近日，寒武纪在互动平台回复投资者提问时表示：公司一直专注于人工智能芯片产品的研发与技术创 新，致力于打造人工智能领域的核心处理器芯片。随着大模型领域的快速发展，公司新一代智能处理器 微架构及指令集针对大模型的训练推理等场景进行重点优化，将在编程灵活性、易用性、性能、功耗、 面积等方面提升产品竞争力；公司基础系统软件平台也进行了更新和迭代，大力推进大模型业务的支持 和优化。公司研发的产品是通用型智能芯片，可以适配包括DeepSeek在内的主流开源模型。 未来，寒武纪将围绕自身的核心优势、提升核心技术，结合内外部资源，以自主创新为驱动，不断推动 企业发展，围绕人工智能核心驱动力——计算能力，坚持云边端一体化，坚持软硬件协同，矢志成为行 业领先的人工智能芯片设计公司。 所谓智能芯片，就是针对人工智能领域设计的芯片，为人工智能应用提供所需的基础算力，是支撑智能 产业发展的核心物质载体。智能芯片面向人工智能领域而专门设计，其架构和指令集针对人工智能领域 中的各类算法和应用作了专门优化，可高效支持视觉、语音、自然语言处理和传统机器学习等智能处理 任务。 截至2025年一季度末，寒武纪已经连续两个季度实现盈利，主要系公司持 ...

Core Viewpoint - The company, Cambricon Technologies, is focused on raising funds for projects related to AI chip innovation and software platforms to enhance its competitiveness in the AI industry [1][15]. Group 1: Company's Main Business - The company specializes in the research, design, and sales of AI core chips used in various applications such as cloud servers, edge computing devices, and terminal devices [1]. - Main products include cloud-based intelligent chips, edge intelligent chips, and terminal intelligent processors, along with supporting system software [1]. Group 2: Fundraising Plan - The company plans to raise up to 3,985.3273 million yuan through a private placement of A-shares, with the funds allocated to projects focused on large model chip platforms, software platforms, and working capital [1][2]. - The total investment for the projects is estimated at 4,980 million yuan, with the raised funds covering 3,985.3273 million yuan after deducting issuance costs [1][2]. Group 3: Project Details and Feasibility - The fundraising projects aim to innovate smart processors for large model technology, including chips for training, inference, and multi-modal tasks [2][3]. - The implementation of these projects is deemed necessary to support the rapid growth of the AI industry and meet the increasing demands for computing power from large models [3][4]. - The projects align with national policies promoting AI and high-end chip development, providing a favorable environment for their execution [4][12]. Group 4: Software Platform Development - The company recognizes the importance of developing a robust software platform to enhance the usability and adaptability of its AI chips, which is crucial for large model applications [8][9]. - The software platform will facilitate the integration of hardware and algorithms, optimizing performance and expanding application areas [10][11]. - The company has established a foundation for an open service capability, supporting developers in utilizing its products effectively [13]. Group 5: Use of Funds for Working Capital - Part of the raised funds, amounting to 478.9702 million yuan, will be used to supplement working capital, addressing the growing operational funding needs as the company expands [14]. - This allocation is expected to enhance the company's financial stability and support ongoing technological innovation [14]. Group 6: Commitment to Technological Innovation - The fundraising initiatives are closely aligned with the company's commitment to technological innovation in the AI chip sector, aiming to enhance design capabilities and software technology reserves [15][16]. - The company plans to continue improving product efficiency and usability through ongoing technological advancements [15].