日披露，山东天岳先进科技股份有限公司(688234.SH)通过港交所上市聆讯，中金公司（601995）和中信证券为其联席保荐人。 天岳先进的碳化硅材料为新能源与AI两大产业提供核心支撑。公司的碳化硅衬底可广泛应用于电动汽车、AI数据中心、光伏系统、AI眼镜、轨道交通、电 网、家电及先进通信基站等领域。根据弗若斯特沙利文的资料，截至2025年3月31日，公司是全球少数能够实现8英寸碳化硅衬底量产、率先实现2英寸到8英 寸碳化硅衬底的商业化的公司之一、也是率先推出12英寸碳化硅衬底的公司，并且是率先使用液相法生产P型碳化硅衬底的公司之一。 天岳先进已跻身为国际知名半导体公司的重要供货商，其产品亦在国际上获得广泛认可。截至2025年3月31日，公司已与全球前十大功率半导体器件制造商 (按2024年的收入计)中一半以上的制造商建立业务合作关系。公司的客户主要利用公司的碳化硅衬底制造功率器件及射频器件，该等器件最终应用于电动汽 车、AI数据中心及光伏系统等领域的终端产品。 招股书提到，天岳先进是第一批在国内实现了半绝缘型碳化硅衬底的产业化的公司，并进一步实现导电型碳化硅衬底的产业化。目前天岳先进量产碳化 ...

智通财经APP获悉，据港交所7月30日披露，山东天岳先进科技股份有限公司(688234.SH)通过港交所上市聆讯，中金公司和中信证券为其联席保荐人。 招股书显示，天岳先进深耕宽禁带半导体材料行业，专业技术实力雄厚，自成立以来即专注于碳化硅衬底的研发与产业化。根据弗若斯特沙利文的资料，按 2024年碳化硅衬底的销售收入计，公司是全球排名前三的碳化硅衬底制造商，市场份额为16.7%。 天岳先进的碳化硅材料为新能源与AI两大产业提供核心支撑。公司的碳化硅衬底可广泛应用于电动汽车、AI数据中心、光伏系统、AI眼镜、轨道交通、电 网、家电及先进通信基站等领域。根据弗若斯特沙利文的资料，截至2025年3月31日，公司是全球少数能够实现8英寸碳化硅衬底量产、率先实现2英寸到8英 寸碳化硅衬底的商业化的公司之一、也是率先推出12英寸碳化硅衬底的公司，并且是率先使用液相法生产P型碳化硅衬底的公司之一。 天岳先进已跻身为国际知名半导体公司的重要供货商，其产品亦在国际上获得广泛认可。截至2025年3月31日，公司已与全球前十大功率半导体器件制造商 (按2024年的收入计)中一半以上的制造商建立业务合作关系。公司的客户主要利用公司的 ...

Core Viewpoint - Tianyue Advanced (688234) reported a revenue of 410 million yuan for Q1 2025, maintaining its industry-leading position despite a slight decline in net profit due to increased R&D expenses and decreased product prices [1] Group 1: Company Performance - The company achieved a revenue of 410 million yuan, showing a slight year-on-year decline in revenue while steadily increasing market share [1] - R&D expenses increased by 101.67% year-on-year to 44.94 million yuan, focusing on product matrix improvement, emerging application markets, and optimization of product quality and costs [2] - The product shipment volume continued to grow, indicating robust operational strategies centered on high-quality products [2] Group 2: Industry Trends - The demand for third-generation semiconductor materials, particularly silicon carbide (SiC), is driven by the rapid development of renewable energy and AI technologies, making SiC a key material for high-power semiconductor devices [1] - SiC is becoming essential in applications such as electric vehicle (EV) inverters, onboard chargers, and DC/DC converters, especially with the adoption of 800V high-voltage platforms in EVs [2] - The company is expanding into new application areas, including AR glasses, leveraging the high refractive index of SiC to enhance visual performance and reduce lens thickness [2] Group 3: Technological Advancements - Tianyue Advanced launched 12-inch conductive substrates at Semicon Europe in November 2024 and showcased a full range of SiC substrates at Semicon China in March 2025, marking the entry into the "12-inch era" for the SiC industry [3] - The company has achieved breakthroughs across the entire technology chain, including crystal growth, defect control, processing detection, and component self-manufacturing [3] - Future R&D investments will focus on large-size products and new application fields, providing strong momentum for performance growth [3]

近日，山东天岳先进科技股份有限公司（下称"天岳先进"，股票代码"688234"）申请港交所上市，中金公司和中信证券为其联 席保荐人。 IPO日报注意到，这家山东济南首富创立的公司科创板上市后出现业绩"变脸"、股价破发、股东减持等情况，此次港股上市能顺 利吗？ 上市三年，股价破发 天岳先进成立于2010年11月，是全球宽禁带半导体材料行业领军企业。公司专注于高质量碳化硅衬底的研发与产业化，为新能 源与AI产业提供核心支撑，业务涉及电动汽车、AI数据中心、AI眼镜等领域。 招股书显示，根据弗若斯特沙利文的资料，按2023年碳化硅衬底的销售收入计，天岳先进是全球排名前三的碳化硅衬底制造 商。截至2024年9月30日，天岳先进已与全球前十大功率半导体器件制造商（按2023年收入计）中一半以上的制造商建立业务合 作关系，其生产的碳化硅衬底经客户制成功率器件及射频器件，最终应用于电动汽车、AI数据中心及光伏系统等多领域的终端 产品中。 碳化硅单晶衬底材料是一种宽禁带半导体材料，和传统材料相比具有更加优异的物理性能，可以有效提升下游器件的功率密度 和整体性能，在电力电子以及微波电子领域有着广泛的应用前景。但优越的物理性能背 ...