重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 11月19日-21日，2025势银显示技术与供应链产业年会（四川·成都） 点此报名 添加文末微信，加 异质异构集成产业 群 晶圆级 2.5D/3D异构集成技术商业化应用愈发普及，尽管晶圆级封装致力于芯片高集成化、尺寸小型化，但随着芯片内晶体管、线路以及功 能密度的大幅提升，2.5D CoWoS封装尺寸持续迭代扩大，目前中介层已经扩展至4倍掩膜尺寸，达到68mm*68mm,未来两年将突破 120mm*120mm尺寸。 对于300mm晶圆载板，2.5D中道制造工艺和封装产出效率将会受限，面板级封装具备更大的有效封装面积，且产出效率比晶圆级封装高3-7 倍，正作为下一代封装技术逐渐崭露头角。 尽管面板级封装具有很高的商业化前景，但目前依旧处于产业培育阶段，应用场景开发和探索，第一阶段主要集中在分立器件、功率 SiP已 经有产品率先导入PLP技术，第二阶段是数模混合多芯片封装导入PLP技术，这一块集中于消费电子和物联网产品，最终阶段是存算一体芯片 导入PLP技术，当下仍然处于技术规模和样品开发阶段，存算一体面板级封装技术的导入 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 11月19日-21日，2025势银显示技术与供应链产业年会（四川·成都） 点此报名 添加文末微信，加 异质异构集成产业 群 在人工智能、数据中心需求火爆的大背景下，光芯片赛道的一级二级市场活跃度节节攀高。光芯片作为异质异构集成技术的主要承载者，从 如今广泛应用的光通信技术，到未来前沿的光量子计算、光量子存储载体，一直是产业界和科研界不断研发新材料、新工艺及新结构的锚定 方向。 从衬底材料来看，目前光芯片衬底主要由 SOI、铌酸锂、GaAs、InP等材料，其中铌酸锂薄膜(LNOI)光子芯片技术因其 可兼容CMOS，且具 备超大规模、超快调制、超宽光语、超低损耗 的优势，被认为是下一代光通信、量子计算和高端光电子领域的核心材料。 且 在 "技术竞速"中，CHIPX率先在无锡布局国内首条光子芯片中试线， 并 于近日完成首片 6寸薄膜铌酸锂光子芯片晶圆在国内首个光子芯 片中试线下线，实现了超低损耗、超高带宽的高性能薄膜铌酸锂调制器芯片的规模化量 ...

Core Viewpoint - The article discusses the current state of the optical module industry, particularly in the context of AI-driven demand and the recent surge in stock prices, questioning whether this is a new era or just a cyclical peak [1][4]. Market Performance - On September 11, the A-share market saw a significant increase, particularly in the CPO (Co-Packaged Optics) sector, which rose by 6.64%, attracting a net inflow of 19.763 billion yuan [2]. - Three companies, NewEase (300502.SZ), Zhongji Xuchuang (300308.SZ), and Tianfu Communication (300394.SZ), collectively referred to as "Yizhongtian," saw their stock prices rise significantly, with NewEase up 13.42%, Zhongji Xuchuang up 14.28%, and Tianfu Communication up 13.54% [2]. AI Demand and Infrastructure - Oracle's unexpected performance guidance due to increased cloud infrastructure contracts signaled strong ongoing demand for AI computing power, which in turn spurred interest in optical modules as essential components for data transmission [3]. - The optical module market has become a focal point for investors, with AI computing hardware being a primary driver of growth since 2025 [4]. Optical Expo Insights - The 26th China International Optoelectronic Expo (CIOE) attracted 77,418 attendees, highlighting the growing interest in optical communication technologies [6]. - The expo showcased advancements in high-speed optical modules, with major companies presenting their latest technologies in 800G and 1.6T modules, as well as CPO solutions [6][9]. Technological Developments - Optical modules are critical for high-speed data transmission, converting electrical signals to optical signals and vice versa, with a shift from traditional copper cables to faster, more efficient optical solutions driven by AI demands [7][8]. - CPO technology, which integrates optical components with switching chips on a single substrate, is emerging as a solution to reduce signal loss and power consumption [9]. Financial Performance - Companies in the optical module sector reported strong financial results, with Zhongji Xuchuang's net profit for the first half of 2025 reaching 3.995 billion yuan, a 69.4% increase year-on-year, and NewEase's net profit soaring by 355.68% to 3.942 billion yuan [16]. - The competitive landscape is shifting, with NewEase closing the gap on Zhongji Xuchuang in terms of revenue and profitability [17]. Market Debate - A debate has emerged regarding the sustainability of high valuations in the optical module sector, with some analysts questioning the feasibility of projected profits for companies like Zhongji Xuchuang [19][20]. - The discussion reflects differing perspectives on whether the current demand driven by AI represents a new paradigm or a temporary cycle [21][22]. Supply Chain Challenges - The optical module industry faces challenges related to reliance on imported high-end optical chips, with domestic production capabilities still developing [22]. - Companies are striving to enhance local supply chains to reduce dependency on foreign sources for critical components [22]. Future Growth Areas - The market is exploring new growth opportunities, including the application of optical interconnect technology within servers and long-distance data center interconnections [25][26]. - The demand for coherent optical modules is expected to rise as AI data centers expand, creating new revenue streams for companies in the sector [26].

Core Viewpoint - The article emphasizes the significance of silicon photonics technology in the future of optical chip markets, highlighting its advantages in manufacturing optical transceivers and its expected market growth by 2030 [2][6][4]. Group 1: Market Overview - Silicon photonics technology is projected to dominate the optical chip market, with the market expected to triple by 2030, and the silicon photonics market share anticipated to double, leading to a sixfold market growth [2]. - Currently, InP optical chip products hold the largest market share at 40%, followed closely by silicon photonics at 37% [2]. Group 2: Technological Advantages - Silicon photonics offers high reliability and low failure rates, making it suitable for mass production, while other materials require years to achieve similar reliability [6]. - The integration of multiple optical components on a single chip is facilitated by silicon photonics, enhancing the reliability and linearity of modulators [10]. Group 3: Industry Adoption - Major companies like Cisco, Huawei, and Intel have significantly adopted silicon photonics technology, which took nearly a decade to influence the entire optical transceiver market [4]. - The compatibility of silicon photonics with LPO/CPO optical module packaging technology has driven its widespread penetration, increasing from 30% in 2024 to 60% by 2030 [4]. Group 4: Upcoming Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, focusing on cutting-edge technologies in heterogeneous integration and advanced packaging [8][10].

Core Viewpoint - The acquisition of LUCEDA by Guangliwei marks a strategic move into the silicon photonics design automation sector, aiming to enhance competitiveness in the global semiconductor industry amidst the rapid growth of AI computing power and silicon photonics technology [2][6][8]. Group 1: Acquisition Details - Guangliwei completed the acquisition of LUCEDA for a total price of €40 million (approximately RMB 340 million), with adjustments based on LUCEDA's net liabilities and working capital at the time of closing [3]. - LUCEDA, established in 2014, specializes in silicon photonics chip design software and related services, and will operate as a wholly-owned subsidiary of Guangliwei post-acquisition [3][4]. - The acquisition process began in July 2024 and was kept confidential until completion due to potential risks associated with government approvals and market reactions [3]. Group 2: Financial Performance - In the fiscal year 2024, LUCEDA reported revenues of €3.81 million and a net profit of €563,700, while in 2025, revenues are expected to rise to €4.2 million but with a projected net loss of €117,700 [4]. - Guangliwei's revenue for 2024 was RMB 547 million, a year-on-year increase of 14.5%, but the net profit decreased by 37.68% to RMB 80.27 million due to slowed revenue growth and increased R&D expenditures [5]. Group 3: Market Context and Strategic Importance - The silicon photonics market is projected to grow significantly, with a market size of approximately $1.4 billion in 2023, expected to reach $10.3 billion by 2029, reflecting a compound annual growth rate of 45% [7]. - The acquisition is seen as a strategic move to optimize Guangliwei's existing industrial layout and to develop comprehensive solutions in silicon photonics design, testing, and yield improvement [6][8]. Group 4: Collaborative Synergies - Post-acquisition, Guangliwei and LUCEDA plan to collaborate on enhancing the silicon photonics design automation toolchain, including the development of a unified design and simulation platform [10]. - The partnership aims to leverage Guangliwei's expertise in semiconductor manufacturing EDA tools and LUCEDA's advanced technologies to innovate in silicon photonics testing and yield enhancement solutions [10]. - LUCEDA's CEO indicated that the collaboration would provide necessary resources for innovation and aim for an annual growth rate exceeding 25% in the photon chip market [11].

Core Viewpoint - Photonic chips are emerging as a core technology for next-generation information processing and communication, offering advantages in bandwidth and energy efficiency compared to traditional electronic chips [3][4]. Industry Overview - Photonic chips utilize photons for information transmission and processing, integrating optical systems onto a chip, akin to a "light computer" or "light communication platform" [3]. - The photonic chip industry is structured into three segments: upstream (materials and manufacturing equipment), midstream (design, manufacturing, and packaging), and downstream (application deployment) [4][5][6]. Upstream Segment - Key materials for photonic chips include silicon, lithium niobate, indium phosphide, and silicon nitride, each with unique properties suitable for different applications [4]. - Manufacturing equipment such as photolithography machines and ion implantation devices are crucial for chip performance and yield [4]. Midstream Segment - The design phase involves layout and performance modeling of core components, requiring specialized optical EDA software for simulation and optimization [5]. - Manufacturing is often outsourced to foundries, with some companies engaging in heterogeneous integration to combine different material platforms for complex optical functions [5]. Downstream Segment - Current applications of photonic chips are primarily in data centers and communication devices, enhancing transmission rates and reducing power consumption [5]. - The demand for AI computing is driving the development of photonic chips integrated with electronic chips for deep learning tasks [5]. Supporting Systems - A comprehensive support system is essential for the efficient operation of the photonic chip industry, including design software, performance testing standards, and supply chain management [6]. Financing Trends - From 2020 to 2024, the number of financing events in the photonic chip sector showed a significant decline, indicating a period of capital cooling or adjustment, with a recovery trend expected in 2025 [7]. Key Companies - **Nanjing NanZhi Advanced Optoelectronic Integration Technology Research Institute** focuses on photonic integration chip technology and has established a comprehensive ecosystem for technology transfer and industrial incubation [9]. - **Xili Optoelectronics** aims to develop high-bandwidth, low-energy photonic integrated chips, targeting data center interconnects and server communication needs [12]. - **Guangben Intelligent Technology** specializes in photonic computing chips and has made significant advancements in commercializing its products for AI computing applications [16]. Recent Developments - AMD's acquisition of Enosemi marks a strategic move into silicon photonic technology, enhancing its AI chip interconnect capabilities [23]. - NVIDIA and TSMC are collaborating on silicon photonics to improve AI chip performance, addressing challenges in chip manufacturing [24][25].

Core Viewpoint - Yingwei Chip Technology has recently completed a multi-million yuan angel round financing exclusively invested by Zhongke Chuangxing, indicating strong investor confidence in the company's innovative technology and market potential [2][4]. Company Overview - Yingwei Chip Technology is a high-tech enterprise focused on optoelectronic heterogeneous integration technology, developing optical interconnect (OIO) products and infrared detector products. The company possesses unique wafer-level optoelectronic heterogeneous integration technology, integrating III-V materials with the silicon industry chain, leveraging the cost advantages of silicon materials and the high bandwidth characteristics of photonics [3]. Financing Purpose - The financing will primarily accelerate the industrialization process of wafer-level heterogeneous integration technology. The company plans to increase R&D investment, optimize product performance, enhance production efficiency, and expand market channels to promote the application of optical interconnect and infrared detector products in more high-end scenarios [4]. Investment Rationale - Zhongke Chuangxing's founder, Mi Lei, emphasized that optoelectronic integration is a significant development trend in the information field. Yingwei Chip Technology has deep technical accumulation and rich practical experience in III-V optical chips and silicon photonics, with significant advantages in performance and cost to meet the stringent demands of artificial intelligence and data centers [5]. Industry Perspective - The financing represents an important milestone in the field of optoelectronic heterogeneous integration, reflecting the high attention of venture capital institutions to cutting-edge technologies and strong support for innovative enterprises. Breakthroughs in optoelectronic integration technology will bring new development opportunities to industries such as data centers and artificial intelligence [6].

Core Viewpoint - The article discusses the potential of "optical-electrical integration" technology to revolutionize the semiconductor industry and redefine the competitive landscape between the US and China, highlighting China's recent advancements in this field [3]. Group 1: Optical-Electrical Integration - "Optical-electrical integration" is a technology that aims to combine semiconductors with optical transmission, potentially leading to significant reductions in data center energy consumption [3][4]. - China has emerged as the world leader in patent applications for optical-electrical integration since 2022, indicating a strong focus on this technology amidst US semiconductor restrictions [3]. - The technology allows for data transmission via light instead of electricity, offering advantages such as higher speed and lower loss compared to traditional copper wire transmission [4]. Group 2: Competitive Landscape - The US has not yet secured a victory in the ongoing technological competition with China, particularly in the realm of optical-electrical integration [3]. - As Chinese companies expand their commercialization efforts in this technology, they may pose a significant challenge to Japanese firms [3].