Group 1 - The company expects its gross margin to remain between 42% and 48% in 2026 [2] - The company's R&D expenditure is projected to account for 14% to 19% of its revenue [2]

Core Viewpoint - Shengmei Shanghai reported that its overall performance remained stable in the third quarter of last year, despite a decrease in ACRM's gross margin due to differing accounting standards between China and the United States [1] Group 1: Financial Performance - The gross margin of ACRM has decreased, primarily influenced by the differences in accounting standards between China and the United States [1] Group 2: Strategic Initiatives - The company will continue to promote technological iteration and product innovation to address client process challenges [1] - Shengmei Shanghai aims to strengthen its differentiated competitive barriers, which will help maintain a stable and positive trend in gross margin [1]

Core Viewpoint - The company is focusing on launching advanced panel-level packaging equipment, including three new products aimed at enhancing manufacturing efficiency and reducing contamination risks in the semiconductor industry [1] Product Innovations - The UltraECPap-p panel-level electroplating equipment utilizes a patented horizontal electroplating method that synchronizes the square electric field with the panel, improving electroplating uniformity and reducing chemical cross-contamination risks between different metal plating baths [1] - The UltraCvac-p panel-level negative pressure cleaning equipment employs negative pressure technology to remove flux residues from chip structures, significantly enhancing cleaning efficiency by allowing cleaning solutions to reach narrow gaps; this equipment is already in mass production at client sites [1] - The UltraCbev-p panel-level edge etching equipment is designed specifically for edge etching and copper residue removal, playing a crucial role in fan-out panel-level packaging technology [1] Market Strategy - The company aims to actively promote the application and expansion of these three product types in the Taiwan market, while also focusing on the development trends in the panel-level equipment market [1] - The company expresses confidence in opening up the wafer-level packaging equipment market in Taiwan this year [1]

证券日报网讯 1月29日，微导纳米在互动平台回答投资者提问时表示，在ALD设备中，水蒸气与臭氧均 可作为氧源。公司出厂的设备能够为客户提供多种配置选择，实际运行中客户会根据成本、稳定性、工 艺控制等因素决定具体采用的工艺路线。 ...

Core Viewpoint - The company anticipates that by 2025, revenue from advanced packaging (excluding electroplating) equipment will account for nearly 10% of total revenue, while electroplating equipment will exceed 20% of total revenue, indicating a strong growth potential in the advanced packaging market [1] Group 1 - The advanced packaging equipment market has significant growth prospects, with an overall positive industry development trend [1] - The company sees substantial growth potential in the Chinese market for advanced packaging equipment [1] - Advanced packaging equipment is expected to become a key business segment for revenue growth in 2026 [1]

证券日报网1月29日讯，连城数控在接受调研者提问时表示，公司深耕光伏及半导体领域多年，不仅与 国内市场的重要客户保持着良好的战略合作关系，也与海外的潜在客户及合作伙伴进行着广泛的沟通交 流。公司通过持续关注新技术与新应用场景的发展动态，深入洞察市场需求，主动开展系统化、前瞻性 的技术积累与创新研究，积极把握国内外市场潜在的应用需求与合作机遇。公司实际业务开展情况以公 开披露的信息为准。 ...

Core Viewpoint - The company emphasizes the importance of expanding into overseas markets and adheres to a development strategy focused on "technological differentiation, product platformization, and global customer base" [1] Group 1: Market Expansion Strategy - The product matrix includes cleaning equipment, electroplating equipment, advanced packaging wet process equipment, vertical furnace tube series equipment, coating and developing equipment, PECVD equipment, and panel-level equipment, all possessing global independent intellectual property rights [1] - The company has gained attention and recognition from several international clients for its self-developed differentiated core equipment, with products already entering the Singapore market this year and four units sold to the U.S. market last year [1] Group 2: Future Outlook - The company is actively pursuing expansion into overseas markets such as Taiwan and South Korea, with an expectation that the pace of overseas market development will accelerate in 2026 compared to 2025 [1] - The ongoing global customer strategy aims to increase overseas market sales share and support overall revenue growth while contributing to the development of the global semiconductor industry [1]

Core Viewpoint - The company anticipates that its platform products, including vertical furnace tubes, Track, and PECVD equipment, will contribute significantly to overall revenue starting in 2026, marking them as key growth drivers for the future [1] Group 1: Product Development and Market Launch - The company plans to launch its first self-developed high-output (300WPH) KrF process front-end coating and developing (Track) equipment, UltraLITHKrF, in Q3 2025, which has already been successfully delivered to a leading logic wafer factory in China [1] - The UltraLITHKrF product features high capacity, advanced temperature control technology, and real-time process control and monitoring capabilities, expanding the applications related to photolithography [1] Group 2: PECVD Equipment and R&D Investment - The company expresses strong confidence in the differentiated technological framework and future market prospects of PECVD equipment, with plans to increase R&D investment to expand its market presence domestically and internationally [1] - Continuous technological advancements are being made in LPCVD and ALD furnace series equipment, achieving innovative breakthroughs [1] Group 3: Innovations in Vertical Furnace and ALD Equipment - The company's self-developed UltraFn vertical furnace equipment features a unique vertical structure design with a processing capability of up to 1250°C, focusing on high-end IGBT applications, receiving positive market feedback [1] - Future product goals include achieving a processing capability of 1350°C, which is expected to be a significant benefit for IGBT applications [1] - The company has been strengthening its R&D investment in ALD equipment, accumulating a series of self-developed patented technologies with global intellectual property protection, aiming for further contributions in uniformity and material aspects [1]

证券日报网1月29日讯，盛美上海在接受调研者提问时表示，公司从2017年就开始进行相关布局，在海 外已设有韩国研发与生产基地，可实现多元化海外供货，更好满足客户的多样化需求。未来，公司将在 海外市场持续推进本地化布局，降低关税等外部因素冲击，提升盈利能力。 ...

Core Viewpoint - The company anticipates a balanced growth between storage and logic customers, with a strong performance in both segments, aiming for comprehensive coverage of cleaning equipment and processes by 2026 [1] Group 1: Customer Segmentation - The overall proportion of storage customers is slightly higher than that of logic customers, with minimal differences between the two [1] - Some customers have procurement shares exceeding 50% for the company's products [1] Group 2: Future Goals - By 2026, the company aims to achieve full coverage of cleaning equipment types and processes [1] - The company is actively promoting the expansion of mature processes while continuously enhancing market share in advanced processes [1]