摘要 ： 10月份，国内刻蚀设备采购活跃，涵盖TSV、激光、反应离子、ICP等多种刻蚀工艺，高校及科研机构主导，国产设备商表现亮眼。 特别提示 微信机制调整，点击顶部"仪器信息网" → 右上方"…" → 设为 ★ 星标，否则很可能无法看到我们的推送。 据 公 开 信 息 显 示 ， 2025 年 10 月 ， 国 内 刻蚀设备 采购市场活跃，多所高校及科研机构密集完成设备招 标，涵盖TSV、激光、反应离子、ICP等多种刻蚀工艺。 本月采购主体以高等院校与科研机构为主，覆盖集成电路、物联网、特种设备等多个前沿科研领域。其 中，空天信息大学（筹） 采购的"TSV刻蚀及沉积设备"由上海银雀电子科技发展有限公司中标，中标金额 2026万元 ，体现出该校正积 极布局相关的芯片制造能力建设。 在设备类型方面，高端科研需求推动特种工艺设备采购。中国科学院上海微系统与信息技术研究所采购 的 " 高 深 宽 比 刻 蚀 单 元 " 金 额 达 1198.1 万 元 ，为非标定制产品，显示出前沿科研对特殊工艺的迫切需求。此外，北京科技大学采购的"8英 寸 超 高 真 空 原 位 刻 蚀 / 蒸 发 镀 膜 系 统 " 由 Sy ...

Core Viewpoint - The company is actively expanding its thin film deposition equipment business, with expectations for rapid revenue growth in the next three to five years, despite current revenue being relatively small [1][3]. Group 1: Thin Film Deposition Equipment - The company achieved its first sale of LPCVD equipment in 2024, with annual sales amounting to approximately 156 million yuan [2]. - The thin film deposition equipment market is segmented into various types, including LPCVD, PECVD, ALD, PVD, EPI, and others, with PECVD holding a 32% market share [3]. - The company has successfully developed multiple new LPCVD and ALD devices, with over 150 LPCVD reaction chambers shipped and EPI devices entering customer mass production verification [3]. Group 2: Erosion Equipment Development - The company has seen significant growth in its ICP equipment, with new orders reaching 2.168 billion yuan in 2023, a year-on-year increase of 139.3%, and 4.108 billion yuan in 2024, an increase of 89.5% [5]. - The company has reduced the product development cycle from 3-5 years to approximately 18 months, allowing for faster market entry and mass production [5]. - Historically, 70% to 75% of the company's R&D investment was allocated to etching equipment, but recent years have seen increased investment in thin film equipment development [5]. Group 3: Future Outlook - The company aims to cover over 60% of high-end semiconductor equipment in the next five to ten years, transitioning into a platform-style group company that includes etching, thin film, and measurement equipment [5].