Group 1 - The core viewpoint of the article is the in-depth analysis and investment prospects of the organic liquid photoresist industry in China from 2025 to 2031, highlighting market trends, growth opportunities, and competitive landscape [1][3][4]. Group 2 - The organic liquid photoresist market overview includes definitions, classifications, and the statistical scope of the industry [3][4]. - The market is segmented by product types, including positive and negative photoresists, with growth trends projected for 2021, 2025, and 2031 [4][5]. - Applications of organic liquid photoresists are categorized into semiconductor, LCD, printed circuit boards, and others, with growth trends analyzed [4][5]. Group 3 - The current development status of the organic liquid photoresist industry is analyzed, including overall industry characteristics, influencing factors, and entry barriers [4][5][6]. - Global supply and demand dynamics for organic liquid photoresists are forecasted from 2021 to 2031, detailing production capacity, output, and utilization rates [4][5][6]. - China's supply and demand situation is also examined, with projections for production capacity, output, and market demand [4][5][6]. Group 4 - The competitive landscape of the global organic liquid photoresist market is analyzed, including market share of major manufacturers and sales revenue from 2021 to 2025 [4][5][6]. - The report provides insights into the market share and revenue of key players in the Chinese market, along with their sales prices [4][5][6]. Group 5 - Different product types of organic liquid photoresists are analyzed, with sales and revenue trends projected for both global and Chinese markets from 2021 to 2031 [5][6][7]. - The report also discusses the pricing trends of various product types and applications within the organic liquid photoresist market [5][6][7]. Group 6 - The industry development environment is assessed, focusing on trends, driving factors, and a SWOT analysis of Chinese enterprises in the organic liquid photoresist sector [6][7][8]. - The supply chain analysis covers the industry’s procurement, production, and sales models, along with key raw materials and downstream customers [7][8][9]. Group 7 - The report includes profiles of major global manufacturers of organic liquid photoresists, detailing their production bases, market positions, and recent developments [8][9][10]. - It also provides an analysis of the import and export trends of organic liquid photoresists in China, including major sources and destinations [10][11][12].

Core Viewpoint - The company is implementing a differentiated and high-end development strategy focused on electroplating and photolithography, with significant progress in product testing and upcoming mass production, which is expected to drive continuous growth in performance [1][3]. Electroplating - The company has established a competitive product matrix for electroplating solutions, achieving full category coverage in traditional and advanced packaging fields, and has made breakthroughs in high-end markets [1]. - In the advanced packaging sector, multiple products for electroplating solutions and additives have entered mass production, widely used in Bumping and RDL processes [1]. - The high-purity copper electroplating solution has achieved stable supply to Huada Technology and Tongfu Microelectronics, while the tin-silver electroplating additive has passed stringent certification from Changdian Technology and received small batch orders [1]. - The copper electroplating additive for advanced packaging is currently undergoing batch stability verification, and the 28nm Damascus copper interconnect process copper plating additive is in the final stages of product certification [1]. - The ultra-high purity cobalt-based solution and additives for 5-14nm advanced processes are progressing well in client testing, and the cleaning solution for copper processes in wafer manufacturing has entered the mass production scaling phase [1]. Photolithography - The advanced packaging negative photoresist has covered multiple mainstream packaging factories, with market penetration continuously increasing, and the company plans to enrich product models for full category coverage [2]. - The self-developed positive PSPI photoresist has successfully obtained the first domestic order from a mainstream wafer factory, breaking the long-standing technology monopoly of the US and Japan, and is expected to gradually achieve mass shipments by 2025 [2]. - The company is also developing negative PSPI and high-sensitivity chemical amplification PSPI, with plans to continue advancing product certification in advanced packaging and wafer manufacturers by 2025 [2]. - The wafer ICA chemical amplification photoresist is undergoing successful client validation testing, with some indicators outperforming international benchmark products [2]. - The OLED high-sensitivity photoresist is in client testing for OLED backplane array photolithography processes, and the company has reached a consensus with BOE on future cooperation and strategic planning [2]. - The high-thickness KrF photoresist is currently in the laboratory research phase, aiming to fill domestic gaps [2]. Market Expansion - The company has acquired INOFINE to expand into the Southeast Asian market, further solidifying its leading position in wet electronic chemicals [3]. - INOFINE, established in 2009, is one of the early entrants in the semiconductor wet electronic chemicals business in Malaysia and holds a certain influence in the local market [3]. - From 2025, INOFINE will be included in the company's consolidated financial statements [3]. Financial Projections - The company expects revenues of 600 million, 727 million, and 913 million yuan for the years 2025, 2026, and 2027, respectively, with net profits attributable to the parent company projected at 50 million, 71 million, and 103 million yuan for the same years [3].

点击 最 下方 " 推荐"、"赞 "及" 分享 "，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 正文 曝光时切断树脂聚合体主链和从链之间的联 系，达到削弱聚合体的目的,所以曝光后光 刻胶在随后的显影处理中溶解度升高，曝光 后溶解度几乎是未曝光时的10倍;更高分辨 率(无膨胀现象)在IC制造应用更为普遍。 | | | 光刻胶按化学反应原理分类 | | | | --- | --- | --- | --- | --- | | 主要类型 | 定义 | 优点 | 缺点 | 灵敏度 | | 正性光刻胶 | 受光昭射后感光部 分发生分解反应, | 分辨率高、对比度 好 | 能力差、高成本 | 保留曝光区域光刻 | | | 可溶于显影液,未 | | 粘附性差、抗刻蚀 | 胶完全溶解时所需 | | | 感光部分显影后仍 | | 的能量 | | | | 然留在基底表面。 | | | | | 负性光刻胶 | 曝光后形成交联网 格结构,在显影液 中不可溶,未感光 | 良好的粘附能力和 抗刻蚀能力、感光 速度快 | 显影时发生变形和一体原始开户 能胀，影响分辨率 胶原始厚度的 50% 並將可及上交兼國 | | | | 部分 ...