Group 1: PCB Business Overview - The company's PCB business focuses on communication equipment, particularly in data centers and automotive electronics, with a slight recovery in wireless communication orders compared to Q4 2024 [1] - The demand for wired communication orders remains strong, with a higher proportion than wireless communication [1] - The data center sector continues to see growth in orders, driven by the demand for AI acceleration cards and servers [1] Group 2: Packaging Substrate Business - The packaging substrate products cover a wide range, including module packaging substrates and storage packaging substrates, primarily used in mobile smart terminals and servers [2] - There has been a noticeable improvement in demand for packaging substrates in Q1 2025 compared to Q4 2024, mainly due to increased demand for storage products [2] Group 3: Production Capacity and Utilization - The overall production capacity utilization remains high, particularly in the PCB business due to sustained demand in computing power and automotive electronics [3] - The packaging substrate business has also seen an increase in capacity utilization due to improved demand in the storage sector compared to Q4 2024 [3] Group 4: FC-BGA Packaging Substrate Technology - The company has achieved batch production capability for FC-BGA packaging substrates with 20 layers or fewer, while R&D for products with more than 20 layers is progressing on schedule [4] - The Guangzhou packaging substrate project is in the early stages of ramping up production, with a reduction in losses in Q1 2025 compared to previous quarters [4] Group 5: Expansion Plans - The company has PCB factories in Shenzhen, Wuxi, Nantong, and a factory under construction in Thailand, focusing on technological upgrades to enhance capacity [5] - The Nantong Phase IV project is underway to establish an HDI technology platform and capacity [5] Group 6: Thailand Factory Investment - The total investment for the Thailand factory is 1.274 billion RMB, with construction progressing on schedule [6] - The factory will have capabilities for high-layer and HDI PCB technologies, aiding in the expansion of overseas markets [6] Group 7: Raw Material Price Changes - Key raw materials include copper-clad laminates and gold salts, with prices increasing year-on-year and compared to Q4 2024 due to commodity price fluctuations [7][8] - The company is monitoring international commodity prices and maintaining communication with suppliers and customers [8]

Group 1: Business Overview - The company focuses on PCB business applications primarily in communication equipment, with a significant emphasis on data centers and automotive electronics [1] - In Q1 2025, the wireless communication orders slightly rebounded compared to Q4 2024, while the demand for wired communication remains strong [1] - The data center orders continued to grow, driven by the demand for AI accelerator cards and servers [1] Group 2: Packaging Substrate Business - The company offers a wide range of packaging substrate products, including module packaging substrates and storage packaging substrates, mainly used in mobile smart terminals and servers [2] - In Q1 2025, the demand for packaging substrates improved compared to Q4 2024, primarily due to increased demand for storage products [2] Group 3: Production Capacity and Utilization - The overall production capacity utilization remains high, with PCB business benefiting from sustained demand in computing and automotive electronics [3] - The packaging substrate business has seen an increase in capacity utilization due to improved demand in the storage sector compared to Q4 2024 [3] Group 4: U.S. Sales and Tariff Impact - Direct sales to the U.S. accounted for a low percentage of total revenue, indicating minimal impact from U.S. tariff policies [4] - The company is closely monitoring the evolving international trade environment and maintaining communication with industry stakeholders [4] Group 5: FC-BGA Packaging Substrate Development - The company has achieved mass production capability for FC-BGA packaging substrates with up to 20 layers, while R&D for products with more than 20 layers is progressing on schedule [5] - The Guangzhou packaging substrate project is in the early stages of ramping up production, with a reduction in losses observed in Q1 2025 compared to previous quarters [5] Group 6: Expansion Plans - The company has factories in Shenzhen, Wuxi, Nantong, and a project under construction in Thailand, focusing on upgrading existing facilities to enhance capacity [6] - The total investment in the Thailand factory is approximately 1.274 billion RMB, aimed at expanding overseas market reach and improving global supply capabilities [7][8] Group 7: Raw Material Price Trends - In Q1 2025, prices for certain raw materials, such as gold salt, increased compared to both Q1 2024 and Q4 2024, influenced by commodity price fluctuations [8] - The company is actively monitoring raw material price changes and maintaining communication with suppliers and customers [8] Group 8: AI and PCB Business - The demand for high-performance PCBs is increasing due to the rapid evolution of AI technology and the need for high-speed networks [8] - The company's PCB business has benefited from trends in high-speed communication networks and data center applications since 2024 [8]

Group 1 - The company held its 2024 annual and Q1 2025 performance briefing on May 9, 2025, via an online interactive format [2] - Key executives, including the chairman and financial director, participated in the briefing to address investor inquiries [2] Group 2 - The company reported a revenue of 1,293,004,000.87 yuan for 2024, a year-on-year increase of 19.45%, and a net profit of 141,498,579.04 yuan, up 6.45% from the previous year [4] - For Q1 2025, the company achieved a revenue of 338,048,302.63 yuan, representing a 23.17% increase year-on-year, with a net profit of 36,618,662.83 yuan, up 17.25% [5] Group 3 - The company plans to invest 135 million yuan in a project to upgrade "high-density interconnect substrate" production technology, with trial production expected in Q1 2026 [5] - The company aims to enhance its competitiveness in traditional sectors while expanding into emerging fields such as electric vehicles and AI computing centers [3][4]

Group 1: Financial Performance - In 2024, the company's operating revenue increased by 11.75% year-on-year, primarily driven by growth in the HDI segment and the introduction of global renowned terminal customers [1] - The net profit attributable to shareholders for 2024 was -87,433,652.40 CNY, indicating a reduction in losses compared to previous periods [2] - The company achieved profitability in Q4 2024 and Q1 2025, marking two consecutive quarters of profit [3] Group 2: Product Development and Market Position - The main products, including high-layer PCB, mid-to-high-end HDI, and flexible circuits (FPC), showed stable growth in 2024 [1] - The company is actively developing new technologies and products in AI, high-speed storage, high-frequency communication, smart driving, low-altitude flying vehicles, and robotics [1] - The company has enhanced its product structure by focusing on high-layer boards and high-end HDI boards, with an increasing proportion of products with 8 layers or more [7] Group 3: Capacity and Operational Efficiency - The new factory in Zhuhai is gradually increasing its capacity utilization, with expectations for steady growth in output [2] - The company is implementing strategies to optimize asset structure and cost control, which have improved operational quality and profitability [3] - The company plans to enhance manufacturing and operational efficiency, focusing on high-end products and emerging markets [8] Group 4: Strategic Initiatives and Market Expansion - The company is seeking advantageous mergers and acquisitions to enhance product structure, technology, and expand the value chain [2] - The company has established offices or subsidiaries in Taiwan, Hong Kong, Singapore, and Thailand to expand overseas marketing channels [4] - The company anticipates that the global PCB market will exceed $100 billion by 2027, driven by smart upgrades and emerging applications [6] Group 5: Research and Development - R&D expenses are increasing, focusing on new energy vehicles, smart driving, AI, and high-frequency communication [5] - The company is recognized as a high-tech enterprise and has established provincial and national-level research centers, indicating strong R&D capabilities [5] - The demand for PCBs is expected to grow significantly due to the increasing requirements for computing power and AI applications [6]

Group 1: Financial Performance - In Q1 2025, the company achieved revenue of 4.91 billion RMB, a year-on-year increase of 20.75% [1] - The net profit attributable to shareholders was 0.47 billion RMB, up 29.47% year-on-year [1] - The net profit excluding non-recurring gains and losses was 0.48 billion RMB, reflecting a growth of 44.64% [1] Group 2: PCB Business Development - The PCB business focuses on communication equipment, particularly in data centers and automotive electronics, with a slight recovery in wireless orders and continued growth in wired demand [2] - Orders in the data center sector continued to grow, driven by demand for AI accelerator cards and servers [2] - The automotive electronics sector is experiencing stable growth, particularly in new energy and ADAS directions [2] Group 3: Packaging Substrate Business - The company offers a wide range of packaging substrate products, including module packaging substrates and storage packaging substrates, primarily used in mobile smart terminals and servers [3] - Demand for packaging substrates improved in Q1 2025, mainly due to increased demand for storage products [3] Group 4: Production Capacity and Utilization - The overall production capacity utilization remains high, particularly in the PCB business due to sustained demand in computing power and automotive electronics [4] - The packaging substrate business has seen an increase in capacity utilization compared to Q4 2024 due to improved demand in the storage sector [4] Group 5: Impact of U.S. Sales and Tariff Policies - Direct sales to the U.S. accounted for a low proportion of total revenue, indicating limited impact from U.S. tariff policies [5] - The company is closely monitoring the evolving international trade environment and maintaining communication with industry stakeholders [5] Group 6: HDI Process Capability - The company possesses HDI process capabilities, applicable in communication, data centers, industrial control, medical, and automotive electronics sectors [6] Group 7: FC-BGA Packaging Substrate Development - The company has achieved batch production capability for FC-BGA packaging substrates with up to 20 layers, with ongoing development for products exceeding 20 layers [7] - The Guangzhou packaging substrate project is in the early stages of ramping up production, with some cost impacts on profits [7] Group 8: Expansion Plans - The PCB business is expanding with factories in Shenzhen, Wuxi, Nantong, and a project in Thailand, focusing on technology upgrades and capacity enhancement [8] - The Nantong Phase IV project is under construction to establish an HDI technology platform [8] Group 9: Thailand Factory Investment - The total investment for the Thailand factory is 1.274 billion RMB, aimed at enhancing overseas market reach and meeting international customer demands [9] Group 10: Raw Material Price Changes - Key raw materials have seen price increases in Q1 2025 due to commodity price fluctuations, impacting costs [10] - The company is actively monitoring raw material prices and maintaining communication with suppliers and customers [10]

Core Points - The company has approved the use of up to RMB 300 million of idle raised funds for cash management, with specific allocations for "Jing 20 Convertible Bonds" and "Jing 23 Convertible Bonds" [1][16] - The purpose of this cash management is to enhance the efficiency of fund usage while ensuring the safety of the raised funds and not affecting the implementation of investment projects [1][14] - The funds for this investment are entirely sourced from temporarily idle raised funds [2] Summary by Sections 1. Overview of the Financial Management - The company and its subsidiary, Zhuhai Jingwang, will use up to RMB 30 million of idle raised funds for cash management, with a maximum of RMB 5 million from "Jing 20 Convertible Bonds" and RMB 25 million from "Jing 23 Convertible Bonds" [1][16] - The usage period is valid for 12 months from the date of board approval, allowing for rolling use of funds within the specified limits [1][16] 2. Source of Funds - The funds for the financial management are entirely from temporarily idle raised funds [2] 3. Basic Information on Raised Funds - The company issued "Jing 20 Convertible Bonds" on August 24, 2020, raising a total of RMB 178 million, with a net amount of RMB 176.02 million after expenses [2] - The company also issued "Jing 23 Convertible Bonds" on April 4, 2023, raising a total of RMB 115.4 million, with a net amount of RMB 113.96 million after expenses [3] 4. Details of the Financial Products - The company has subscribed to structured deposit products from Bank of China, with a total investment of RMB 160 million [5] - The structured deposits have varying terms of 35 days and 37 days, with expected annualized returns ranging from 0.84% to 2.08% depending on market conditions [8][12] 5. Risk Control Measures - The company adheres to prudent investment principles, selecting reputable and capable institutions for investment products [6] - An internal audit department will oversee the use and custody of funds, ensuring compliance and timely reporting to the board [6][7] 6. Impact on Investment Projects - The cash management of idle raised funds will not affect the normal operation of investment projects or the use of raised funds, ensuring compliance with regulations [14][17] 7. Trustee Information - Bank of China, a publicly listed company, serves as the trustee for the structured deposits, with no related party relationships with the company [15]

Group 1 - The convertible bond of Fushi closed at 124.097 yuan per share, with a trading volume of 32.6581 million yuan and a conversion premium of 30.7% [1] - The credit rating of Fushi's convertible bond is "AA-", with a maturity of 6 years and a coupon rate that increases from 0.30% in the first year to 2.00% in the sixth year [1] - The conversion price for the bond is set at 29.68 yuan, with the conversion period starting on February 19, 2024 [1] Group 2 - Si Hui Fushi Electronic Technology Co., Ltd. is a private national high-tech enterprise focused on high-quality PCB manufacturing, serving industries such as industrial control, automotive, transportation, communication, and medical [2] - The company was listed on the Shenzhen Stock Exchange's Growth Enterprise Market on July 13, 2020, with the stock code 300852 [2] - For the first quarter of 2025, Si Hui Fushi reported a revenue of 406.2 million yuan, a year-on-year increase of 26.23%, while the net profit attributable to shareholders decreased by 38.08% to 28.6926 million yuan [2] - As of March 2025, the concentration of shareholding is high, with the top ten shareholders holding a combined 68.51% and the top ten circulating shareholders holding 67.23% [2]

Core Viewpoint - The company Shengyi Electronics (688183.SH) has experienced significant growth in its operating performance due to the increasing demand for multilayer printed circuit boards, with substantial year-on-year increases in revenue and net profit reported for the first quarter of 2025 [1][2]. Financial Performance - In Q1 2025, Shengyi Electronics achieved revenue of 1.579 billion yuan, a year-on-year increase of 78.55%, and a net profit of 200 million yuan, up 656.87% [1]. - For the full year 2024, the company reported revenue of 4.687 billion yuan, a 43.19% increase, and a net profit of 332 million yuan, recovering from a loss of 24.99 million yuan in the same period of 2023 [1]. - The net profit has shown exponential growth over the quarters in 2024, with figures of 26.45 million, 69.64 million, 90.43 million, and 145 million yuan for Q1 to Q4 respectively, reflecting year-on-year increases of 759.89%, 412.84%, 432.26%, and 2079.78% [1]. Business Strategy and R&D - Shengyi Electronics has been optimizing its product structure and enhancing its business layout in response to the growing market demand for high-layer, high-precision, high-density, and high-reliability multilayer printed circuit boards [2]. - The company has consistently invested in R&D, with expenditures of 196 million, 193 million, and 284 million yuan from 2022 to 2024, totaling 673 million yuan over three years, and Q1 2025 R&D expenses were 91.13 million yuan, an increase of 87.08% year-on-year [2]. - As of the end of 2024, the company holds 276 invention patents and has participated in the formulation of 20 industry standards and specifications [2]. Market Performance - As of April 28, the stock price of Shengyi Electronics was 25.62 yuan per share, with an overall increase of 158.78% over the past 12 months [3]. - The company has been generous in cash dividends, having distributed a total of 745 million yuan since its listing in 2021, which accounts for approximately 68.7% of the total net profit since then [3].

登录新浪财经APP 搜索【信披】查看更多考评等级 证券代码：300964 证券简称：本川智能 公告编号：2025-012 一、重要提示 本年度报告摘要来自年度报告全文，为全面了解本公司的经营成果、财务状况及未来发展规划，投资者 应当到证监会指定媒体仔细阅读年度报告全文。 所有董事均已出席了审议本报告的董事会会议。 致同会计师事务所（特殊普通合伙）对本年度公司财务报告的审计意见为：标准的无保留意见。 本报告期会计师事务所变更情况：公司本年度会计师事务所未发生变更，为致同会计师事务所（特殊普 通合伙）。 非标准审计意见提示 □适用 √不适用 公司上市时未盈利且目前未实现盈利 □适用 √不适用 董事会审议的报告期利润分配预案或公积金转增股本预案 √适用 □不适用 公司经本次董事会审议通过的利润分配预案为：以截至本次会议召开日公司总股本77,298,284股剔除公 司回购专用证券账户中已回购股份970,000股后的股本76,328,284股为基数，向全体股东每10股派发现金 红利1元（含税），送红股0股（含税），以资本公积金向全体股东每10股转增0股。 董事会决议通过的本报告期优先股利润分配预案 （二）主要产品及其用 ...

Core Viewpoint - The company Xunjiéxing (688655.SH) is planning to acquire 100% equity of Shenzhen Jiazhihong Electronics Co., Ltd. through a combination of issuing shares and cash payment, while also raising supporting funds [1][2]. Group 1: Transaction Details - The transaction is expected to constitute a major asset restructuring but will not involve a restructuring listing or related party transactions [2]. - The share issuance price for the asset purchase is set at 15.28 yuan per share, which is not less than 80% of the average trading price over the previous 20 trading days [2]. - The company plans to issue shares to no more than 35 specific investors to raise supporting funds, with the total amount not exceeding 100% of the asset purchase price and the number of shares issued not exceeding 30% of the total share capital prior to the issuance [2][3]. Group 2: Financial Information of Jiazhihong - As of December 31, 2024, Jiazhihong's total assets are 53,124.35 million yuan, with total liabilities of 34,469.57 million yuan and owner's equity of 18,654.78 million yuan [5]. - The company's operating revenue for 2024 is projected to be 49,111.86 million yuan, with a net profit of 1,986.64 million yuan [5]. Group 3: Company Ownership Structure - As of the signing date of the proposal, the controlling shareholder of Xunjiéxing, Ma Zhuo, directly holds 38.66% of the shares and indirectly controls an additional 2.74%, totaling 41.40% [3]. - Wu Wenyiyi, the controlling shareholder of Jiazhihong, directly holds 48.1485% of the equity, and together with Cheng Xiaocheng, they control 64.2728% of Jiazhihong [3].