Core Viewpoint - The 11th International Photonic Interconnect Forum will be held online on October 29, 2025, focusing on advancements in photonic technology and its integration with microelectronics, which is seen as a key direction in the post-Moore's Law era [3]. Group 1: Event Details - The forum is organized by the IEEE EDA Committee Guangzhou Branch and co-hosted by the École Polytechnique de Montréal and HKUST (GZ) [3]. - It will feature 16 invited experts from prestigious institutions such as the National University of Singapore, the University of Texas, and the University of Cambridge, who will discuss various aspects of photonic technology [3][6]. Group 2: Technological Significance - Photonic integration combines photonics and microelectronics, enabling enhanced computing power, higher data throughput, and lower energy consumption [3]. - This technology has broad application prospects in fields such as artificial intelligence, data centers, quantum computing, cloud computing, and communication networks [3]. Group 3: Participation Information - The forum will be conducted online, providing a platform for scholars and industry professionals to exchange knowledge [3]. - Participants can register for free and will receive a link to the online meeting one week prior to the event [6].

Core Insights - The article discusses the advancements and commercialization efforts of micro-transfer printing (μTP) technology, which is crucial for the integration of III-V materials on silicon substrates, enhancing photonic integrated circuits [2][5][6]. Group 1: μTP Technology Overview - μTP technology was developed by researchers at the University of Illinois in 2004 and has seen significant advancements, including the ability to transfer individual devices onto target photonic chips [2]. - The process involves using a PDMS stamp to pick and transfer devices, ensuring high alignment accuracy and allowing for large-scale parallel integration [3]. - μTP enables the integration of different materials on a common substrate without modifying the backend processes of silicon photonics [3]. Group 2: Commercialization Efforts - The INSPIRE project, running from 2021 to March 2025, focuses on commercializing wafer-level μTP technology, aiming to combine InP and SiN photonics on a single platform [5]. - Key partners in the INSPIRE project include Eindhoven University of Technology, imec, Smart Photonics, and Cambridge University, among others [5]. Group 3: Integration Challenges - The integration of III-V materials on silicon faces challenges due to lattice mismatch, which can lead to defects affecting the reliability of semiconductor lasers [6]. - Successful applications of single-chip methods in quantum dot devices have been reported, indicating potential for improved laser reliability [6]. Group 4: Upcoming Conference - TrendBank plans to host a conference from November 17-19, 2025, focusing on heterogeneous integration technologies, aiming to foster collaboration between industry and academia [9]. - The conference will cover advanced packaging technologies, including multi-material integration and photonic-electronic co-packaging [9].

Core Viewpoint - The 11th International Photonic Interconnect Forum will be held online on October 29, 2025, focusing on advancements in photonic technology and its integration with microelectronics, which is seen as a key direction in the post-Moore's Law era [3]. Group 1: Event Details - The forum is organized by the IEEE EDA Committee Guangzhou Branch and co-hosted by the École Polytechnique de Montréal and Hong Kong University of Science and Technology (Guangzhou) [3]. - It will feature 16 invited experts from prestigious institutions such as the National University of Singapore, University of Texas, École Polytechnique de Montréal, and University of Cambridge, who will discuss various aspects of photonic technology [3][6]. Group 2: Technological Significance - Photonic integration combines photonics and microelectronics, enabling enhanced computing power, higher data throughput, and lower energy consumption [3]. - This technology has broad application prospects in fields such as artificial intelligence, data centers, quantum computing, cloud computing, and communication networks [3].

Core Viewpoint - The article emphasizes the importance of heterogeneous integration technology in the semiconductor industry, particularly in the context of new demands from artificial intelligence, intelligent driving, and high-performance computing applications. It highlights the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and Yongjiang Laboratory to address these challenges and promote collaboration between industry and academia [2][10]. Conference Background - The conference will focus on the critical issues of chip power consumption, performance, area, and cost, which are driving the acceleration of emerging semiconductor technologies. Heterogeneous integration, including 2.5D/3D integration and advanced packaging, is identified as a key area for development [2]. - Ningbo is positioned as a core city for advanced manufacturing, with a strong foundation in the electronics industry, making it an ideal location for this conference [2]. Conference Details - The 2025 Heterogeneous Integration Annual Conference will take place from November 17-19, 2025, in Ningbo, Zhejiang, co-hosted by TrendBank and Yongjiang Laboratory, with support from local industry associations [4][10]. - The expected scale of the conference is between 300 to 500 participants, featuring a diverse agenda that includes keynote speeches, technical sessions, and roundtable discussions on various topics related to heterogeneous integration and advanced packaging technologies [4][6][10]. Agenda Highlights - The agenda includes discussions on micro-nano device applications, 2.5D/3D integration, MEMS processing technology, and advanced packaging solutions. Notable topics also cover optical chip innovations and the integration of photonic and electronic components [6][7][10]. - The conference aims to facilitate deep research exchanges and industry topic sharing, promoting the integration of technology and industry applications [10]. Participation and Fees - The registration fee for the conference is set at RMB 2500 per person, with early bird discounts available for those who register before October 31 [12]. - The conference aims to attract a wide range of participants from the semiconductor industry, including EDA tool developers, chip manufacturers, and research institutions [15]. Industry Collaboration - The conference seeks to create a collaborative ecosystem that integrates technology, industry, and capital, breaking down barriers across the semiconductor supply chain [11][13]. - It will feature a combination of large-scale meetings and smaller closed-door sessions to enhance interaction quality and facilitate targeted discussions [13].

Core Insights - The article discusses the advancements in thin-film lithium niobate (TFLN) and thin-film lithium tantalate (TFLT) as leading materials in integrated photonics, highlighting their unique properties such as low optical loss and high electro-optic coefficients, enabling modulation bandwidths exceeding 100 GHz [2] - A new silicon (Si) Mach-Zehnder modulator (MZM) based on heterogeneous integration of TFLT is proposed, showcasing competitive characteristics compared to devices using single-chip TFLT technology [2][3] Technical Developments - The device consists of a hybrid SiN/LT MZM, designed using a standard process design kit (PDK) on a Si photonic chip, with LT integrated via micro-transfer printing [3] - The measured insertion loss and propagation loss in the 7 mm long arm of the modulator total 2.9 dB, with a low half-wave voltage (Vπ) of 3.5 V achieved in push-pull configuration [3] - The modulator demonstrates a working bandwidth exceeding 70 GHz, validated through data transmission experiments using arbitrary waveform generators and photodiodes [3][5] Industry Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration in the electronic information industry [6][7] - The conference will cover topics such as multi-material heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and advanced packaging technologies like TGV and FOPLP [7]

Core Viewpoint - The article discusses the commercialization and development stages of panel-level packaging (PLP) technology, highlighting its potential advantages over traditional wafer-level packaging (WLP) and the challenges it faces in the industry [2][3][6]. Group 1: Panel-Level Packaging Development - Panel-level packaging is currently in the industry cultivation stage, focusing on application scenario development, with the first phase targeting discrete devices and power SiP adopting PLP technology [3]. - The second phase involves the integration of mixed-signal multi-chip packaging into PLP technology, primarily for consumer electronics and IoT products [3]. - The final phase will see the introduction of memory-compute integrated chips using PLP technology, expected to commence in 3-5 years, marking the competitive phase against wafer-level 2.5D/3D packaging [3]. Group 2: Technical and Operational Challenges - Panel-level packaging faces high operational costs, poor technical stability, and an incomplete industrial ecosystem, which are significant barriers to its widespread adoption [6]. - The large size of the panels complicates the chip placement and bonding processes, increasing the difficulty of controlling displacement, line width, and stress [6]. - Establishing a panel-level packaging ecosystem requires new equipment and material supply chains, which necessitates substantial investment, particularly in high-end memory-compute integrated chip sectors [6]. Group 3: Upcoming Events and Industry Collaboration - TrendBank plans to host the Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [7]. - The conference will cover core technologies such as multi-material heterogeneous integration, optoelectronic co-packaging, and advanced packaging techniques like TGV and FOPLP [7].

Core Viewpoint - The article emphasizes the growing importance and market activity of optical chips, particularly lithium niobate on insulator (LNOI) technology, in the context of increasing demand for artificial intelligence and data centers [2][3]. Group 1: Optical Chip Market Dynamics - The optical chip sector is experiencing heightened activity in both primary and secondary markets, driven by advancements in optical communication and emerging technologies like quantum computing [2]. - LNOI technology is highlighted as a key material for next-generation optical communication and quantum computing due to its compatibility with CMOS and superior performance characteristics [2][3]. Group 2: LNOI Technology Advantages - LNOI exhibits excellent optoelectronic performance, including a high electro-optic coefficient and strong nonlinear optical effects, making it suitable for high-speed optical modulation and quantum optics applications [3][4]. - The technology allows for significant device miniaturization, with a half-wave voltage-length product of less than 2.5 V·cm, leading to reduced power consumption and enhanced integration capabilities [3]. - LNOI crystals demonstrate high stability and reliability, with a Curie temperature around 1140°C, enabling operation in harsh environments [3]. Group 3: Global Supply Chain and Collaboration - The article outlines the establishment of the first open LNOI photonic chip foundry in Europe, which will enable industrial-scale production of optical-grade LNOI wafers [3][4]. - A list of global suppliers for lithium niobate substrates is provided, showcasing the competitive landscape and potential for collaboration within the industry [4]. Group 4: Upcoming Events and Industry Focus - The company plans to host the 2025 Heterogeneous Integration Annual Conference in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [6].

Core Viewpoint - The article discusses the current state of the optical module industry, particularly in the context of AI-driven demand and the recent surge in stock prices, questioning whether this is a new era or just a cyclical peak [1][4]. Market Performance - On September 11, the A-share market saw a significant increase, particularly in the CPO (Co-Packaged Optics) sector, which rose by 6.64%, attracting a net inflow of 19.763 billion yuan [2]. - Three companies, NewEase (300502.SZ), Zhongji Xuchuang (300308.SZ), and Tianfu Communication (300394.SZ), collectively referred to as "Yizhongtian," saw their stock prices rise significantly, with NewEase up 13.42%, Zhongji Xuchuang up 14.28%, and Tianfu Communication up 13.54% [2]. AI Demand and Infrastructure - Oracle's unexpected performance guidance due to increased cloud infrastructure contracts signaled strong ongoing demand for AI computing power, which in turn spurred interest in optical modules as essential components for data transmission [3]. - The optical module market has become a focal point for investors, with AI computing hardware being a primary driver of growth since 2025 [4]. Optical Expo Insights - The 26th China International Optoelectronic Expo (CIOE) attracted 77,418 attendees, highlighting the growing interest in optical communication technologies [6]. - The expo showcased advancements in high-speed optical modules, with major companies presenting their latest technologies in 800G and 1.6T modules, as well as CPO solutions [6][9]. Technological Developments - Optical modules are critical for high-speed data transmission, converting electrical signals to optical signals and vice versa, with a shift from traditional copper cables to faster, more efficient optical solutions driven by AI demands [7][8]. - CPO technology, which integrates optical components with switching chips on a single substrate, is emerging as a solution to reduce signal loss and power consumption [9]. Financial Performance - Companies in the optical module sector reported strong financial results, with Zhongji Xuchuang's net profit for the first half of 2025 reaching 3.995 billion yuan, a 69.4% increase year-on-year, and NewEase's net profit soaring by 355.68% to 3.942 billion yuan [16]. - The competitive landscape is shifting, with NewEase closing the gap on Zhongji Xuchuang in terms of revenue and profitability [17]. Market Debate - A debate has emerged regarding the sustainability of high valuations in the optical module sector, with some analysts questioning the feasibility of projected profits for companies like Zhongji Xuchuang [19][20]. - The discussion reflects differing perspectives on whether the current demand driven by AI represents a new paradigm or a temporary cycle [21][22]. Supply Chain Challenges - The optical module industry faces challenges related to reliance on imported high-end optical chips, with domestic production capabilities still developing [22]. - Companies are striving to enhance local supply chains to reduce dependency on foreign sources for critical components [22]. Future Growth Areas - The market is exploring new growth opportunities, including the application of optical interconnect technology within servers and long-distance data center interconnections [25][26]. - The demand for coherent optical modules is expected to rise as AI data centers expand, creating new revenue streams for companies in the sector [26].

Core Viewpoint - The article emphasizes the significance of silicon photonics technology in the future of optical chip markets, highlighting its advantages in manufacturing optical transceivers and its expected market growth by 2030 [2][6][4]. Group 1: Market Overview - Silicon photonics technology is projected to dominate the optical chip market, with the market expected to triple by 2030, and the silicon photonics market share anticipated to double, leading to a sixfold market growth [2]. - Currently, InP optical chip products hold the largest market share at 40%, followed closely by silicon photonics at 37% [2]. Group 2: Technological Advantages - Silicon photonics offers high reliability and low failure rates, making it suitable for mass production, while other materials require years to achieve similar reliability [6]. - The integration of multiple optical components on a single chip is facilitated by silicon photonics, enhancing the reliability and linearity of modulators [10]. Group 3: Industry Adoption - Major companies like Cisco, Huawei, and Intel have significantly adopted silicon photonics technology, which took nearly a decade to influence the entire optical transceiver market [4]. - The compatibility of silicon photonics with LPO/CPO optical module packaging technology has driven its widespread penetration, increasing from 30% in 2024 to 60% by 2030 [4]. Group 4: Upcoming Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, focusing on cutting-edge technologies in heterogeneous integration and advanced packaging [8][10].

Core Viewpoint - The acquisition of LUCEDA by Guangliwei marks a strategic move into the silicon photonics design automation sector, aiming to enhance competitiveness in the global semiconductor industry amidst the rapid growth of AI computing power and silicon photonics technology [2][6][8]. Group 1: Acquisition Details - Guangliwei completed the acquisition of LUCEDA for a total price of €40 million (approximately RMB 340 million), with adjustments based on LUCEDA's net liabilities and working capital at the time of closing [3]. - LUCEDA, established in 2014, specializes in silicon photonics chip design software and related services, and will operate as a wholly-owned subsidiary of Guangliwei post-acquisition [3][4]. - The acquisition process began in July 2024 and was kept confidential until completion due to potential risks associated with government approvals and market reactions [3]. Group 2: Financial Performance - In the fiscal year 2024, LUCEDA reported revenues of €3.81 million and a net profit of €563,700, while in 2025, revenues are expected to rise to €4.2 million but with a projected net loss of €117,700 [4]. - Guangliwei's revenue for 2024 was RMB 547 million, a year-on-year increase of 14.5%, but the net profit decreased by 37.68% to RMB 80.27 million due to slowed revenue growth and increased R&D expenditures [5]. Group 3: Market Context and Strategic Importance - The silicon photonics market is projected to grow significantly, with a market size of approximately $1.4 billion in 2023, expected to reach $10.3 billion by 2029, reflecting a compound annual growth rate of 45% [7]. - The acquisition is seen as a strategic move to optimize Guangliwei's existing industrial layout and to develop comprehensive solutions in silicon photonics design, testing, and yield improvement [6][8]. Group 4: Collaborative Synergies - Post-acquisition, Guangliwei and LUCEDA plan to collaborate on enhancing the silicon photonics design automation toolchain, including the development of a unified design and simulation platform [10]. - The partnership aims to leverage Guangliwei's expertise in semiconductor manufacturing EDA tools and LUCEDA's advanced technologies to innovate in silicon photonics testing and yield enhancement solutions [10]. - LUCEDA's CEO indicated that the collaboration would provide necessary resources for innovation and aim for an annual growth rate exceeding 25% in the photon chip market [11].