氧化镓：第四代半导体的"性价比之王" 公众号记得加星标⭐️，第一时间看推送不会错过。 日前，日本厂商Novel Crystal Technology宣布，开始交付用于下一代功率半导体的150毫米（6英 寸）氧化镓（β-Ga₂O₃）晶圆样品，这一动作标志着氧化镓作为超宽禁带半导体材料，向规模化量产 迈出了关键一步。 据悉，NCT已明确后续发展路线：2027年交付150毫米β-Ga₂O₃外延片样品，2029年实现全面量产， 2035年进一步开发并供应200毫米（8英寸）β-Ga₂O₃晶圆，逐步完善氧化镓产品矩阵，抢占下一代功 率半导体市场先机。 这一动态也引发了业界对氧化镓（Ga₂O₃）材料产业化进程的再度聚焦。 Ga 2 O 3 ，属于一种单晶材料，是继Si、SiC及GaN后的第四代宽禁带半导体材料。 作为备受瞩目的下一代功率半导体材料，氧化镓实际上并非新近发现的材料，但直到近年，随着新能 源汽车、智能电网、光伏逆变器等高压场景对功率器件性能要求的持续攀升，其卓越的材料特性才被 推到聚光灯下。 据 了 解 ， 氧 化 镓 的 禁 带 宽 度 高 达 4.9eV ， 远 超 硅 材 料 的 1.1eV ， 高 于 ...

Core Insights - The global silicon carbide (SiC) wafer market is projected to grow from 143.6 billion yen in 2024 to 619.5 billion yen by 2035, representing an increase of approximately 4.3 times [1] - In 2024, the demand for SiC power semiconductors is expected to slow down, but sales volume is anticipated to increase by 81.9% year-on-year, primarily driven by Chinese wafer manufacturers [1] - The 6-inch wafer currently dominates the market, accounting for over 90% of sales, while the demand for 4-inch wafers is declining [2] Group 1 - The SiC power semiconductor market is expected to see a sales volume and revenue growth of about 20% year-on-year in 2025, despite a decline in prices due to the influx of cheaper products [1] - The diamond wafer market is projected to take off starting in 2026, with the market size expected to reach 4.6 billion yen by 2035 [3] - The commercialization of 2-inch diamond wafers is anticipated to accelerate the development of the diamond power semiconductor market [3] Group 2 - The aluminum nitride (AlN) wafer samples have begun shipping, and the application range is expanding, with full-scale production expected in the future [3] - The germanium wafer is planned to be developed as a 6-inch epitaxial wafer, with sales expected to begin around 2030 [3] - The silicon wafer market is expected to stabilize from 2025 onwards after a contraction in 2024, with the 6-inch wafer's practicality driving growth in GaN and gallium oxide wafer markets [3]