第第九九届届国国际际先先进进光光刻刻技技术术研研讨讨会会 （（ IIWWAAPPSS 22002255 ）） --IIWWAAPPSS 22002255-- 第九届国际先进光刻技术研讨会（IWAPS）将于10月14-15日在深圳隆重举行！本次研 讨会由中国集成电路创新联盟、中国光学学会主办，中国科学院微电子研究所、深圳市半导 体与集成电路产业联盟（深芯盟）、南京诚芯集成电路技术研究院有限公司联合承办，诚邀 全球业界精英共赴这场光刻技术领域的学术盛宴！ 国际先进光刻技术研讨会（IWAPS），依托中国创新沃土，搭建全球交流平台。在国内 外光刻专家的鼎力支持下，在全球企业、高校、协会等的共同推动下，IWAPS持续构建覆盖 光刻设备、工艺制程、计量检测、掩模材料、计算光刻、系统协同优化及新型技术等全产业 链的尖端技术对话平台。 本届盛会特别依托深芯盟的产业集群优势，汇聚深圳及湾区半导体企业、高校与科研机 构的协同力量；同时联动湾芯展的产业生态资源，为全球领军企业提供展示创新蓝图的舞 台，为科研院所搭建核心技术攻关的交流通道，为青年学者创造技术思辨的活跃氛围，更为 投资机构提供洞察粤港澳大湾区半导体机遇的前瞻窗口。 第 ...

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Core Insights - Mistral AI, a leading AI company in France, raised €1.7 billion (approximately $2 billion) in a Series C funding round led by ASML, increasing its valuation from $6.4 billion to about $13.7 billion [2][3] - Mistral AI is recognized as a competitor to major US AI firms like OpenAI and Google, with its chatbot Le Chat being enhanced with features such as deep research and voice capabilities [3][4] - The partnership with ASML aims to leverage AI to address engineering challenges in the semiconductor industry, highlighting the interconnectedness of AI and semiconductor technologies [6][7] Funding and Valuation - The recent funding round has more than doubled Mistral's valuation to approximately $13.7 billion [2] - Notable investors in this round include Nvidia, DST Global, Andreessen Horowitz, and others [2] Product Development - Mistral has released several advanced AI models, including Mistral Medium 3 and Mistral Code, which outperform competitors' solutions [4] - The company is also focusing on inference-optimized AI models, positioning itself competitively in the current AI landscape [4] Strategic Partnership - ASML's investment is seen as a strategic move to enhance the entire technology chain from AI development to infrastructure engineering [5][6] - ASML's CEO emphasized that the collaboration will bring significant benefits to ASML's customers through innovative products and solutions [4][6] Market Context - The collaboration between a semiconductor equipment supplier and an AI startup reflects the growing importance of AI in semiconductor manufacturing [6][7] - The concept of "technological sovereignty" is driving interest in such partnerships in the post-globalization era [7]

Group 1 - ASML will become the largest shareholder of French AI startup Mistral AI, investing €1.3 billion (approximately $1.5 billion) in a funding round of €1.7 billion (about $2 billion) to strengthen European tech sovereignty [1] - Mistral's pre-money valuation in the latest Series C funding round is €10 billion (approximately $11.7 billion), making it the highest-valued AI company in Europe post-funding [1] - Mistral is seen as a leading player in the French and European AI sector, competing with major US tech companies like OpenAI and Alphabet's Google [1] Group 2 - ASML's lithography equipment is crucial for advanced chip manufacturing, and the company utilizes AI to enhance the efficiency of its devices [2] - Mistral previously received investment from Nvidia and had a valuation exceeding $6 billion after its Series B funding round [2] - Mistral was founded in 2023 by former DeepMind and Meta researchers, and it is reportedly in discussions to raise $1 billion at a valuation of $10 billion [3]

Core Insights - The 13th Semiconductor Equipment and Core Components Exhibition (CSEAC) commenced on September 4 in Wuxi, Jiangsu, showcasing significant growth since its inception in 2021, expanding from a few dozen exhibitors to over 1,130 companies [1] - The exhibition attracted more than 100,000 attendees, a substantial increase from the initial 400-500 participants [1] - Major domestic companies such as Northern Huachuang, Shengmei Semiconductor, and Zhongwei Semiconductor participated, highlighting advancements in wafer manufacturing and packaging equipment [1] Company Highlights - Zhongwei Company launched six new semiconductor equipment products at CSEAC, covering critical processes such as plasma etching, atomic layer deposition, and epitaxy [1] - Shengmei showcased advanced packaging electroplating equipment and vertical furnace tube equipment, among others [1] - New Kai Lai, a semiconductor equipment "dark horse" established just four years ago, presented etching and ALD models at the exhibition [1]

Core Insights - A recent report from a well-known international investment institution indicates that China has a technological gap of approximately 20 years in advanced chip manufacturing compared to Western developed countries [1] - The report highlights a significant disparity in photolithography equipment manufacturing between China and the United States, identifying it as a major obstacle to producing high-end chips in China [1] Industry Summary - The most advanced photolithography equipment is developed and manufactured by European companies, which rely on core components from the United States, thus being affected by export controls [1] - Due to external restrictions, Chinese companies face difficulties in obtaining high-end photolithography equipment, directly impacting their research and mass production capabilities in advanced processes [1] - For instance, domestic major chip manufacturers are forced to use relatively outdated technologies to produce 7-nanometer chips, which not only affects production efficiency but also significantly increases manufacturing costs [1] Technology and Supply Chain - The manufacturing of high-end photolithography equipment involves a global supply chain, with key components primarily located in the US and Europe, indicating a substantial gap in China's self-sufficiency in this area [1] - Photolithography is a core technology that transfers chip design patterns onto silicon wafers, and high-end equipment enables finer line delineation, thereby enhancing overall chip performance [1] - After the pattern transfer, multiple processes such as etching, deposition, and cleaning are required to complete chip manufacturing, underscoring the irreplaceable role of photolithography equipment in the chip manufacturing process and its influence on the industry's advancement towards high-end development [1]

Core Insights - The article discusses the increasing domestic production rates of semiconductor equipment in China across various manufacturing segments, highlighting the growth potential and market size for 2024 [2][4]. Group 1: Market Size and Growth - The global market size for wafer manufacturing is projected to reach $60 billion in 2024, with various equipment segments showing significant growth in domestic production rates [2][4]. - The estimated market size for different semiconductor equipment segments includes: - Thermal processing equipment: $3.15 billion - Thin film deposition equipment: $25.63 billion - Etching equipment: $18.09 billion - Lithography equipment: $25.84 billion - CMP equipment: $2.98 billion - Cleaning equipment: $6.57 billion - Coating and developing equipment: $3.53 billion - Testing/measurement equipment: $14.25 billion [2]. Group 2: Domestic Production Rates - The domestic production rates for various equipment segments are as follows: - Thermal processing equipment: increased from ~11% in 2021 to ~23% in 2024 - Thin film deposition equipment: increased from ~5% in 2021 to ~19% in 2024 - Etching equipment: increased from ~11% in 2021 to ~28% in 2024 - CMP equipment: increased from ~18% in 2021 to ~40% in 2024 - Cleaning equipment: increased from ~26% in 2021 to ~32% in 2024 - Coating and developing equipment: increased from ~7% in 2021 to ~10% in 2024 - Testing/measurement equipment: increased from ~3% in 2021 to ~5% in 2024 [2][3]. Group 3: Key Domestic Companies - Major domestic companies involved in semiconductor equipment manufacturing include: - North Huachuang and Yitang Co. for thermal processing and etching equipment - Zhongwei Company and Tuo Jing Technology for thin film deposition equipment - Shengmei Shanghai and North Huachuang for cleaning equipment - Chip measurement and testing companies like Jingce Electronics and Zhongke Feimeng [2][3].

Core Insights - Canon is thriving in the semiconductor manufacturing equipment market, particularly with its Nano Imprint Lithography (NIL) technology, which is expected to bring a paradigm shift in optical lithography processes [1][34] - The semiconductor industry experienced a downturn in 2023 after a surge in 2022 due to COVID-19, but is projected to recover in 2024, with most equipment shipments expected to increase [1][9] - The market for front-end semiconductor manufacturing equipment is primarily dominated by European and American manufacturers, with significant market shares held by companies like ASML, Lam Research, and Applied Materials [2][6] Market Share and Trends - The market size for major equipment types exceeds $10 billion, with lithography equipment valued at $24.4 billion, primarily dominated by ASML (94.1% market share) [2][6] - Japan holds significant shares in several equipment categories, such as coating and developing equipment (94.5%) and vertical diffusion furnaces (82.2%), but these markets are relatively small [2][6] - Japan's market share in front-end equipment has been declining since 2011, with projections indicating a further drop to 21.7% by 2024, while the U.S. is expected to hold 44.3% and Europe 29.2% [9][11] Canon's Performance - Canon has shown strong performance in the lithography equipment sector, with its market share increasing from 14.5% in 2011 to an expected 32.7% by 2024, while Nikon's share has significantly declined [16][34] - Canon's strategy focuses on KrF and i-line technologies, where it has achieved a dominant market position, particularly in i-line with a projected share of 74.6% by 2024 [28][34] - The company is developing NIL technology, which offers a cost-effective and simpler method for creating fine patterns, potentially disrupting the current lithography market dominated by ASML [34] Future Outlook - If NIL technology is successfully implemented in semiconductor mass production, it could weaken ASML's dominance in EUV and ArF immersion technologies, positioning Canon to establish NIL as a new business pillar [34] - The NIL technology, while facing challenges related to defects from contaminants on masks, presents a lower-cost alternative compared to EUV systems, which are priced over 30.8 billion yen [34]

Group 1 - The global market size for wafer manufacturing equipment is projected to grow significantly from 2021 to 2024, with various equipment categories showing increasing domestic production rates [2] - The market for thermal processing equipment is expected to increase from $31.5 billion in 2021 to a domestic production rate of approximately 23% by 2024 [2] - The market for thin film deposition equipment is projected to grow from $256.3 billion in 2021, with a domestic production rate reaching around 19% by 2024 [2] Group 2 - The etching equipment market is anticipated to grow from $180.9 billion in 2021, maintaining a domestic production rate of 28% from 2023 to 2024 [2] - The photolithography equipment market is valued at $258.4 billion, with no specific domestic production rate data provided for the years 2021 to 2024 [2] - The chemical mechanical planarization (CMP) equipment market is expected to grow from $29.8 billion in 2021, with a domestic production rate projected to be around 40% by 2024 [2] Group 3 - The cleaning equipment market is projected to grow from $65.7 billion in 2021, with a domestic production rate expected to be approximately 32% by 2024 [2] - The photoresist coating and developing equipment market is expected to grow from $35.3 billion in 2021, with a domestic production rate of about 10% by 2024 [2] - The detection and measurement equipment market is valued at $142.5 billion, with a domestic production rate projected to reach 5% by 2024 [2]

Core Viewpoint - The Bay Area Semiconductor Industry Ecosystem Expo (Bay Chip Expo) will take place from October 15 to 17 at the Shenzhen Convention and Exhibition Center, focusing on technological innovation and transformation trends across the entire semiconductor industry chain, featuring over 600 quality semiconductor companies globally [2]. Exhibition Overview - The expo will cover an exhibition area of 60,000 square meters, with four main exhibition zones: wafer manufacturing, compound semiconductors, IC design, and advanced packaging [2]. - The wafer manufacturing zone is highlighted as one of the largest areas, showcasing key segments such as wafer manufacturing and IDM manufacturers, manufacturing equipment, advanced materials, components, and green factory facilities [2]. Exhibits and Participants - The exhibition will feature a wide range of equipment including lithography, etching, cleaning, coating, thin film deposition, ion implantation, polishing, thermal processing, measurement, and testing equipment [3]. - Notable exhibitors include TEL, KE, SCREEN, Hitachi, and Northern Huachuang, among others, who will present their latest technologies and solutions in wafer manufacturing [2][4]. Component and Material Focus - The expo will also showcase various materials such as wafers, electronic specialty gases, chemicals, photolithography materials, polishing materials, precursors, masks, and consumables [5]. - Key exhibitors in materials include Shanghai Silicon Industry, Yiswei Materials, and Jiangfeng, among others [5]. Forums and Discussions - The event will host several forums focusing on wafer manufacturing, semiconductor core components, integrated circuit materials, and international semiconductor equipment technology [9][12][13]. - Topics of discussion will include innovations in advanced etching equipment, semiconductor core component manufacturing processes, and the application of electronic gases in wafer manufacturing [16]. Additional Information - The event will also offer opportunities for networking and collaboration among industry participants, including decision-makers, marketing leaders, and technical innovation professionals [10].