截至2025年6月17日 13点17分，中证半导体材料设备主题指数（931743）下跌0.50%。成分股方面涨跌 互现，神工股份领涨3.88%，中晶科技上涨1.75%，康强电子上涨1.46%；安集科技领跌2.73%，华峰测 控下跌2.45%，中科飞测下跌2.02%。半导体材料ETF（562590）下跌0.67%，最新报价1.03元。 近期随着中美在稀土领域的博弈加深，相关概念成为二级市场的大热板块。而同为半导体关键材料的稀 散金属，也广泛受到市场关注。据业内专家介绍，目前半导体材料的发展正从第三代开始走向第四代。 当前，第三代半导体材料已发展出完整的产业链，向成本更低的方向发展。第四代半导体材料氧化镓具 有耐压、电流、功率、损耗等优势，已被行业认可并逐渐开启产业化，国际领先企业均已展开相关布 局。2022年我国科技部将氧化镓列入"十四五"重点研发计划，抓紧发展第四代半导体材料、赶超国际先 进水平的意图已十分明显。 半导体材料ETF（562590），场外联接（华夏中证半导体材料设备主题ETF发起式联接A：020356；华 夏中证半导体材料设备主题ETF发起式联接C：020357）。 （文章来源：每日经济新闻） ...

南方财经全媒体记者 孙诗卉 上海报道 为深入实施创新驱动发展战略，上海金融监管局与上海市科学技术委员会近日出台《关于推动上海科技 保险高质量发展的指导意见》（以下简称《意见》），旨在构建与上海国际科技创新中心建设相匹配的 科技保险体系，强化保险服务对科技创新的支撑作用。 《意见》提出，构建覆盖科技创新全链条的保障体系，并首次系统性地提出打造保险产业与未来产业共 同成长的"伙伴关系"。 从"碎片化"到"全链条" "在顶层设计上，《意见》立足上海的战略定位与产业布局，首次系统性提出覆盖科技创新全链条、科 技企业全生命周期的科技保险发展框架。"上海金融监管局相关部门负责人对记者表示。 《意见》通过系统性布局与创新实践，为技术攻关、产业升级、企业出海等关键领域注入"稳定剂"，助 力上海加快培育新质生产力，打造全球科创高地。 在产品创新方面，引入"沪科积分"探索保险精准定价，推动人工智能在保险垂直领域的深度应用，创新 以"链主"企业为牵引的产业链科技保险模式。 在能力建设方面，鼓励大型保险机构发挥主力军作用，在专项考核、专属产品、专业人才、专营机构、 专用技术、专配系统等方面加快建设；积极研究与科技保险相适配的专业监管 ...

Market Overview - On May 27, the cultivated diamond sector opened strong, with Huanghe Xuanfeng hitting the daily limit up, and companies like Huifeng Diamond, Sifangda, and Liliang Diamond also experiencing significant gains [1] Company Developments - **ST Yazhen (603389.SS)**: Holds a 30% stake in Yazhen Diamond, which specializes in CVD large-size diamond manufacturing and sales, contributing to about 20% of the cultivated diamond sales market, with high-end quality diamonds accounting for over 50% [3] - **Huanghe Xuanfeng (600172.SS)**: Plans to increase its stake, leveraging 20 years of technical experience in cultivated diamonds, with a focus on R&D, production, and quality management [3] - **Sifangda (300179.SZ)**: Its subsidiary Tianxuan Semiconductor is involved in CVD technology R&D and has signed a 700 million yuan investment agreement to establish a production line for 700,000 carats of functional diamonds annually [3] - **Liliang Diamond (301071.SZ)**: A leading domestic producer of cultivated diamonds, currently producing high-grade diamonds in the range of 2-10 carats, with research indicating potential for 25-carat diamonds [4] Industry Events - On May 27, Huanghe Xuanfeng announced a joint venture with Bozhi Jinduan to develop diamond-based thermal materials for the semiconductor packaging sector [5] - Liliang Diamond is focusing on high-power heat sink projects, anticipating broad applications for diamonds in semiconductor cooling [5] - A $27 million agreement was signed between Akash and NxtGen for deploying diamond cooling servers in India [5] - Huawei and Nvidia are both exploring diamond cooling technologies, with Huawei filing a patent related to semiconductor devices involving diamond cooling [5] Industry Insights - Diamonds possess the highest known thermal conductivity, being 13 times that of silicon and 4-5 times that of copper and silver, making them a promising material for the semiconductor industry [6] - The diamond cooling technology can enhance GPU and CPU performance by three times, reduce temperatures by 60%, and lower energy consumption by 40%, potentially saving millions in cooling costs for data centers [6] - The diamond cooling market is projected to grow from $0.5 million in 2025 to $15.2 billion by 2030, with a compound annual growth rate of 214% [6] - In quantum computing, nitrogen-vacancy centers in diamonds are seen as a core material due to their ability to maintain quantum states at room temperature [6] - CVD-produced polycrystalline diamond heat sinks have a diameter of up to 2 inches and a thickness of 0.3 to 1 mm, offering superior thermal conductivity compared to traditional materials [6]