Core Insights - The article discusses the recent research conducted by QuanGuo Fund on the listed company JiaoCheng Ultrasonic, highlighting the fund's performance and the company's competitive advantages in the ultrasonic technology sector. Group 1: Fund Performance - QuanGuo Fund was established on February 8, 2022, and currently manages assets totaling 23.787 billion yuan across six funds with five fund managers [1] - The best-performing fund in the past year is QuanGuo XuYuan Three-Year Holding Mixed A (016709), achieving a return of 31.08% [1] - Other notable fund performances include: - QuanGuo XuYuan Three-Year Holding Mixed C (30.56%) - QuanGuo Consumer Opportunity Mixed Initiation A (25.79%) - QuanGuo SiYuan Three-Year Holding Mixed A (24.23%) - QuanGuo JiaYuan Three-Year Holding Mixed A (20.47%) [1] Group 2: Company Product Applications - The company’s ultrasonic technology encompasses both power ultrasound and detection ultrasound, with applications in new energy batteries, wiring connectors, and semiconductors [1] - The ultrasonic equipment varies significantly in frequency, power, and precision, indicating a wide range of technical challenges [1] Group 3: R&D Advantages - The company possesses the capability to independently produce core components of ultrasonic systems, giving it a competitive edge in technology innovation and talent resources [2] - Close collaboration with well-known clients allows the company to anticipate market demands and focus on developing new technologies and products [2] Group 4: Semiconductor Sector Competition - The company offers a full range of ultrasonic solutions, including ultrasonic terminal welding machines and ultrasonic scanning microscopes, and has established partnerships with major enterprises [3] - The domestic market for core ultrasonic equipment in semiconductor packaging remains underdeveloped, with a high market share held by imported equipment [3] - The company is gradually increasing its market share by leveraging its technological expertise to challenge foreign competitors [3] Group 5: Profitability Metrics - For the fiscal year 2024, the gross profit margin for the company's semiconductor ultrasonic equipment is projected to be 56.65% [4] - Continuous optimization of product structure and operational efficiency is aimed at enhancing overall competitiveness [4] Group 6: Technical Barriers - The application of ultrasonic technology involves multiple disciplines, creating significant technical barriers due to the complexity of maintaining ideal resonance states and minimizing operational losses [5] Group 7: Academic Collaborations - The company has signed an agreement with Shanghai Jiao Tong University to establish a joint laboratory focused on advanced semiconductor packaging and intelligent robotics [6] - This collaboration aims to advance research in ultrasonic precision detection technology and promote talent development and technology transfer [6]

Core Viewpoint - The company reported strong financial performance for the first three quarters of 2025, with significant year-on-year growth in revenue and net profit, indicating robust operational efficiency and market demand [1]. Financial Performance - For the first three quarters of 2025, the company achieved revenue of 521 million yuan, a year-on-year increase of 28% [1]. - The net profit attributable to shareholders reached 94 million yuan, up 360% year-on-year [1]. - The non-recurring net profit was 76 million yuan, reflecting a 673% increase year-on-year [1]. - The gross margin was 65.05%, an increase of 14 percentage points year-on-year [1]. - The net profit margin stood at 16.71%, up 12 percentage points year-on-year [1]. - In Q3 alone, the company reported revenue of 198 million yuan, a 20% increase year-on-year and a 13% increase quarter-on-quarter [1]. - The Q3 net profit attributable to shareholders was 36 million yuan, a 137% increase year-on-year and a 5% increase quarter-on-quarter [1]. - The Q3 non-recurring net profit was 30 million yuan, up 289% year-on-year and 13% quarter-on-quarter [1]. - The Q3 gross margin was 64.74%, an 11 percentage point increase year-on-year but a 1 percentage point decrease quarter-on-quarter [1]. - The Q3 net profit margin was 16.18%, a 7 percentage point increase year-on-year but a 2 percentage point decrease quarter-on-quarter [1]. Product Development and Market Position - The company successfully shipped its 2.5D/3D advanced packaging ultrasonic scanning microscope, breaking the technology monopoly in Europe and the US [2]. - The new Wafer400 series ultrasonic scanning microscope can detect 6, 8, and 12-inch wafers, offering various solutions to meet customer needs, with performance metrics comparable to leading international brands [2]. - In the semiconductor equipment sector, the company has established a dual layout in power semiconductors and advanced packaging, with a full range of ultrasonic solutions already in mass production [3]. - The company is actively promoting new products in the advanced packaging sector, including ultrasonic scanning microscopes and ultrasonic bonding machines, with successful orders from well-known domestic clients [3]. - The company is focusing on the solid-state battery sector, launching ultrasonic welding and detection equipment to meet the growing demand in the lithium battery market [3]. Business Model and Future Outlook - The "equipment + accessories" business model continues to support the company's performance, with an increasing revenue share from accessory sales [4]. - The company expects to achieve revenues of 866 million yuan, 1.198 billion yuan, and 2.368 billion yuan for the years 2025, 2026, and 2027, respectively, with net profits of 134 million yuan, 250 million yuan, and 469 million yuan [4]. - The corresponding price-to-earnings ratios are projected to be 92.54, 49.63, and 26.45 for the years 2025, 2026, and 2027, respectively [4].

Core Viewpoint - The company, Jiao Cheng Ultrasonic (688392), is actively advancing its product offerings in the semiconductor advanced packaging sector, focusing on ultrasonic solutions and establishing significant partnerships with well-known enterprises in the industry [1][3]. Group 1: Product Development and Market Position - The company has developed a comprehensive range of ultrasonic solutions for power semiconductors, including ultrasonic terminal welding machines and ultrasonic bonding machines, which have achieved mass production [1]. - In the advanced packaging field, the company is promoting new products such as advanced ultrasonic scanning microscopes and ultrasonic die bonders, successfully securing formal orders from reputable domestic clients [1][3]. - The company is also making strides in the IC packaging sector, focusing on high-end ultrasonic die bonders and ball bonding machines to break the long-standing monopoly of foreign manufacturers [3][4]. Group 2: Technology Advantages - Ultrasonic detection technology offers significant advantages over optical and X-ray detection methods, particularly in its ability to penetrate materials and quantify internal interface defects without causing damage [2]. - The ultrasonic bonding technology enhances the reliability and efficiency of packaging processes by utilizing ultrasonic energy to facilitate atomic diffusion at the interface, resulting in stronger metal bonds compared to traditional methods [4]. Group 3: Financial Performance - For the first half of 2025, the company reported a main revenue of 323 million yuan, a year-on-year increase of 32.5%, and a net profit attributable to shareholders of 58.04 million yuan, reflecting a substantial year-on-year growth of 1005.12% [6]. - The second quarter of 2025 saw a main revenue of 175 million yuan, up 42.46% year-on-year, with a net profit of 34.40 million yuan, marking a significant increase of 718.65% [6]. Group 4: Client Base and Industry Applications - In the wire harness connector sector, the company's ultrasonic welding machines are utilized in applications such as new energy vehicles and charging stations, collaborating with notable clients like BYD and Amphenol [5]. - The company is also expanding its product offerings in the medical field, having obtained five registration certificates for ultrasonic dental medical devices, with plans for further development in mid-to-high-end applications [6].

Core Viewpoint - The company has established a comprehensive ultrasonic solution in the power semiconductor field, with successful mass production of various ultrasonic welding machines and equipment [1] Group 1: Product Offerings - The company offers a full range of ultrasonic solutions including ultrasonic terminal welding machines, ultrasonic PIN needle welding machines, ultrasonic bonders, and ultrasonic scanning microscopes [1] - All products have achieved mass production, indicating strong operational capabilities [1] Group 2: Partnerships - The company maintains good cooperation with well-known enterprises such as SAIC Infineon, CRRC Times, Zhenhua Technology, Hongwei Technology, Silan Microelectronics, and Chiplink Integration [1]