Group 1 - The Ministry of Foreign Affairs of China emphasizes the importance of international law in response to Israel and the US's actions against Iran's nuclear facilities, indicating a willingness to support peace initiatives [1] - The National Committee of the Chinese People's Political Consultative Conference discusses deepening economic reforms to promote modernization [2] - The People's Bank of China and six other departments issue guidelines to enhance financial support for consumption, including a 500 billion yuan loan for service consumption and pension [3] - The Ministry of Commerce announces a campaign to promote electric vehicle consumption in rural areas from July to December 2025 [4] - Guangdong province releases a plan to stimulate domestic circulation by promoting trade-in programs for various consumer goods [5] Group 2 - Youyan New Materials announces plans to introduce strategic investors with a total investment of 300 million yuan [6] - Youngor announces the sale of financial assets, totaling 4.175 billion yuan [7] - Changchuan Technology plans to raise up to 3.132 billion yuan for semiconductor equipment research and development [8] - Tailin Microelectronics expects a 267% year-on-year increase in net profit for the first half of the year [9] - Huatai Securities is approved to issue up to 10 billion yuan in technology innovation bonds [11] Group 3 - The Federal Reserve Chairman Powell indicates potential for early interest rate cuts if the labor market weakens and inflation decreases [16] - US stock markets show significant gains, with the Nasdaq rising 1.43% and the Dow Jones reaching its highest closing since March [17] - International crude oil futures experience substantial declines, with WTI and Brent crude oil futures dropping over 6% [18] - Goldman Sachs maintains an overweight recommendation for A-shares and Hong Kong stocks, projecting a target of 4600 points for the CSI 300 index [19]

在半导体制造这个"纳米级微观手术"中，干式真空泵扮演着至关重要的角色。干式真空泵能快速、干净地把芯 片加工腔室里的空气和各种气体"抽走"，为芯片制造提供工艺所必需的洁净真空环境，完成薄膜沉积、刻蚀、 离子注入、光刻等超微加工。 在新三板挂牌的中科仪，依托高真空、超高真空和超洁净真空技术优势，攻克了一系列产业共性、关键技术难 题，致力于研制开发先进的干式真空泵、真空仪器设备，产品均达到国际同类产品先进水平，填补了国内同类 产品空白。 中科仪干式真空泵已 实现集成电路产业核心部件国产化多项零的突破。 潜望系列深度报道丨 股事会专栏 丨 投资小红书 丨 e公司调查 丨 时报会客厅 丨 十大明星私募访谈 丨 科创板第五套标准重启！禾元生物IPO即将上会 丨 又有公司进入退市整理期！ 丨 促消费！央 行、证监会等联合印发！ 丨 大涨！牛市旗手，再现百亿成交！ 丨 刚刚，突破！中国资产，全线爆 发！ 丨 伊朗和以色列宣布正式停火 丨 亚太市场，普涨！A股，拉升！以伊停火最新进展→ 丨 昨 夜，油价暴跌！伊朗官员证实：接受停火方案 丨 重磅！特朗普：以色列和伊朗已同意全面停火 丨 美联储重磅！ 版权声明 证券时报各平台所有 ...

近日，证券时报、辽宁日报"从资本市场看地方高质量发展"大型融媒报道采访团走进辽宁沈阳，进行深度调研。 浑河之畔，铁西区的老厂房曾托起新中国工业的脊梁，齿轮与轴承的轰鸣声里，"东方鲁尔"的钢铁血脉流淌了半个世纪。而今，沈阳这座镌刻着"共和国长子"荣光 的城市，正以精密半导体设备的嗡鸣续写新的传奇。 在京津冀与长三角的半导体版图之外，以沈阳为代表的辽宁工业重镇用二十年时间破茧成蝶，将老工业基地的厚重积淀熔铸成中国半导体设备国产替代的东北力 量。截至2025年5月底，辽宁省上市公司数量共84家，高新技术企业占比过半，以拓荆科技、芯源微、富创精密等为代表的半导体设备企业交出了一份崭新的资本 市场"辽宁答卷"。 从薄膜沉积设备、涂胶显影设备到半导体设备精密零部件，辽宁企业在一个又一个领域打破海外垄断，托起国产半导体设备的脊梁。近日，证券时报、辽宁日报"从 资本市场看地方高质量发展"大型融媒报道采访团走进辽宁沈阳，进行深度调研。 02027年我国青会资源 根据污一 计划增长5%至10% 从钢铁圆鸣到"芯片森林" 山海关不住 投资逐浪高 守望货本市场 推动社会进步 分享自:证券时报客户端 查看电子报详情 中国人民抗日战争暨 ...

和研科技已形成划片机、无膜划切设备、研磨机、切割治具等多个产品线。 责编：李丹 校对：冉燕青 版权声明 证券时报各平台所有原创内容，未经书面授权，任何单位及个人不得转载。我社保留追 究相关 行 为主体 法律责任的权利。 封装是半导体产业链下游的核心工序，而半导体切磨抛设备是封装领域不可缺少的重要一环。切磨抛环节处在 后道封装的开端位置，主要作用是将前道制作完成的晶圆背面进行减薄，再翻转后分割成个体芯片。 和研科技总经理余胡平表示："切磨抛环节风险高，并且是被加工物价值最高的工序，一旦出现问题损失很 大，客户对切磨抛设备加工的良品率要求极高，哪怕0.1%的良品率差距，都会影响到客户对设备品牌的最终 选择。" 在半导体切磨抛设备上，日本企业凭借长时间的技术积累，与下游国际巨头长期以来深度配合，在多个应用场 景下找到合适的工艺路线，取得了先发优势，并形成了规模效应。以和研科技为代表的中国企业，正将日本企 业的技术和市场"包围圈"撕开一道裂口。 对于半导体切磨抛设备，超精密加工是所有应用的基础。余胡平表示，和研科技自2011年成立以来，攻克了高 稳定性机芯结构设计及加工装配、微米级切割位置精度控制、微米级切割深度精度 ...

高新技术产业是透视地方营商环境的绝佳窗口，因为技术的发展离不开资本的助力，越是"高新"，就越需要资 本的投入和金融的加持。在辽宁半导体设备企业集体突围、形成全国"第三极"的背后，是辽宁这十多年上下一 心攻山头、打硬仗，让"投资正过山海关"成为了常态。 2024年，辽宁招商引资到位资金同比增长14.1%，超额完成了全年目标。2025年前4个月，辽宁全省招商引资 到位资金达4186.8亿元，同比增长17.4%，实际使用外资197.7亿元，同比激增151.3%，增速远超全国平均水 平，投资热度和吸引力逐浪走高。 "投资正过山海关"的背后，是政府部门服务意识的转变。让笔者记忆犹新的，是辽宁省地方金融管理局副局长 战巍的"忙碌"。在接受采访前几天，他刚去了一趟深圳。在一天半的时间里，既搞"创投辽宁"发展大会的路 演，又开展企业上市和科创债券培训，还拜访多家创投机构，几乎连轴转。政府官员"走出去"，是为了把资金 和资源"引进来"，助力辽宁本土企业发展。 辽宁政府部门的贴身服务让很多企业感觉很贴心。如沈阳市委金融办一年就要举行20多场资本市场专题培训， 定期组织重点产业投融资路演，对上市公司更有"联席会议制度"实现快速响应 ...

Core Viewpoint - ChipSource Micro has become the only domestic company capable of providing mass-produced mid-to-high-end coating and developing equipment in China [1][2]. Group 1: Industry Context - The photolithography process is crucial in integrated circuit manufacturing, accounting for 50% of production time and 30% of costs. The domestic replacement rate for photolithography machines is less than 3%, while the coating and developing equipment, which is highly monopolized by Japanese companies, has a replacement rate of less than 10% [2][4]. - Coating and developing machines, along with photolithography machines and photoresists, are considered the three essential elements of the photolithography process [2]. Group 2: Company Development - ChipSource Micro was founded in 2002 when the domestic semiconductor market was undeveloped, lacking products, supply chains, and customers. The company has grown from 4-inch and 6-inch wafers to 8-inch and 12-inch, expanding from LED to advanced packaging and front-end fields [2]. - The company successfully went public on the Shanghai Stock Exchange's Sci-Tech Innovation Board in 2019, becoming the first stock from Liaoning Province on this board, and has since become a leader in the domestic coating and developing equipment sector [2]. Group 3: Market Position and Growth Potential - The low domestic replacement rate indicates significant growth potential. ChipSource Micro's front-end equipment covers all process nodes above 28nm, accounting for over 90% of China's mature semiconductor processes. The company has achieved international advanced levels in front-end physical cleaning equipment, becoming the market leader domestically [4]. - In the advanced packaging sector, ChipSource Micro has over 50% market share as a key supplier of mass production equipment, while also expanding into emerging fields like 2.5D and 3D packaging [4]. Group 4: R&D and Innovation - ChipSource Micro has maintained R&D expenses at over 10% of its revenue for several years, with R&D investment reaching 297 million yuan in 2024, a nearly 50% increase year-on-year [4]. - The company emphasizes the complexity of coating and developing equipment, which consists of over 150 units and requires high precision and reliability to avoid affecting the performance of photolithography machines [5].

Core Viewpoint - The emergence of Tuojing Technology marks a significant step towards domestic production in the high-end semiconductor manufacturing sector, particularly in the film deposition equipment market, which has been dominated by international giants [2]. Group 1: Market Overview - The film deposition equipment sector accounts for over 20% of the wafer manufacturing equipment market, with Tuojing Technology capturing approximately 12% of the market share, translating to a revenue of 4.1 billion yuan in a market projected to reach 9.7 billion USD in 2024 [2]. - Tuojing Technology focuses on PECVD, ALD, and Gap Fill technologies, supporting over 100 types of medium film materials required for logic and memory chips [2]. Group 2: Technological Advancements - Chinese companies, represented by Tuojing Technology, are rapidly catching up in terms of process coverage and production equipment performance, achieving levels comparable to international counterparts [3]. - Tuojing Technology has undertaken 11 national major projects and has filed 1,640 patents, with 507 granted, showcasing its commitment to innovation and technology breakthroughs in the semiconductor film deposition field [3]. Group 3: Future Prospects - The company is preparing for future product generations, with 70% of its products being new or advanced process technologies, indicating a strong focus on innovation [4]. - The demand for semiconductor equipment in the three-dimensional integration field is expected to drive Tuojing Technology's growth, with existing orders for wafer-to-wafer hybrid bonding equipment and successful industrial applications of developed detection equipment [3].

Core Viewpoint - The semiconductor packaging process is critical, with semiconductor cutting, grinding, and polishing equipment being an essential part of this field. The cutting and grinding stage is at the beginning of the packaging process, primarily responsible for thinning the back of completed wafers and then flipping and separating them into individual chips [1]. Group 1: Industry Insights - The cutting and grinding stage is high-risk and involves processing the most valuable materials, where even a 0.1% difference in yield can significantly impact customer brand choice [1]. - Japanese companies have established a first-mover advantage in semiconductor cutting and grinding equipment due to long-term technical accumulation and deep cooperation with international giants, creating a scale effect [1]. - Chinese companies, represented by He Yan Technology, are beginning to break through the technological and market "encirclement" established by Japanese firms [1]. Group 2: Company Developments - He Yan Technology focuses on high stability and consistency in mass production equipment, with the entire company participating in quality improvement, which is crucial for the application of cutting and grinding equipment [2]. - The company has transitioned from being a single equipment supplier to a process solution provider, forming a complete product portfolio that surpasses overseas competitors [2]. - He Yan Technology has developed multiple product lines, including dicing machines, film-less cutting equipment, grinders, and cutting fixtures, with the dicing machine gaining widespread recognition and leading market share among domestic suppliers [2].

在半导体工艺整机装备中，最核心的零部件就是真空机械手及集束型设备，它们作为晶圆传输设备，被 广泛应用于晶圆制造与封装测试等全工艺流程产业链中。 得益于技术追赶，新松机器人吸引了国家集成电路产业投资基金、北方华创（002371）、中微半导体、 拓荆科技、华海清科等战略投资者。绑定战略合作客户，促成了新松半导体与战略客户从业务到资本的 深度合作，形成产业链协同发展效应。以此为契机，新松半导体系列产品的国产化替代和市场推广也得 以加速。 程龙提到，尽管新松半导体自主研制真空机械手及集束型设备已达到国际同等水平，部分指标还优于国 外设备，但是在一致性和可靠性方面还有进一步提升的空间。在市场方面，半导体行业研发投入大、试 错成本高、验证周期长、国内客户对国产供应链的信心不足等客观问题仍在阻碍国内企业进一步开拓市 场。 展望未来，程龙对新松半导体超越海外公司，拿下国内市场份额第一充满自信。他说："我们希望在 2027年到2028年，在中国能拿到第一，我们整个团队的目标非常清晰，现在就是一路狂奔。" 新松半导体总经理程龙表示，真空机械手系列产品的自主可控将进一步缓解半导体整机装备的"卡脖 子"问题。据了解，新松半导体是创业 ...

Core Viewpoint - The article highlights the transformation of Shenyang, a city in Liaoning Province, from a traditional industrial base to a burgeoning hub for semiconductor equipment manufacturing, showcasing significant advancements in domestic production capabilities and a supportive ecosystem for innovation and investment [1][2][3]. Group 1: Industry Development - Shenyang has evolved from a steel manufacturing center to a key player in the semiconductor equipment industry, with five major companies listed in the capital market since 2019 [2][3]. - The semiconductor equipment industry in Liaoning is characterized by a "6+N" development system, with six leading companies supported by numerous ancillary firms [2][3]. - Companies like拓荆科技, 芯源微, and 富创精密 have achieved international standards in their respective technologies, contributing to the domestic semiconductor equipment landscape [3][4]. Group 2: Research and Education - Liaoning boasts a robust educational foundation with 114 higher education institutions, including 63 undergraduate colleges, which supports the semiconductor industry's growth [4][5]. - The province's scientific research institutions, particularly those affiliated with the Chinese Academy of Sciences, have played a crucial role in nurturing leading semiconductor companies [4][5]. Group 3: Financial Support and Policy - The development of the semiconductor industry in Liaoning has been significantly bolstered by national policies and financial support, including the establishment of the National Integrated Circuit Industry Investment Fund [6][7]. - The launch of the Sci-Tech Innovation Board has provided essential funding and resources for semiconductor companies, facilitating their growth and expansion [7][8]. - The local government has adopted a proactive approach to improve the business environment, offering tailored support to companies in the semiconductor sector [10][11]. Group 4: Future Prospects - The article emphasizes the need for continued investment in the semiconductor ecosystem, including enhancing local venture capital capabilities and filling gaps in the industrial chain [12][13]. - The goal is to position Shenyang as a globally competitive center for integrated circuit equipment, thereby elevating its status in the national and international markets [14].