Core Viewpoint - The Shanghai Fengxian District Government has issued the "Fengxian District General New Materials Industry Development Action Plan (2025-2027)" to enhance the development of the new materials industry, focusing on integrated circuit supporting materials and promoting domestic alternatives [1] Group 1: Industry Focus - The plan emphasizes the use of the Shanghai Electronic Chemical Products Zone as a platform, with key areas being the Hangzhou Bay Development Zone and the Industrial Comprehensive Development Zone [1] - The initiative targets the development of wet chemicals, high-purity targets, electronic gases, and semiconductor packaging materials as key directions for integrated circuit supporting materials [1] Group 2: Company Support - Companies such as Xinxin Lesi, Tongchuang Purun, and Kangmeite are identified as key players in driving the development of advanced process integrated circuit supporting materials [1] - The plan supports the development of high-purity targets above 6N level, high-purity reagents above G3 level, deep ultraviolet photoresists, and associated reagents to accelerate domestic substitution [1] Group 3: Project Development - The plan aims to promote the establishment of the Tongchuang Purun New Materials Industrial Park project to create an ecosystem for industry chain expansion [1]

Core Viewpoint - The Guangzhou Development Zone and Huangpu District have introduced policies to support the high-quality development of the integrated circuit industry, focusing on the localization of key equipment and components [1] Group 1: Policy Measures - The newly released policy encourages the development of high-end semiconductor and sensor manufacturing materials, including photomasks, electronic gases, photoresists, polishing materials, and high-purity targets [1] - The policy aims to steadily enhance the supply capacity of key basic materials by actively attracting domestic key basic material enterprises [1] Group 2: Support for Localization - Continuous research and technological breakthroughs will be conducted around key components and system integration for integrated circuit manufacturing, supporting the localization of equipment such as photolithography, cleaning, etching, ion implantation, and deposition [1] - For newly introduced industrial projects with fixed asset investments exceeding 10 million yuan, companies achieving small-scale upgrades during the policy's validity period will receive support of up to 15% of their equipment and tool investment, with a maximum of 10 million yuan [1]