中国台湾面板厂群创旗下位于南部科学园区的五厂（5.5 代厂）出售动向引起市场在、注意，虽2月11 日市场一度盛存储大厂美光（Micron）将接手该厂以扩充产能，但最新市场消息指出，美光因已敲定收 购力积电铜锣厂，群创南科五厂的真正买家并非美光，而是拟出售予中国台湾的重量级半导体封测大 厂。 （来源：OLEDindustry） （来源：OLEDindustry） 中国台湾面板厂群创旗下位于南部科学园区的五厂（5.5 代厂）出售动向引起市场在、注意，虽2月11 日市场一度盛存储大厂美光（Micron）将接手该厂以扩充产能，但最新市场消息指出，美光因已敲定收 购力积电铜锣厂，群创南科五厂的真正买家并非美光，而是拟出售予中国台湾的重量级半导体封测大 厂。 群创南科五厂的出售案近期传闻不断，买家名单从台积电、美光到各大封测厂皆曾被点名。 2月11日市 场传出美光为因应2025年起由AI带动的存储供需失衡及报价上涨，有意买下群创五厂进行"买厂改厂"， 以求快速扩大版图。然而，此传闻随即遭到业界的消息修正。 群创南科五厂的出售案近期传闻不断，买家名单从台积电、美光到各大封测厂皆曾被点名。 2月11日市 场传出美光为因应20 ...

Core Viewpoint - The semiconductor packaging and testing industry is undergoing significant changes as traditional OSAT (Outsourced Semiconductor Assembly and Test) companies face intense competition from foundries like TSMC, Samsung, and Intel, which are entering the advanced packaging sector. Traditional OSAT firms are actively expanding their capabilities and investing in advanced packaging technologies to maintain their market positions [1][16][38]. Group 1: Traditional OSAT Companies' Expansion - ASE Group (日月光) is expanding its advanced packaging capacity by investing $200 million in a FOPLP production line in Kaohsiung, Taiwan, aiming for mass production by the end of the year [2][3]. - ASE has also inaugurated its fourth and fifth factories in Penang, Malaysia, with a total investment of $300 million to meet the growing demand for automotive semiconductors and AI applications [3][4]. - ASE is acquiring two packaging factories from Infineon in the Philippines and South Korea for approximately NT$2.1 billion to enhance its capabilities in automotive and industrial automation applications [5][6]. Group 2: Amkor Technology's Developments - Amkor plans to triple the annual production capacity of its factory in Vietnam from 1.2 billion to 3.6 billion units, reflecting strong growth in the region [7][8]. - The company is investing $2 billion to build an advanced semiconductor packaging and testing facility in Arizona, USA, primarily serving TSMC and Apple [8][9]. Group 3: Longsys Technology's Innovations - Longsys Technology is focusing on high-density packaging technologies, including 2.5D/3D packaging, and has launched a high-end manufacturing project in Jiangsu with a total investment of 10 billion yuan [9][24]. - The company has developed a high-density heterogeneous integration technology platform, XDFOI, which has entered stable mass production and is being applied in high-performance computing and AI fields [24][25]. Group 4: Tongfu Microelectronics' Advancements - Tongfu Microelectronics has established a 2.5D/3D packaging platform and is expanding its capabilities in high-performance computing, with new processes developed for chiplet packaging [28][29]. - The company is also focusing on glass substrate packaging technology to meet the demands of various high-performance chip applications [29][30]. Group 5: Huada Semiconductor's Strategic Moves - Huada Semiconductor is investing in advanced packaging technologies, including SiP and 3D packaging, and has launched a new 2.5D packaging technology platform to cater to AI demands [31][32]. - The company is also developing a 3D Matrix packaging platform that integrates TSV and eSiFo technologies for high-density heterogeneous integration [35][36]. Group 6: Powertech Technology's Expansion - Powertech Technology is expanding its testing capabilities in Japan with a new investment of 5 billion yen to enhance its semiconductor testing and mass production capabilities [13][14]. - The company is evaluating a proposal to establish a high-end chip packaging factory in Japan, aiming to leverage the country's advanced testing technology and stable automotive chip market [14][36].