（编辑 姚尧） 证券日报网讯 超声电子10月14日在互动平台回答投资者提问时表示，公司有批量生产应用于高算力、 高性能计算配套的印制板产品；未来，公司仍将深入挖掘AI服务器、智能出行、智能家居和工业控制 等细分领域潜力，也会根据自身的市场策略拓展客户，不断优化客户结构。 ...

Core Viewpoint - The company, Ultra Sonic Electronics, has entered the small batch production phase for its 200G-400G optical modules, indicating a significant step towards commercialization and market expansion [1] Company Summary - Ultra Sonic Electronics has disclosed that its 200G-400G optical modules are now in small batch production, with ongoing market expansion efforts [1] - The company has already produced printed circuit board products for server applications, demonstrating a foundational presence in the upstream materials and components for optical modules [1] - Achieving small batch production marks a critical milestone for the company, as it transitions from research and development to commercial readiness, having completed initial manufacturing process and reliability validations [1] Industry Summary - Optical modules are essential components for optical signal transmission in data centers and communication networks, with increasing demand driven by the ongoing development of domestic computing infrastructure [1] - The 200G-400G optical module specifications are currently significant during this transitional period, offering substantial market application potential [1] - Market observers suggest that if Ultra Sonic Electronics can stabilize yield rates, reduce costs, and successfully acquire customers during this phase, its competitiveness in the future transition to 800G or higher-speed modules will be significantly enhanced [1]

Group 1: Company Overview - The company is Guangdong Shantou Ultrasonic Electronics Co., Ltd., with the stock code 000823 and the abbreviation "Ultrasonic Electronics" [1]. Group 2: Event Details - The 2024 Annual Performance Briefing was held on March 28, 2025, from 15:00 to 16:00 via the Shenzhen Stock Exchange's "Interactive Easy Platform" [2]. - The event was hosted by Lin Min, the company's General Manager, along with other key personnel including Chairman Mo Yibin and Secretary Chen Dongping [2]. Group 3: Market and Product Insights - Currently, the company's printed circuit board (PCB) products account for approximately 8% of applications in high-performance computing and server fields, with plans for future expansion in this area [3]. - The company produces PCBs for 5G communication devices, while research on 6G technology and applications is still ongoing [3]. - Although the company does not currently have PCBs specifically for AI glasses, it confirmed that its products can be adapted for such applications [3].