Core Insights - The Nvidia GTC conference will be held from March 16 to 19, 2026, and is expected to reveal new GPU core parameters and showcase advancements in CPO switches, power architecture, and liquid cooling technologies [1][4]. Industry Trends - Nvidia has established a global CPO core supply chain covering core chips, optoelectronic devices, materials, and packaging manufacturing, with a focus on the next-generation AI chip roadmap and network architecture solutions at the GTC [4][6]. - The market trend is expected to continue emphasizing "speed + power," with recommendations to focus on industries related to PCB, CPO, storage, power, and cooling [4][5]. Investment Opportunities - Analysts suggest paying attention to CPO, LPU, AI liquid cooling, AI power, orthogonal backplane, and Feynman architecture at the GTC 2026 [5][6]. - The demand for computing power remains strong due to the continuous upgrade of large models and the rise of AI applications, indicating a positive outlook for AI core computing hardware [6][7]. - The introduction of the Vera Rubin platform and the next-generation Feynman architecture is anticipated, which may enhance liquid cooling system value and create opportunities for domestic suppliers entering overseas supply chains [6][7]. Company Developments - Nvidia is expected to expand its chip product matrix, potentially unveiling the Rubin Ultra chip and more details about its cabinet design, which could lead to innovations in data interconnectivity and power supply [7]. - The GTC 2026 is seen as a pivotal moment for Nvidia to transition the industry from merely purchasing GPUs to deploying AI factories, reinforcing confidence in the sustained growth of the AI industry [6][7].

Group 1 - The core viewpoint of the article highlights a strong surge in chip-related stocks, with companies like Xin Jing Gang, Zhong Ying Ke Ji, Lian Rui Xin Cai, and Chang Guang Hua Xin hitting the daily limit of 20% increase [2] - The upcoming NVIDIA GTC conference, scheduled for March 16-19, 2026, is anticipated to be a significant event in the AI computing power sector, where new GPU core parameters will be unveiled, along with advancements in technology and commercialization in areas such as CPO switches, power architecture, and liquid cooling [2] - Guolian Minsheng suggests that the market trend will continue to focus on "speed + power," recommending attention to the PCB, CPO, storage, power supply, and cooling sectors within the related industry chain [2]

Core Viewpoint - The article discusses the upcoming advancements in AI computing infrastructure, particularly focusing on the developments expected at the NVIDIA GTC conference, including new GPU architectures and power supply innovations [5][21]. Power Supply Architecture - The competition in AI computing power is fundamentally about power density, with significant advancements expected in power supply and cooling technologies. NVIDIA's Rubin chip is projected to exceed 2000W, while the upcoming "Feiman" chip aims for over 5000W, necessitating a shift to 800V high-voltage power systems [9][10]. - The transition to 800V high-voltage direct current (HDVC) is expected to reduce current and alleviate power loss issues, with NVIDIA's Rubin Ultra generation likely adopting this technology [9][10]. - Modular power supply solutions are anticipated to enhance current capacity and reduce PCB layout space, with significant implications for manufacturing complexity and costs [10][11]. - The value of inductors in power supply components is expected to increase significantly, from approximately 3 yuan in traditional designs to 8-10 yuan in modular designs, with potential for further increases due to technological advancements [10][11]. AI Computing and Data Transmission - The demand for higher bandwidth, lower latency, and reduced power consumption in AI computing is driving the evolution of optical communication technologies from traditional modules to Co-Packaged Optics (CPO) and Near-Packaged Optics (NPO) [14][15]. - The GTC conference is seen as a critical point for the commercialization of CPO technology, with expectations for significant production increases by 2027 [14][15]. - The integration of optical engines with network cards in the Rubin Ultra design is expected to lead to a surge in demand for optical components, enhancing the overall market for optical communication [15]. Liquid Cooling Technology - As GPU power levels rise above 2000W, liquid cooling is transitioning from an optional feature to a mandatory requirement, with projections indicating that liquid cooling will dominate the market by 2026 [16][17]. - The deployment of the "Feiman" chip is expected to significantly increase the demand for liquid cooling components, with a focus on upgrading cooling materials and thermal interface materials (TIM) [17][19]. - Innovations in cooling materials, such as diamond-based thermal conductors and liquid metal TIMs, are anticipated to enhance cooling efficiency and reduce total cost of ownership (TCO) for GPU servers [19][20]. Industry Supply Chain Developments - Domestic companies are making significant strides in integrating into the supply chains of major players like NVIDIA, Amazon, and Google, with several firms already validated for key components [12][13]. - The article highlights the importance of companies with core technologies and established supply chain relationships as key investment targets in the evolving AI infrastructure landscape [21].