风险提示：能源成本上涨、新项目投产不及预期，下游需求不及预期。 聚焦高端芯片封装技术等领域，持续推出新产品。报告期内，公司持续聚焦高端芯片（AI、5G、HPC 等）封装 、异构集成先进封装（Chiplet、HBM 等）、新一代高频高速覆铜板（M8、M9 等）、新能源 汽车用高导热材料、先进毫米波雷达等下游应用领域的先进技术，深化纳米级球形二氧化硅、高性能球 形二氧化钛、先进氮化物粉体等功能性先进粉体材料的研究开发及应用推广，突破了氮化物球化技术、 氮化铝防水解等诸多技术难题。 持续推出多种规格、低 CUT 点、表面修饰、Low α 微米/亚微米球形二 氧化硅、低钠球形氧化铝粉，Low α 球形氧化铝、高频高速覆铜板用低损耗/超低损耗/极低损耗球形二 氧化硅，新能源汽车用高导热微米/亚微米球形氧化铝。 持续技术创新驱动产业升级，拓展新项目增强成长性。报告期内，公司持续深化与国内外领先的封装材 料、电子电路基板、高性能导热材料等领域厂商的战略合作，重点推进新产品的验证合作；持续加强高 性能球形二氧化硅、高性能球形氧化铝、高性能球形二氧化钛、先进氮化物粉体等功能性粉体材料的研 究开发。公司拟投资约 1.29 亿元实 ...

Investment Rating - The report maintains a "Buy-B" rating for the company, indicating an expected price increase of over 15% relative to the benchmark index [4][9]. Core Views - The company has shown strong performance in the first half of 2025, with revenue reaching 519 million yuan, a year-on-year increase of 17.12%, and a net profit of 139 million yuan, up 18.01% year-on-year [4]. - The demand for high-performance materials is driving growth, particularly in advanced packaging and high-performance electronic circuit boards, which has led to a steady increase in market share [4][5]. - The company is focusing on high-end powder materials and has launched several new products to meet the growing needs in AI, 5G, and electric vehicle sectors [5][6]. Financial Performance - For the first half of 2025, the company achieved a revenue of 281 million yuan in Q2, with a quarter-on-quarter increase of 16.38% and a year-on-year increase of 17.55% [4]. - The net profit for Q2 2025 was 76 million yuan, reflecting a quarter-on-quarter increase of 14.89% and a year-on-year increase of 19.94% [4]. - The projected net profits for 2025, 2026, and 2027 are 290 million yuan, 340 million yuan, and 390 million yuan, respectively, with corresponding P/E ratios of 50, 42, and 37 [9][11]. Market Trends - The global CCL market is expected to grow at a compound annual growth rate (CAGR) of 9% from 2024 to 2026, with the high-end CCL market projected to grow at a CAGR of 26% during the same period [7]. - The demand for ultra-pure spherical silica is increasing due to its critical role in high-performance circuit boards, which require materials with low dielectric loss to enhance signal integrity [7][8]. Investment Projects - The company is investing 720 million yuan in convertible bonds, with 423 million yuan allocated to high-performance substrate materials and 388 million yuan to high thermal conductivity materials [6]. - The high-performance substrate project is expected to generate sales revenue of 659 million yuan upon reaching full production, while the high thermal conductivity project is projected to achieve 310 million yuan in sales [6].