Group 1 - Japan Display Inc (JDI) announced a postponement of its investment in Taiwan's PanelSemi due to increased geopolitical risks in the semiconductor sector and a rapidly changing global economic environment [2] - JDI's consolidated revenue for the fiscal year 2024 is projected to decline by 21.4% to 188.01 billion yen, with an operating loss of 37.07 billion yen [3] - The company has reported a net loss of 78.22 billion yen for the fiscal year 2024, marking its 11th consecutive year of losses [3] Group 2 - JDI's Mobara factory, which produces LCD/OLED panels, is set to cease operations by March 2026, with plans to convert the site into an AI data center [4] - The company plans to reduce its workforce by approximately 1,500 employees in Japan, which represents nearly 60% of its domestic staff, as part of its restructuring efforts [4] - JDI aims to achieve profitability in its core business by fiscal year 2026 through measures such as layoffs and consolidating production at its Ishikawa factory [5] Group 3 - JDI plans to spin off its automotive display business into a subsidiary named "AutoTech" by October 1, 2025, to facilitate external funding and partnerships [5] - Scott Callon, JDI's Chairman and CEO, has resigned due to poor performance, with Jun Akama taking over as the new CEO [5]

Core Viewpoint - The global semiconductor materials market is projected to grow by 3.8% in 2024, reaching $67.5 billion, driven by the recovery of the overall semiconductor market and increasing demand for advanced materials in high-performance computing and high-bandwidth memory manufacturing [2] Semiconductor Materials Market Summary - In 2024, wafer manufacturing materials revenue is expected to grow by 3.3% to $42.9 billion, while packaging materials revenue is projected to increase by 4.7% to $24.6 billion [2] - The chemical mechanical planarization (CMP), photoresist, and photoresist auxiliary equipment segments are experiencing strong double-digit growth due to the complexity and number of processes required for advanced DRAM, 3D NAND flash, and cutting-edge logic ICs [2] - All semiconductor material segments, except silicon and silicon-on-insulator (SOI), are expected to show year-on-year growth [2] - Demand for silicon remains weak due to ongoing inventory digestion, leading to a projected 7.1% decline in silicon revenue in 2024 [2] Regional Market Insights - Taiwan continues to be the largest semiconductor materials consumer region with revenue of $20.1 billion for 15 consecutive years [3] - Mainland China is expected to achieve $13.5 billion in revenue, maintaining year-on-year growth and ranking second in 2024 [3] - South Korea ranks third with $10.5 billion in revenue, while all regions except Japan are expected to achieve single-digit growth in 2024 [3] Advanced Semiconductor Packaging Market Forecast - The advanced semiconductor packaging market is valued at $18.09 billion in 2024 and is expected to reach $29.8 billion by 2031, with a compound annual growth rate (CAGR) of 7.5% [5] - The shift in value creation from front-end miniaturization to back-end integration is anticipated to drive strong double-digit growth in the advanced semiconductor packaging market by 2030 [5] - Demand for heterogeneous chip architecture, high-bandwidth memory stacks, ultra-thin fan-out modules, and automotive-grade power packaging is continuously increasing [5] Packaging Technology Developments - Flip-chip packaging technology is replacing long wire bonding, providing improved thermal performance and enabling higher power ranges without compromising performance [6] - Fan-out wafer-level packaging (FO WLP) offers ultra-thin packaging suitable for space-constrained devices, enhancing economic viability for mid-range smartphones and IoT sensors [7] - Advanced packaging technologies are being adopted in automotive applications to meet stringent AEC Q100 standards, driven by the need for high reliability and durability [7] Market Drivers and Trends - The transition from monolithic scaling to heterogeneous integration is driving demand for advanced packaging, integrating logic, memory, analog, and photonic chips into single system-in-package solutions [8] - The proliferation of 5G base stations and edge AI gateways relies on advanced packaging methods to meet thermal and signal integrity requirements [8] - The demand for AI accelerators and high-performance computing is pushing OSAT manufacturers to develop larger organic substrates and advanced filling materials, leading to higher average selling prices and long-term capacity investments [9] Consumer Electronics and Wearable Devices - The growing demand for smartphones, AR glasses, and health monitoring wearables is prompting OEMs to shift towards WLP, FO PLP, and molded embedded packaging [10] - The reduction in the number of discrete components per circuit board is freeing up battery space and enhancing waterproof performance, while also shortening design cycles [10]

QYResearch的观点和数据因被众多国内外知名企业、证券公司及媒体频繁引用与转载，而享有高度的 品牌知名度。其权威认证确保了所提供的行业分析及定制报告的可信度与专业度，是业界信赖的优选。 0 1 恒州博智的LED照明报告被深圳民爆光电公司中的年报引用 民爆光电（301362）2024年度管理层讨论与分析 据恒州博智发布的《2023年中国LED照明行业全景图谱》显示，2023年，全球LED防爆照明市场销售额达到 了49亿元，并预测在2028年将达到79亿元，期间的复合年增长率（CAGR）约为7.8%。这一增长可归因于 LED防爆灯在石油和采矿、军事基地、机场以及其他商业和工业领域的广泛应用，这些领域对于安全照明有着 极高的要求。 来源：证券之星 更多：https://stock.stockstar.com/RB2025040100020605.shtml 最新报告推荐：2025年全球及中国极端温度LED照明企业出海开展业务规划及策略研究报告 0 2 深圳思创策划咨询有限公司引用了恒州博智出版的外墙翻新服务市场分析报告 深圳建筑外立面改造项目可行性研究报告——市场分析 根据 QYR（恒州博智）的统计及预测，2 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 semiconductor-digest ，谢谢。 SEMI今日在其材料市场数据订阅（MMDS）中报告称，2024年全球半导体材料市场收入将增长 3.8%，达到675亿美元。整体半导体市场的复苏，以及高性能计算和高带宽存储器制造对先进材料 需求的不断增长，支撑了2024年材料收入的增长。 2024年，晶圆制造材料收入增长3.3%，达到429亿美元；封装材料收入增长4.7%，达到246亿美 元。化学机械平坦化(CMP)、光刻胶及光刻胶辅助设备细分市场实现了强劲的两位数增长，这得益 于先进DRAM、3D NAND闪存和前沿逻辑集成电路(IC)所需的工艺复杂性和工序数量的增加。除 硅和绝缘体上硅(SOI)外，所有半导体材料细分市场均实现了同比增长。由于行业持续消化过剩库 存，2024年对硅的需求（尤其是在后缘细分市场）依然疲软，导致2024年硅收入下降7.1%。 台湾地区以201亿美元的营收连续15年成为全球最大的半导体材料消费地区。中国大陆地区以135 亿美元的营收继续实现同比增长，将在2024年位居第二；韩国则以105亿美元的营收位居第三。除 日本外 ...