Core Insights - Imec has made significant advancements in single-print high numerical aperture EUV lithography technology, showcasing a 20nm pitch line structure with a critical dimension (CD) of 13nm, which is crucial for advanced semiconductor manufacturing [3][8][10] - The results achieved by Imec are pivotal for meeting the goals outlined in the European Chips Act, particularly concerning technology nodes below 2nm [3][11] Summary by Sections - **Technological Achievements** - Imec demonstrated a 20nm pitch line structure with a 13nm T2T CD and a local critical dimension uniformity (LCDU) of 3nm, marking a significant milestone in the industry [9][10] - The results were obtained through the optimization of metal oxide photoresists and the underlying illumination pupil shape and mask selection [9][10] - **Collaboration and Ecosystem** - The advancements are a result of collaboration with ASML and the establishment of the ASML-Imec high numerical aperture EUV joint laboratory in Veldhoven, which has fostered a robust ecosystem for lithography technology development [11] - The partnership emphasizes the importance of collaboration among leading chip manufacturers, equipment suppliers, and material providers to enhance high numerical aperture EUV lithography capabilities [11] - **Future Directions** - Imec is working towards reducing the end-to-end distance to 13nm and below while maintaining functional interconnects, with promising results already seen at the 11nm process node [5][10] - The laboratory is also exploring alternative metallization schemes for below 20nm pitches, demonstrating the compatibility of ruthenium (Ru) direct metal etching with single-exposure high NA EUV lithography [10][11]

Core Viewpoint - The strategic partnership agreement between Imec and Zeiss Semiconductor Manufacturing Technology aims to advance semiconductor technology development, particularly for research and development below 2 nanometers, extending their collaboration until 2029 [3][7]. Group 1: Partnership Details - The new agreement extends the existing partnership established in 2019, emphasizing the importance of collaboration in advancing semiconductor technology [3]. - Imec and Zeiss have been working together since 1997 on various joint projects to further develop Moore's Law, which continues to enhance microchip and memory processor performance [3][5]. - The partnership focuses on key semiconductor manufacturing technologies, including high numerical aperture EUV lithography, which is essential for producing more powerful and energy-efficient microchips [3][5]. Group 2: Technological Advancements - Imec's NanoIC pilot line is being expanded to cover the entire value creation process and various technology chains in semiconductor manufacturing [5]. - The pilot line aims to provide groundbreaking and advanced semiconductor technologies and platforms for industry representatives, enabling them to explore, develop, and test innovations [5]. - Both companies are committed to optimizing existing equipment, processes, and measurement methods to achieve smaller, more powerful, and energy-efficient microchips, driving global digitalization [5][8]. Group 3: European Chip Act Compliance - The collaboration aligns with the goals of the European Chip Act, which aims to strengthen Europe's technological sovereignty, competitiveness, and resilience [7]. - Zeiss's investment in the NanoIC pilot line contributes significantly to maintaining Europe's leadership in the latest generation of semiconductor equipment [7]. - The partnership highlights the strong cohesion among European partners, which is crucial for establishing the NanoIC pilot line, recognized as the world's most advanced R&D infrastructure below 2 nanometers [8].