Core Viewpoint - Shanghai Awinic Technology Co., Ltd. is focusing on raising funds through convertible bonds to enhance its research and development capabilities in the semiconductor industry, particularly in high-performance mixed-signal chips, power management, and signal chain technologies, to meet the growing demand in various applications such as consumer electronics, automotive, and industrial sectors [1][2][3]. Group 1: Company's Main Business - The company specializes in integrated circuit design, particularly in high-performance mixed-signal, power management, and signal chain chips, with over 1,400 product models and annual sales exceeding 6 billion units by the end of 2024 [1][11]. - The company has established a strong technical foundation and competitive advantage in the high-performance mixed-signal chip sector, continuously innovating and expanding its product categories to meet domestic demand for localization [2][3]. Group 2: Fundraising and Investment Plans - The total amount to be raised through the issuance of convertible bonds is not to exceed 1,901.32 million yuan, which will be allocated primarily to the development and industrialization of edge AI and supporting chips [3][4]. - The company plans to invest in a global R&D center to enhance research efficiency and support the development of its core product lines, including mixed-signal chips, power management chips, and signal chain chips [5][6]. Group 3: Project Necessity and Feasibility - The establishment of the global R&D center is crucial for improving the company's research environment, meeting the increasing demand for R&D projects, and achieving cost reduction and efficiency enhancement [8][9]. - The project aligns with national policies supporting the semiconductor industry, providing a favorable environment for its implementation [10][28]. Group 4: Market Opportunities - The edge AI market is experiencing rapid growth, with a projected market size of 193.9 billion yuan in 2023, and the company aims to capitalize on this trend by developing compatible chips [17][21]. - The automotive chip market is also expanding, driven by the increasing demand for electric and intelligent vehicles, with the company planning to develop a range of automotive chips to enhance its competitive position [22][31].

智通财经7月28日电，艾为电子(688798.SH)公告称，公司拟向不特定对象发行可转换公司债券募集资金 不超过19.01亿元，用于全球研发中心建设项目、端侧AI及配套芯片研发及产业化项目、车载芯片研发 及产业化项目和运动控制芯片研发及产业化项目。其中，全球研发中心建设项目总投资14.85亿元，拟 使用募集资金12.24亿元。 艾为电子：拟发行可转债募资不超过19.01亿元 用于多个研发及产业化项目 ...