Core Viewpoint - The forum titled "Collaborative Innovation Forum from Devices to Networks" aims to address practical challenges in the semiconductor industry, focusing on implementable technology solutions rather than mere concepts [1][10]. Group 1: Event Overview - The forum will take place on March 18, 2026, at the Shanghai New International Expo Center, featuring over 10 leading companies and three major telecom operators addressing the urgent needs of 6G technology [1]. - Unlike typical PPT presentations, this forum will showcase verified and applicable results from experts across academia and industry, targeting critical areas such as compound semiconductors and EDA [2]. Group 2: Agenda Highlights - The agenda includes presentations on various topics, such as photonic integrated chips for communication systems and the advantages of silicon capacitors in AI applications [5][6]. - Notable presentations include a practical solution for photonic integrated chips that can reduce device size by 40% and power consumption by 25%, addressing hardware bottlenecks in the transition from 5G to 6G [6]. Group 3: Demand and Collaboration - The forum will facilitate direct matching between supply and demand by inviting major telecom operators and leading cloud service providers to seek partnerships and collaboration [7]. - A closed-door matching session will allow participating companies to submit their technology proposals for one-on-one discussions with potential partners, leading to significant collaboration opportunities [7]. Group 4: Industry Needs and Opportunities - Telecom operators are expected to announce procurement needs for 6G integrated communication devices, focusing on domestic suppliers of optical chips and high-power compound semiconductor devices [8]. - Cloud service providers will present collaboration lists for AI computing centers, prioritizing products that can be delivered quickly from domestic companies [8]. Group 5: Organizational Strengths - The forum is organized by Semiconductor Industry Observation, which has over 10 years of experience in the semiconductor field, aiming to solve real industry problems and facilitate resource gathering for domestic innovation [10][12]. - The organization boasts a significant reach with over 950,000 followers across the industry, enabling effective engagement with key stakeholders [12].

Core Viewpoint - The article emphasizes the importance of heterogeneous integration technology in the semiconductor industry, particularly in the context of new demands from artificial intelligence, intelligent driving, and high-performance computing applications. It highlights the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and Yongjiang Laboratory to address these challenges and promote collaboration between industry and academia [2][10]. Conference Background - The conference will focus on the critical issues of chip power consumption, performance, area, and cost, which are driving the acceleration of emerging semiconductor technologies. Heterogeneous integration, including 2.5D/3D integration and advanced packaging, is identified as a key area for development [2]. - Ningbo is positioned as a core city for advanced manufacturing, with a strong foundation in the electronics industry, making it an ideal location for this conference [2]. Conference Details - The 2025 Heterogeneous Integration Annual Conference will take place from November 17-19, 2025, in Ningbo, Zhejiang, co-hosted by TrendBank and Yongjiang Laboratory, with support from local industry associations [4][10]. - The expected scale of the conference is between 300 to 500 participants, featuring a diverse agenda that includes keynote speeches, technical sessions, and roundtable discussions on various topics related to heterogeneous integration and advanced packaging technologies [4][6][10]. Agenda Highlights - The agenda includes discussions on micro-nano device applications, 2.5D/3D integration, MEMS processing technology, and advanced packaging solutions. Notable topics also cover optical chip innovations and the integration of photonic and electronic components [6][7][10]. - The conference aims to facilitate deep research exchanges and industry topic sharing, promoting the integration of technology and industry applications [10]. Participation and Fees - The registration fee for the conference is set at RMB 2500 per person, with early bird discounts available for those who register before October 31 [12]. - The conference aims to attract a wide range of participants from the semiconductor industry, including EDA tool developers, chip manufacturers, and research institutions [15]. Industry Collaboration - The conference seeks to create a collaborative ecosystem that integrates technology, industry, and capital, breaking down barriers across the semiconductor supply chain [11][13]. - It will feature a combination of large-scale meetings and smaller closed-door sessions to enhance interaction quality and facilitate targeted discussions [13].

Core Viewpoint - The article emphasizes the significance of heterogeneous integration technology in the semiconductor industry, particularly in the context of the upcoming 2025 Heterogeneous Integration Conference, which aims to address the challenges and advancements in chip design and manufacturing [2][10]. Conference Background - The conference will focus on the stringent requirements for chip design and manufacturing driven by applications in artificial intelligence, smart driving, and high-performance computing [2]. - Heterogeneous integration has emerged as a crucial direction in the semiconductor field, especially as traditional Moore's Law approaches physical limits [2]. - Ningbo is highlighted as a key city for advanced manufacturing, with the Yongjiang Laboratory serving as a provincial-level innovation platform focusing on electronic information materials and micro-nano device research [2]. Conference Details - The 2025 Heterogeneous Integration Conference is scheduled for November 17-19, 2025, at the Nanyuan Wanghai Hotel, with an expected attendance of 300-500 participants [3][5]. - The conference is co-hosted by TrendBank and Yongjiang Laboratory, supported by local industry associations [3]. Agenda Highlights - The agenda includes a closed-door meeting for industry leaders, government speeches, and a ceremony for the micro-nano processing platform [4][6]. - Various topics will be discussed, including 2.5D/3D heterogeneous integration, MEMS micro-nano processing technology, and advanced packaging solutions [6][7]. Forum Highlights - The conference aims to integrate resources across the entire heterogeneous integration industry chain, fostering collaboration between technology, industry, and capital [11]. - It will involve participation from various stakeholders across the semiconductor supply chain, promoting discussions on future industry trends and development directions [11]. Registration and Fees - The registration fee for the conference is RMB 2500 per person, with early bird discounts available [12]. - Special pricing is offered for students, encouraging broader participation [12]. Participating Companies - A diverse range of companies from the semiconductor industry will be invited, including those involved in EDA tools, chip manufacturing, and advanced packaging [14][15]. Conclusion - The conference aims to facilitate deep research exchanges and industry discussions, promoting technological innovation and application integration in the semiconductor sector [10][11].