Core Viewpoint - The article highlights the unprecedented transformation opportunities and technological challenges in the semiconductor and optoelectronic industries due to the exponential growth in AI computing power demand and the accelerated deployment of 6G technology [1]. Group 1: Event Overview - The Munich Shanghai Optical Expo will take place from March 18-20, 2026, at the Shanghai New International Expo Center, featuring over 1,200 leading global companies [1]. - The event will include the "Collaborative Innovation Forum from Devices to Networks," focusing on "industry collaboration and communication upgrades," aiming to create a high-end platform for domestic innovation and technology integration [1]. Group 2: Exhibition Highlights - The expo will cover nine exhibition halls, focusing on six core areas: lasers and optoelectronics, optical manufacturing, infrared technology and applications, testing and quality control, integrated optoelectronics and optical communications, and biomedical photonics [3]. - Major industry players such as Dazhu Laser, Canon, and Coherent will showcase innovations from basic materials to core devices and system integration [3]. - The X Match business matching program will provide customized services for invited buyers, enhancing supply-demand matching efficiency [3]. Group 3: Forum Insights - The "Collaborative Innovation Forum" will gather 200 key participants, including academic leaders and industry giants, to discuss the entire value chain from trends to applications [4]. - Key presentations will focus on practical solutions addressing critical challenges, such as the production progress of silicon nitride photonic chips and their cost-reduction potential for optical module companies [4][5]. - The forum will also feature significant technological breakthroughs, including 3D vision solutions and ultra-high-speed oscilloscopes, with applications in major companies like Huawei and Alibaba Cloud [5]. Group 4: Market Demand and Supply - The forum will invite major telecom operators and cloud service providers to present clear procurement needs, focusing on 6G integrated communication and AI computing cluster construction [7]. - A closed-door matching session will facilitate one-on-one discussions between supply and demand sides, with previous events resulting in over 50 million yuan in orders [7]. Group 5: Domestic Innovation and Collaboration - The forum will showcase domestic companies with over 10 billion yuan in revenue, highlighting their R&D investments and breakthroughs in key areas like compound semiconductors and EDA tools [8]. - Discussions will cover critical topics such as the scaling of 800G/1.6T optical modules and the path to domestic EDA tool breakthroughs [8]. Group 6: Opportunities for Industry Professionals - The expo and forum present a unique opportunity for industry professionals to gain insights into mass production solutions and connect with major telecom and cloud service providers [10]. - Participants can engage with key decision-makers across the industry, fostering long-term collaboration [10].

Core Viewpoint - The forum titled "Collaborative Innovation Forum from Devices to Networks" aims to address practical challenges in the semiconductor industry, focusing on implementable technology solutions rather than mere concepts [1][10]. Group 1: Event Overview - The forum will take place on March 18, 2026, at the Shanghai New International Expo Center, featuring over 10 leading companies and three major telecom operators addressing the urgent needs of 6G technology [1]. - Unlike typical PPT presentations, this forum will showcase verified and applicable results from experts across academia and industry, targeting critical areas such as compound semiconductors and EDA [2]. Group 2: Agenda Highlights - The agenda includes presentations on various topics, such as photonic integrated chips for communication systems and the advantages of silicon capacitors in AI applications [5][6]. - Notable presentations include a practical solution for photonic integrated chips that can reduce device size by 40% and power consumption by 25%, addressing hardware bottlenecks in the transition from 5G to 6G [6]. Group 3: Demand and Collaboration - The forum will facilitate direct matching between supply and demand by inviting major telecom operators and leading cloud service providers to seek partnerships and collaboration [7]. - A closed-door matching session will allow participating companies to submit their technology proposals for one-on-one discussions with potential partners, leading to significant collaboration opportunities [7]. Group 4: Industry Needs and Opportunities - Telecom operators are expected to announce procurement needs for 6G integrated communication devices, focusing on domestic suppliers of optical chips and high-power compound semiconductor devices [8]. - Cloud service providers will present collaboration lists for AI computing centers, prioritizing products that can be delivered quickly from domestic companies [8]. Group 5: Organizational Strengths - The forum is organized by Semiconductor Industry Observation, which has over 10 years of experience in the semiconductor field, aiming to solve real industry problems and facilitate resource gathering for domestic innovation [10][12]. - The organization boasts a significant reach with over 950,000 followers across the industry, enabling effective engagement with key stakeholders [12].

Core Viewpoint - The article highlights the upcoming "Collaborative Innovation Forum from Devices to Networks" scheduled for March 18, 2026, at the Shanghai New International Expo Center, focusing on the semiconductor and communication industries, aiming to foster collaboration across the entire semiconductor value chain [2][20]. Group 1: Forum Overview - The forum is organized by Semiconductor Industry Observation and the Munich Shanghai Optical Fair, emphasizing "collaborative breakthroughs across the semiconductor industry chain" [2]. - It aims to connect key areas such as compound semiconductors, EDA, and semiconductor chip design, providing a high-end communication platform for technological breakthroughs and ecosystem building in the context of domestic substitution [2][5]. Group 2: National Science Optical Core - Guokexin (Haining) Technology Co., Ltd. is recognized as a leading enterprise in the domestic silicon nitride (SiN) silicon photonic chip field and a national-level specialized "little giant" enterprise [2][6]. - The company will present its mass production-level technology and application practices in the silicon photonics field during the forum, contributing to the innovation momentum in the optoelectronic industry [2][20]. Group 3: Technical Advantages - Guokexin has established an 8-inch low-loss silicon nitride silicon photonic mass production process, achieving a transmission loss as low as 0.1 dB/cm at a wavelength of 1550 nm, with a process yield exceeding 95% [8]. - The company has developed a self-owned silicon photonic integrated chip design platform, covering multiple core products in high-speed data communication, laser radar, and optical fiber sensing [9]. Group 4: Industry Layout and Recognition - Guokexin has been awarded the national-level specialized "little giant" enterprise title, reflecting its technical strength and industry position [11]. - The company has built a comprehensive technical system covering materials, design, processes, and packaging, supporting product iteration and scene expansion [11][12]. Group 5: Forum Value - The forum aims to break down barriers between the semiconductor and optoelectronic industries, addressing the challenges of domestic production processes [14]. - It will provide a platform for 200 core industry practitioners to engage in targeted discussions, enhancing technical cooperation and market expansion opportunities for Guokexin and its partners [15].