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下一代电子布,要被英伟达们抢爆了
3 6 Ke· 2026-02-04 12:10
Group 1 - Nittobo plans to launch next-generation T-type glass fiber cloth for AI chips by 2028, reducing the thermal expansion coefficient from 2.8 ppm to 2.0 ppm, a decrease of approximately 30% [1] - T-type glass fiber cloth is widely used in integrated circuit substrates and advanced packaging substrates, enhancing dimensional stability and supporting large-scale AI packaging [1] - Nittobo holds about 90% market share in the global T-type glass fiber cloth market and is currently evaluating and improving the new glass cloth based on copper-clad laminate samples [1] Group 2 - The demand for glass fiber cloth is driving price increases, with the price of 7628 electronic cloth rising from 4.15 yuan/meter at the end of September 2025 to 4.75 yuan/meter currently, with multiple price hikes occurring [2] - Upstream materials like electronic yarn are also expected to see price increases due to stable supply and structural adjustments, leading to a tight supply of traditional electronic yarn and strong support for high-end products [2] - Companies like International Composites and Honghe Technology are expected to report significant profit increases due to rising glass fiber product prices, with International Composites projecting a net profit of up to 350 million yuan in 2025 [2] Group 3 - AI servers require higher performance in signal transmission rates and data loss, driving the demand for low dielectric constant electronic cloth, which is a core material for high-frequency and high-speed copper-clad laminates [3] - The supply of low thermal expansion coefficient electronic cloth is expected to remain tight in 2026, with potential for further price increases [3] - The shortage of high-end electronic cloth is anticipated to accelerate the domestic substitution process in the industry, presenting a golden development period for domestic electronic cloth manufacturers [3]
电子布龙头谋划新品 英伟达、谷歌或竞相争购 国内产业链已现“涨价潮”
Xin Lang Cai Jing· 2026-02-04 09:04
Group 1 - Nittobo plans to launch a next-generation T-type glass fiber cloth for AI chips by 2028, reducing the thermal expansion coefficient from 2.8 ppm to 2.0 ppm, which is a 30% decrease [1] - T-type glass fiber cloth is widely used in integrated circuit substrates and advanced packaging substrates, enhancing dimensional stability and supporting large-scale AI packaging [1] - Nittobo holds approximately 90% market share in the global T-type glass fiber cloth market and is currently evaluating and improving the new glass cloth based on copper-clad laminate samples [1] Group 2 - The demand for glass fiber cloth is driving price increases, with the price of 7628 electronic cloth rising from 4.15 yuan/meter to 4.75 yuan/meter since September 2025 [2] - Upstream materials like electronic yarn are also expected to see price increases due to supply constraints and structural adjustments, supporting price growth [2] - Companies like International Composites and Honghe Technology are projected to see significant profit increases due to rising glass fiber product prices [2] Group 3 - AI servers require lower dielectric constants and loss factors, driving the upgrade of copper-clad laminates towards high-frequency and high-speed applications, leading to increased demand for low dielectric constant electronic cloth [3] - The supply of low thermal expansion coefficient electronic cloth is expected to remain tight in 2026, with potential for further price increases [3] - The shortage of high-end electronic cloth is anticipated to accelerate the domestic substitution process, presenting growth opportunities for local electronic cloth manufacturers [3]