Core Viewpoint - Tianyue Advanced successfully listed on the Hong Kong Stock Exchange, raising its market capitalization to approximately HKD 22.8 billion (around RMB 21 billion) with a strong demand for its shares during the IPO process [2][3] Group 1: IPO Details - Tianyue Advanced's H-share was issued at HKD 42.80 per share, opening at HKD 45.60, reflecting a 6.54% increase [2] - The Hong Kong public offering accounted for 35% of the total shares, with a subscription rate of 2809.19 times, while the international offering made up 65% with a subscription rate of 9.04 times [2] - The company attracted cornerstone investors including Guoneng Environmental Investment Group, Future Asset Securities, and others [2] Group 2: Company Positioning and Market - Tianyue Advanced is a leading player in the wide bandgap semiconductor materials sector, focusing on the research and industrialization of silicon carbide (SiC) substrates [3][6] - According to Frost & Sullivan, the company ranks among the top three global manufacturers of SiC substrates, holding a market share of 16.7% as of 2024 [3][7] - The company's SiC substrates are essential for industries such as electric vehicles and AI, with applications in power devices and RF devices [4][6] Group 3: Production Capabilities - Tianyue Advanced has achieved mass production of 8-inch SiC substrates and is set to launch the industry's first 12-inch SiC substrate in 2024 [6] - The company is one of the first to industrialize semi-insulating and conductive SiC substrates, enhancing production efficiency and cost-effectiveness [6][7] Group 4: Financial Performance - The company reported revenues of approximately RMB 417 million, RMB 1.251 billion, RMB 1.768 billion, and RMB 408 million for the fiscal years 2022, 2023, 2024, and the three months ending March 31, 2025, respectively [7] - Profit figures for the same periods were approximately -RMB 176 million, -RMB 46 million, RMB 179 million, and RMB 9 million [7] Group 5: Future Plans - The company plans to allocate approximately 70% of the net proceeds from the IPO to expand its production capacity for 8-inch and larger SiC substrates, 20% for enhancing R&D capabilities, and 10% for working capital and general corporate purposes [8]

Core Viewpoint - Shandong Tianyue Advanced Technology Co., Ltd. successfully listed on the Hong Kong Stock Exchange, marking a significant milestone for the semiconductor materials sector in Hong Kong [1][3]. Group 1: Company Overview - Tianyue Advanced is a leading player in the global silicon carbide materials industry, being one of the few participants capable of mass-producing 8-inch silicon carbide substrates [3][6]. - The company was established in November 2010 and has focused on the research and industrialization of silicon carbide substrates since its inception [6]. - Tianyue Advanced has achieved the industrialization of semi-insulating silicon carbide substrates and is advancing towards the production of conductive silicon carbide substrates [6]. Group 2: Market Highlights - The IPO raised HKD 20.44 billion, making it the first silicon carbide materials stock in the Hong Kong market [1][3]. - It is the first A to H project in the semiconductor materials sector in Hong Kong in 2023, with a subscription rate exceeding 2,800 times, the highest for an A to H project this year [3][5]. - The company plans to launch the industry's first 12-inch silicon carbide substrate in November 2024 [3][6]. Group 3: Role of CITIC Securities - CITIC Securities acted as the joint sponsor and coordinator for Tianyue Advanced's IPO, showcasing its commitment to supporting the development of China's semiconductor industry [1][4]. - The firm utilized its strong research capabilities and understanding of industry regulations to ensure the efficient progress of the project [4][5]. - CITIC Securities organized multiple high-quality investor meetings, successfully attracting a diverse range of high-quality investors, contributing to the successful completion of the IPO [5].

Group 1 - Tianyue Advanced (02631) has officially listed, with a share price set at HKD 42.8, issuing 47.7457 million shares, resulting in a net proceeds of approximately HKD 1.9381 billion [1] - As of the report, the stock price has increased by 6.54%, currently trading at HKD 45.6 [1] - The company specializes in the wide bandgap semiconductor materials industry, focusing on the research and industrialization of silicon carbide substrates since its establishment [1] Group 2 - According to Frost & Sullivan, Tianyue Advanced's silicon carbide materials provide core support for the new energy and AI industries [1] - The company's silicon carbide substrates have extensive applications in electric vehicles, AI data centers, photovoltaic systems, AI glasses, rail transit, power grids, home appliances, and advanced communication base stations [1]

天岳先进深耕宽禁带半导体材料行业，专业技术实力雄厚，自成立以来即专注于碳化硅衬底的研发与产 业化。根据弗若斯特沙利文的资料，按2024年碳化硅衬底的销售收入计，天岳先进是全球排名前三的碳 化硅衬底制造商。 格隆汇8月20日｜天岳先进(2631.HK)首日在港挂牌上市高开6.54%，报45.6港元。 天岳先进昨晚在港交所公告，公司全球发售47,745,700股H股，最终发售价每股H股42.80港元，所得款 项净额19.38亿港元。香港公开发售股份数目占全球发售股份数目35.00%，获认购2809.19倍；国际发售 股份数目占全球发售股份65.00%，获认购9.04倍。 天岳先进专注于碳化硅材料行业已超过14年，是第一批在国内实现了半绝缘型碳化硅衬底的产业化的公 司，并进一步实现导电型碳化硅衬底的产业化。天岳先进依托研发、生产和管理经验，在产品大尺寸化 上的优势不断提高，目前天岳先进量产碳化硅衬底的尺寸已从2英寸迭代升级至8英寸，并于2024年推出 业内首款12英寸碳化硅衬底。 | 02631 天岳先进 | | ol | | --- | --- | --- | | 45.600 + +2.800 +6.54% | ...

天岳先进的碳化硅材料为新能源与AI两大产业提供核心支撑。公司的碳化硅衬底可广泛应用于电动汽 车、AI数据中心、光伏系统、AI眼镜、轨道交通、电网、家电及先进通信基站等领域。根据弗若斯特 沙利文的资料，截至2025年3月31日，公司是全球少数能够实现8英寸碳化硅衬底量产、率先实现2英寸 到8英寸碳化硅衬底的商业化的公司之一、也是率先推出12英寸碳化硅衬底的公司，并且是率先使用液 相法生产P型碳化硅衬底的公司之一。 公开资料显示，天岳先进深耕宽禁带半导体材料行业，专业技术实力雄厚，自成立以来即专注于碳化硅 衬底的研发与产业化。根据弗若斯特沙利文的资料，按2024年碳化硅衬底的销售收入计，集团是全球排 名前三的碳化硅衬底制造商，市场份额为16.7%。 天岳先进(02631)首挂上市，公告显示，每股定价42.8港元，共发行4774.57万股股份，每手100股，所得 款项净额约19.381亿港元。截至发稿，涨6.54%，报45.6港元，成交额4.56亿港元。 ...

Group 1 - Tianyue Advanced (02631.HK) has launched its H-share IPO, with the offering period from August 11 to August 14, and is expected to list on the Hong Kong Stock Exchange on August 19 [1] - The company plans to issue 47.7457 million H-shares globally, with 95% allocated for international offering and 5% for public offering, and an overallotment option of 15% [1] - The expected price per share is HKD 42.80, with a total fundraising target of approximately HKD 2.044 billion, and a net amount of about HKD 1.938 billion after expenses [1] Group 2 - The company has attracted a strong lineup of cornerstone investors for its IPO, raising a total of approximately HKD 740.2 million from five investors, including Jinan Energy Group and Future Asset Securities [2] - Tianyue Advanced specializes in wide-bandgap semiconductor materials, focusing on the research and industrialization of silicon carbide substrates, ranking among the top three global manufacturers with a market share of 16.7% [2] - The company's silicon carbide materials support key industries such as renewable energy and AI, with applications in electric vehicles, AI data centers, photovoltaic systems, and advanced communication bases [2] Group 3 - The company is recognized for its technological innovation, strong production capacity, and effective management, leading advancements in the silicon carbide industry [3] - It is one of the few companies capable of mass-producing 8-inch silicon carbide substrates and has pioneered the commercialization of substrates from 2 inches to 8 inches, as well as the introduction of 12-inch substrates [3] - The company has established strategic partnerships, including collaboration with OmniLight for the industrialization of silicon carbide optical waveguide lenses [2][3]

公司在宽禁带半导体材料行业拥有雄厚技术实力，专注于碳化硅衬底的研发与产业化。根据弗若斯特沙 利文的数据，天岳先进是全球排名前三的碳化硅衬底制造商，2024年市场份额为16.7%。公司已与国能 环保、未来资产证券等基石投资者签订协议，认购总金额7.40亿港元。 公司预计全球发售所得款项净额约19.38亿港元，将主要用于扩张8英寸及更大尺寸碳化硅衬底产能 (70%)、加强研发能力(20%)以及营运资金和一般企业用途(10%)。 天岳先进将于2025年8月11日至14日进行招股，计划全球发售4774.57万股H股。发售价上限为每股42.80 港元，预计于8月19日在联交所上市。 ...

Group 1 - The company plans to globally offer 47.7457 million H-shares, with 2.3873 million shares available in Hong Kong and 45.3584 million shares for international offering, along with an over-allotment option of approximately 15% [1] - The expected pricing date for the shares is August 15, 2025, with a maximum offer price of HKD 42.80 per share, and trading on the Hong Kong Stock Exchange is anticipated to commence on August 19, 2025 [1] - The company is a leading player in the wide-bandgap semiconductor materials industry, focusing on the research and industrialization of silicon carbide substrates, holding a market share of 16.7% as one of the top three manufacturers globally by sales revenue in 2024 [1][2] Group 2 - The company's silicon carbide materials support key industries such as renewable energy and AI, with applications in electric vehicles, AI data centers, photovoltaic systems, and more [2] - The company is recognized for its technological innovation and strong production capabilities, being one of the few able to mass-produce 8-inch silicon carbide substrates and the first to commercialize 2-inch to 8-inch substrates [2] - The company has established business relationships with over half of the top ten power semiconductor device manufacturers globally, utilizing its silicon carbide substrates for power and RF devices [2] Group 3 - The company has entered cornerstone investment agreements, with cornerstone investors agreeing to subscribe for shares totaling HKD 740.2 million, including notable firms such as Guoneng Environmental Investment Group and Hearta Intelligent Control [3] - Assuming a share price of HKD 42.80, the company estimates a net amount of approximately HKD 1.9381 billion from the global offering after deducting underwriting commissions and other expenses [3] - The net proceeds from the offering are planned to be allocated as follows: approximately 70% for expanding production capacity for 8-inch and larger silicon carbide substrates, 20% for enhancing R&D capabilities, and 10% for working capital and general corporate purposes [3]

Core Viewpoint - Tianyue Advanced (02631) is set to launch an IPO from August 11 to August 14, 2025, aiming to issue 47.75 million H-shares, with a maximum offer price of HKD 42.80 per share, and is positioned as a leading player in the silicon carbide substrate manufacturing industry [1][2]. Group 1: Company Overview - The company specializes in the semiconductor materials industry, particularly in the research and industrialization of silicon carbide substrates, and ranks among the top three global manufacturers with a market share of 16.7% based on sales revenue in 2024 [1]. - The company has shown strong revenue growth, with revenue increasing from RMB 417 million in 2022 to RMB 1.251 billion in 2023, representing a 199.9% increase, and further rising by 41.4% to RMB 1.768 billion in 2024 [2]. Group 2: Financial Performance - The company reported losses of RMB 176 million in 2022 and RMB 45.7 million in 2023, but turned a profit of RMB 179 million in 2024, with profits of RMB 46.1 million and RMB 8.5 million for the three months ending March 31 in 2024 and 2025, respectively [2]. - The estimated net proceeds from the global offering, assuming the maximum offer price, are approximately HKD 1.938 billion, which will be allocated primarily for capacity expansion, R&D enhancement, and general corporate purposes [3]. Group 3: Use of Proceeds - Approximately 70% (HKD 1.357 billion) of the net proceeds is expected to be used for expanding the company's capacity for 8-inch and larger silicon carbide substrates [3]. - About 20% (HKD 388 million) is planned for strengthening R&D capabilities to maintain innovation leadership, while 10% (HKD 194 million) will support working capital and other general corporate needs [3].

Summary of Key Points Core Viewpoint - The Hong Kong Stock Exchange (HKEX) reported that seven companies submitted applications for listing, with two companies passing the hearing and one company currently in the process of an initial public offering (IPO) without any new stocks listed during the week. Group 1: Companies Submitting Applications - **Wenzhi Traditional Chinese Medicine**: The largest AI-assisted TCM service provider in mainland China, with projected revenues of approximately 621.69 million RMB in 2022 and a loss of about 154 million RMB in the same year [2] - **Zhengpin Holdings Limited**: Engaged in the development and distribution of health and beauty supplements in Hong Kong, with revenues projected to reach approximately 110 million HKD in 2025 and a profit of about 35.5 million HKD in the same year [3] - **YunTian LiFei Technology Co., Ltd.**: A leading AI company focusing on AI inference chips, with revenues expected to be around 5.46 billion RMB in 2022 and a loss of approximately 4.47 billion RMB [4] - **Xinnengda Electronics Co., Ltd.**: A global leader in lithium battery technology, with projected revenues of about 521.62 billion RMB in 2022 and a profit of approximately 7.63 billion RMB [5] - **Danno Pharmaceutical (Suzhou) Co., Ltd.**: A biotech company focused on innovative drug development, with losses projected to be around 1.22 billion RMB in 2023 [6] - **Innovation International Industrial Group**: Engaged in the production of aluminum products, with revenues expected to reach approximately 134.90 billion RMB in 2022 and a profit of about 9.13 billion RMB [7] - **Wangshan Wangshui Biopharmaceutical Co., Ltd.**: Focused on small molecule drug development, with revenues projected to be around 200 million RMB in 2023 [8] Group 2: Companies Passing Hearings - **Shandong Tianyue Advanced Technology Co., Ltd.**: A leading manufacturer of silicon carbide substrates, with revenues projected to be approximately 4.17 billion RMB in 2022 and a loss of about 1.76 billion RMB [8] - **Guangzhou Yinnuo Pharmaceutical Group Co., Ltd.**: Focused on innovative drug development for metabolic disorders, with no recorded revenue in 2023 and a loss of approximately 733 million RMB [9] Group 3: IPO and Market Updates - **Zhonghui Biotechnology-B**: Plans to offer 33.44 million H-shares with a price range of 12.9 to 15.5 HKD per share, aiming for a total of approximately 1.02 billion HKD from cornerstone investors [10] - **HKEX New IPO Regulations**: New rules effective from August 4 aim to enhance the pricing and allocation framework for IPOs, requiring at least 40% of shares to be allocated to book-building investors [11] - **A+H Listing Trends**: Regulatory considerations are underway to increase the minimum market capitalization requirement for A-share companies seeking to list in Hong Kong from 10 billion to 20 billion RMB [12]