Core Insights - The article discusses the anticipated commercialization of advanced semiconductor packaging technologies, driven by the explosive growth in artificial intelligence (AI) and high-performance computing (HPC) demands, expected to begin next year [1][2]. Group 1: Advanced Packaging Technologies - The TechInsights report highlights five key technologies that will lead the future market: Co-Packaged Optics (CPO), next-generation HBM4, glass substrates, Panel Level Packaging (PLP), and advanced thermal management solutions [1][2]. - CPO technology integrates optical transceiver modules directly into or near the chip, significantly improving energy efficiency compared to traditional pluggable optical modules. Major companies like TSMC, NVIDIA, and Broadcom are preparing for CPO commercialization, with 2026 expected to be a pivotal year for this technology [1][2]. Group 2: HBM4 and Glass Substrates - HBM4 is recognized as one of the most advanced 3D packaging technologies, maximizing high bandwidth memory performance while facing challenges in stacking yield. The industry is compelled to develop new packaging processes and material systems due to increasing thermal management and production efficiency issues [2]. - The shift from traditional silicon substrates to glass substrates is accelerating, as glass substrates offer higher stability and better wiring performance, becoming the ideal choice for high-end packaging [2]. Group 3: Panel Level Packaging and Thermal Management - PLP is gaining attention for its significant production efficiency and cost advantages, prompting global companies to increase investments in this area. This trend is expected to drive equipment investment, supply chain restructuring, and intensified competition in technology standardization [2]. - Advanced thermal management technologies, including liquid cooling, high-performance thermal interface materials (TIM), and backside power delivery, are being rapidly introduced in data centers and are expected to expand into mobile and consumer electronics [2].

Core Insights - The rapid development of artificial intelligence (AI) technology has led to a reshuffling of global semiconductor technology rankings, with South Korea's semiconductor technology being surpassed by China [1][2]. Group 1: Semiconductor Technology Rankings - According to a report by the Korea Institute of Science and Technology Evaluation and Planning (KISTEP), South Korea's semiconductor technology is lagging behind China in all key areas, with specific scores indicating South Korea at 90.9% in high-integration, low-resistance memory chip technology compared to China's 94.1% [1]. - In the field of high-performance, low-power AI chips, South Korea scored 84.1%, while China scored 88.3% [1]. - South Korea's score in power semiconductors is 67.5%, significantly lower than China's 79.8% [1]. Group 2: Commercialization and Market Position - From a commercialization perspective, South Korea only leads in high-integration, low-resistance memory chips and advanced packaging technology, indicating a significant decline in its previous advantages [2]. - The report highlights that South Korea's previous lead in memory, sensing, and packaging technologies has been lost to China within just two years [2]. Group 3: Challenges and Future Outlook - Experts express concerns over South Korea potentially losing its major advantages in semiconductor technology to China, particularly in foundational research and design technology [2][3]. - The report emphasizes the need for South Korea to secure core technologies to maintain its strategic position in the global value chain, suggesting measures to attract and retain talent [3]. - Factors such as the rise of Japan and China, U.S. sanctions, and growth in Southeast Asian markets contribute to uncertainties for South Korea's semiconductor industry [3].