北京大学信息工程学院院长杨玉超在接受采访时表示，粤芯四期项目的建设有望提升区域芯片制造能力 和产业链完整性。北京大学深圳研究生院将推动与粤芯在产教融合、人才培养、校企联合实验室等多元 化合作内容，目标是构建产学研深度融合的创新合作模式。 据招股书，粤芯是广东省自主培养且首家进入量产的12英寸晶圆制造企业，为广东省实现了12英寸芯片 制造从0到1的突破，对粤港澳大湾区集成电路的产业发展、产业升级、科技创新和产业安全都具有重要 的意义。粤芯目前拥有两座12英寸晶圆厂，分别为第一工厂（粤芯一、二期）和第二工厂（粤芯三 期），规划产能合计为8万片/月。未来，公司还将新增建设一条规划产能为4万片/月的12英寸集成电路 数模混合特色工艺生产线，即第三工厂（粤芯四期）。粤芯四期建成后，公司规划产能合计将达到12万 片/月。 广州将加快华星光电t8、粤芯四期等重大项目建设。 1月22日，粤芯半导体技术股份有限公司（下称"粤芯"）四期项目启动。资料显示，该项目总投资约252 亿元，规划建设月产能4万片的12英寸数模混合特色工艺生产线，围绕"感、传、算、存、控、显"六大 方向，构建具备国际先进水平的数模混合、光电融合等特色工艺平 ...

Core Insights - The Future Network Experimental Facility, China's first major national technology infrastructure in the information and communication sector, has officially commenced operations [1] Group 1: Facility Overview - The facility is located in Nanjing, Jiangsu, and was completed in August 2024 [1] - It covers 40 cities nationwide, featuring 88 backbone network nodes and 133 edge network nodes, with a total optical transmission length exceeding 55,000 kilometers [1] - The facility can support 4,096 heterogeneous services for parallel testing and is capable of interconnecting with existing domestic and international networks [1] Group 2: Performance Metrics - The facility enables efficient, high-speed, low-latency, and low-jitter data transmission, with a packet loss rate of only one in a million [1] Group 3: Service and Collaboration - To date, the facility has served major national research institutions such as the National Astronomical Observatory and the Institute of High Energy Physics, as well as telecom operators like China Telecom, China Mobile, China Unicom, and China Broadcasting Network [1] - It has collaborated with universities including Peking University, Nanjing University, Zhejiang University, and the Chinese University of Hong Kong, along with leading companies like Huawei, H3C, and Baidu, completing 120 significant innovation experiments [1] - The experiments cover critical dimensions such as core chips, network operating systems, routing control, security and trust, large-scale networking, and new AI services [1]

Core Insights - Wuxi is leveraging its strong industrial foundation and forward-looking vision to establish an innovative ecosystem that integrates technology and industry, driving the development of future industries [1][8] - The city has implemented a systematic approach to cultivate future industries, focusing on five key sectors: artificial intelligence, quantum technology, third-generation semiconductors, hydrogen energy and storage, and deep-sea equipment, while also exploring new tracks such as low-altitude economy and humanoid robots [2][3] Group 1: Future Industry Development - Wuxi's "5+X" future industry development system aims to create a globally influential innovation hub, with a target industry scale exceeding 100 billion yuan by 2024 [2][3] - The quantum technology sector in Wuxi has shown significant growth, with total revenue reaching approximately 230 million yuan in the first three quarters of this year, marking an over 40% increase year-on-year [2] - Wuxi has initiated the "Wuxi Quantum Technology Industry Development Three-Year Action Plan (2026-2028)" to systematically layout future development goals and implementation paths for the quantum technology industry [2] Group 2: Innovation and Research - Wuxi is enhancing its innovation capabilities by establishing key laboratories and research institutes, with four national key laboratories and five provincial key laboratories currently in operation [4] - The city has formed partnerships with top universities and research institutions to create new R&D entities, achieving full coverage of the "465" modern industrial cluster [4] - The Wuxi Research Institute of Huazhong University of Science and Technology has been proactive in identifying and developing emerging technologies, such as humanoid robots and industrial AI models, which are now becoming industry hotspots [4] Group 3: Commercial Aerospace and Scene Innovation - Wuxi has gained a competitive edge in the commercial aerospace sector, with 52 regulated enterprises and a revenue of 10.4 billion yuan from January to September this year [6] - The city has introduced policies to accelerate scene innovation, focusing on integrating technology with industry and promoting the application of future industry technologies across various sectors [7] - Wuxi's high-tech zone has been proactive in identifying and developing application scenarios, establishing a dual-release mechanism for opportunity and capability lists to foster innovation [7]

Core Viewpoint - The 11th International Photonic Interconnect Forum will be held online on October 29, 2025, focusing on advancements in photonic technology and its integration with microelectronics, which is seen as a key direction in the post-Moore's Law era [3]. Group 1: Event Details - The forum is organized by the IEEE EDA Committee Guangzhou Branch and co-hosted by the École Polytechnique de Montréal and HKUST (GZ) [3]. - It will feature 16 invited experts from prestigious institutions such as the National University of Singapore, the University of Texas, and the University of Cambridge, who will discuss various aspects of photonic technology [3][6]. Group 2: Technological Significance - Photonic integration combines photonics and microelectronics, enabling enhanced computing power, higher data throughput, and lower energy consumption [3]. - This technology has broad application prospects in fields such as artificial intelligence, data centers, quantum computing, cloud computing, and communication networks [3]. Group 3: Participation Information - The forum will be conducted online, providing a platform for scholars and industry professionals to exchange knowledge [3]. - Participants can register for free and will receive a link to the online meeting one week prior to the event [6].

Core Insights - The article discusses the advancements and commercialization efforts of micro-transfer printing (μTP) technology, which is crucial for the integration of III-V materials on silicon substrates, enhancing photonic integrated circuits [2][5][6]. Group 1: μTP Technology Overview - μTP technology was developed by researchers at the University of Illinois in 2004 and has seen significant advancements, including the ability to transfer individual devices onto target photonic chips [2]. - The process involves using a PDMS stamp to pick and transfer devices, ensuring high alignment accuracy and allowing for large-scale parallel integration [3]. - μTP enables the integration of different materials on a common substrate without modifying the backend processes of silicon photonics [3]. Group 2: Commercialization Efforts - The INSPIRE project, running from 2021 to March 2025, focuses on commercializing wafer-level μTP technology, aiming to combine InP and SiN photonics on a single platform [5]. - Key partners in the INSPIRE project include Eindhoven University of Technology, imec, Smart Photonics, and Cambridge University, among others [5]. Group 3: Integration Challenges - The integration of III-V materials on silicon faces challenges due to lattice mismatch, which can lead to defects affecting the reliability of semiconductor lasers [6]. - Successful applications of single-chip methods in quantum dot devices have been reported, indicating potential for improved laser reliability [6]. Group 4: Upcoming Conference - TrendBank plans to host a conference from November 17-19, 2025, focusing on heterogeneous integration technologies, aiming to foster collaboration between industry and academia [9]. - The conference will cover advanced packaging technologies, including multi-material integration and photonic-electronic co-packaging [9].

Core Viewpoint - The 11th International Photonic Interconnect Forum will be held online on October 29, 2025, focusing on advancements in photonic technology and its integration with microelectronics, which is seen as a key direction in the post-Moore's Law era [3]. Group 1: Event Details - The forum is organized by the IEEE EDA Committee Guangzhou Branch and co-hosted by the École Polytechnique de Montréal and Hong Kong University of Science and Technology (Guangzhou) [3]. - It will feature 16 invited experts from prestigious institutions such as the National University of Singapore, University of Texas, École Polytechnique de Montréal, and University of Cambridge, who will discuss various aspects of photonic technology [3][6]. Group 2: Technological Significance - Photonic integration combines photonics and microelectronics, enabling enhanced computing power, higher data throughput, and lower energy consumption [3]. - This technology has broad application prospects in fields such as artificial intelligence, data centers, quantum computing, cloud computing, and communication networks [3].

Core Viewpoint - The article emphasizes the importance of heterogeneous integration technology in the semiconductor industry, particularly in the context of new demands from artificial intelligence, intelligent driving, and high-performance computing applications. It highlights the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and Yongjiang Laboratory to address these challenges and promote collaboration between industry and academia [2][10]. Conference Background - The conference will focus on the critical issues of chip power consumption, performance, area, and cost, which are driving the acceleration of emerging semiconductor technologies. Heterogeneous integration, including 2.5D/3D integration and advanced packaging, is identified as a key area for development [2]. - Ningbo is positioned as a core city for advanced manufacturing, with a strong foundation in the electronics industry, making it an ideal location for this conference [2]. Conference Details - The 2025 Heterogeneous Integration Annual Conference will take place from November 17-19, 2025, in Ningbo, Zhejiang, co-hosted by TrendBank and Yongjiang Laboratory, with support from local industry associations [4][10]. - The expected scale of the conference is between 300 to 500 participants, featuring a diverse agenda that includes keynote speeches, technical sessions, and roundtable discussions on various topics related to heterogeneous integration and advanced packaging technologies [4][6][10]. Agenda Highlights - The agenda includes discussions on micro-nano device applications, 2.5D/3D integration, MEMS processing technology, and advanced packaging solutions. Notable topics also cover optical chip innovations and the integration of photonic and electronic components [6][7][10]. - The conference aims to facilitate deep research exchanges and industry topic sharing, promoting the integration of technology and industry applications [10]. Participation and Fees - The registration fee for the conference is set at RMB 2500 per person, with early bird discounts available for those who register before October 31 [12]. - The conference aims to attract a wide range of participants from the semiconductor industry, including EDA tool developers, chip manufacturers, and research institutions [15]. Industry Collaboration - The conference seeks to create a collaborative ecosystem that integrates technology, industry, and capital, breaking down barriers across the semiconductor supply chain [11][13]. - It will feature a combination of large-scale meetings and smaller closed-door sessions to enhance interaction quality and facilitate targeted discussions [13].

Core Insights - The article discusses the advancements in thin-film lithium niobate (TFLN) and thin-film lithium tantalate (TFLT) as leading materials in integrated photonics, highlighting their unique properties such as low optical loss and high electro-optic coefficients, enabling modulation bandwidths exceeding 100 GHz [2] - A new silicon (Si) Mach-Zehnder modulator (MZM) based on heterogeneous integration of TFLT is proposed, showcasing competitive characteristics compared to devices using single-chip TFLT technology [2][3] Technical Developments - The device consists of a hybrid SiN/LT MZM, designed using a standard process design kit (PDK) on a Si photonic chip, with LT integrated via micro-transfer printing [3] - The measured insertion loss and propagation loss in the 7 mm long arm of the modulator total 2.9 dB, with a low half-wave voltage (Vπ) of 3.5 V achieved in push-pull configuration [3] - The modulator demonstrates a working bandwidth exceeding 70 GHz, validated through data transmission experiments using arbitrary waveform generators and photodiodes [3][5] Industry Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration in the electronic information industry [6][7] - The conference will cover topics such as multi-material heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and advanced packaging technologies like TGV and FOPLP [7]

Core Viewpoint - The article discusses the commercialization and development stages of panel-level packaging (PLP) technology, highlighting its potential advantages over traditional wafer-level packaging (WLP) and the challenges it faces in the industry [2][3][6]. Group 1: Panel-Level Packaging Development - Panel-level packaging is currently in the industry cultivation stage, focusing on application scenario development, with the first phase targeting discrete devices and power SiP adopting PLP technology [3]. - The second phase involves the integration of mixed-signal multi-chip packaging into PLP technology, primarily for consumer electronics and IoT products [3]. - The final phase will see the introduction of memory-compute integrated chips using PLP technology, expected to commence in 3-5 years, marking the competitive phase against wafer-level 2.5D/3D packaging [3]. Group 2: Technical and Operational Challenges - Panel-level packaging faces high operational costs, poor technical stability, and an incomplete industrial ecosystem, which are significant barriers to its widespread adoption [6]. - The large size of the panels complicates the chip placement and bonding processes, increasing the difficulty of controlling displacement, line width, and stress [6]. - Establishing a panel-level packaging ecosystem requires new equipment and material supply chains, which necessitates substantial investment, particularly in high-end memory-compute integrated chip sectors [6]. Group 3: Upcoming Events and Industry Collaboration - TrendBank plans to host the Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [7]. - The conference will cover core technologies such as multi-material heterogeneous integration, optoelectronic co-packaging, and advanced packaging techniques like TGV and FOPLP [7].

Core Viewpoint - The article emphasizes the growing importance and market activity of optical chips, particularly lithium niobate on insulator (LNOI) technology, in the context of increasing demand for artificial intelligence and data centers [2][3]. Group 1: Optical Chip Market Dynamics - The optical chip sector is experiencing heightened activity in both primary and secondary markets, driven by advancements in optical communication and emerging technologies like quantum computing [2]. - LNOI technology is highlighted as a key material for next-generation optical communication and quantum computing due to its compatibility with CMOS and superior performance characteristics [2][3]. Group 2: LNOI Technology Advantages - LNOI exhibits excellent optoelectronic performance, including a high electro-optic coefficient and strong nonlinear optical effects, making it suitable for high-speed optical modulation and quantum optics applications [3][4]. - The technology allows for significant device miniaturization, with a half-wave voltage-length product of less than 2.5 V·cm, leading to reduced power consumption and enhanced integration capabilities [3]. - LNOI crystals demonstrate high stability and reliability, with a Curie temperature around 1140°C, enabling operation in harsh environments [3]. Group 3: Global Supply Chain and Collaboration - The article outlines the establishment of the first open LNOI photonic chip foundry in Europe, which will enable industrial-scale production of optical-grade LNOI wafers [3][4]. - A list of global suppliers for lithium niobate substrates is provided, showcasing the competitive landscape and potential for collaboration within the industry [4]. Group 4: Upcoming Events and Industry Focus - The company plans to host the 2025 Heterogeneous Integration Annual Conference in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [6].