车规级主驱碳化硅功率模块
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明星公司再融资,太空具身智能要来了
Sou Hu Cai Jing· 2025-12-27 13:00
Financing Activities - Chunfeng Huayu completed several hundred million RMB Series A financing, led by Shunxi Fund and Qiming Venture Partners, to enhance technology iteration and global market expansion in spinal surgery robotics [2] - Suzhou Yixin Semiconductor announced strategic financing to expand Micro-LED packaging chip capacity, focusing on full-color Micro-LED chip products [2] - Suzhou Xizhi Technology completed 250 million RMB Pre-A financing, aimed at new product development and facility expansion in the wide bandgap semiconductor sector [2] - Yufeng Future secured a new round of financing in the hundreds of millions, led by Hangtou Fund, to advance testing and certification of its large electric vertical takeoff and landing aircraft [3] - Lingtai Biopharmaceutical completed over 200 million RMB Series B financing, led by Hankan Capital, to accelerate clinical development of its core products [3] - Qianjue Technology raised nearly 100 million RMB in Pre-A++ financing to enhance brain-like architecture development and global commercialization [4] - Arc Light Quantum completed several million RMB Series A financing, exclusively funded by Beijing Information Industry Development Investment Fund [4] - Nuo Yiteng Robotics completed Pre-A+ financing to enhance data collection and processing capabilities for embodied intelligence [6] - Weihe Biotechnology announced seed round financing to build a research platform for synthetic biological manufacturing [6] - Chip Bida completed a new round of financing to promote market penetration and next-generation automotive chip development [6] - Baiming Xinkang raised over 300 million RMB in D+ round financing to advance global clinical trials and internationalization of its product pipeline [7] - Shuo Cheng Technology completed over 100 million RMB D round financing to support AI model iteration and market expansion [8] - Xino Future secured over 100 million RMB angel round financing, led by CATL Capital and Xiaomi, to accelerate product development and mass production [8] - Elliptical Space completed several hundred million RMB C1 round financing to advance its core strategic project "Star Pool Plan" [9] - DeepSense Technology completed over 800 million RMB C round financing to enhance its scientific discovery intelligent engine and expand market applications [9] Fund Establishments - The first commercial aerospace socialized special fund, "Leading Innovation Commercial Aerospace Alliance Science and Technology Fund," was established with an initial scale of 2 billion RMB [11] - Chengdu High-tech Zone established a venture capital fund with a contribution of 3 billion RMB [11] - The Guangdong-Hong Kong-Macao Greater Bay Area Venture Capital Guidance Fund was registered with a contribution of 45.05 billion RMB [12] - Shanghai Jiao Tong University launched the second phase of its future industry mother fund, targeting a scale of 1 billion RMB [12] - A low-altitude industry venture capital fund was established in Fuzhou with a contribution of 500 million RMB [12] - Zhejiang Province established a science and technology innovation direct investment partnership with a contribution of approximately 8.08 billion RMB [14] - Fujian (Xiamen) Social Security Science and Technology Innovation Fund was established with a contribution of 20 billion RMB [14] - A space and marine industry development fund was established in Hunan with a contribution of 3 billion RMB [14]
高端汽车市场创2亿营收,「悉智科技」拓疆AIDC蓝海 |36氪首发
3 6 Ke· 2025-12-19 02:25
作者丨欧雪 编辑丨袁斯来 硬氪获悉,宽禁带电力电子零部件供应商「悉智科技」近日完成2.5亿元Pre-A轮融资。我们总结了本轮融资信息和该公司几大亮点: 融资金额及领投机构 融资轮次:Pre-A轮 融资规模:2.5亿元人民币 投资方:安芯资本、浙江省新能源汽车基金、交银国际等 融资用途:新产品研发、新厂房建设和AIDC事业部扩充 公司基本信息 成立时间:2022年 成立地点:苏州 技术亮点:「悉智科技」是国内少数在宽禁带半导体(SiC/GaN)领域,同时掌握MHz级高频设计、车规级塑封/嵌埋封装工艺并实现塑封模块大规模量产 的公司。其核心产品包括车规级主驱碳化硅功率模块与高频电源模块两大系列。 碳化硅主驱功率模块DCM(图源/企业) 碳化硅HVDC高压电源模块(图源/企业) 硬氪了解到,功率模块就像是电动汽车的"动力心脏",负责将电池的直流电高效地转换成驱动电机所需的交流电,其性能直接决定了车辆的加速、能效与 续航。 目前,一方面在汽车领域,「悉智科技」专注主驱碳化硅模块塑封路线,通过自主创新设计,实现了回路电感比国际竞品下降50%,均流性提升45%,助 力客户提升系统性能,同时还在研发下一代车规级SiC和Ga ...