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高通连续八年参展进博会,携手生态伙伴共建智能未来
Jing Ji Wang· 2025-11-06 09:06
随着汽车产业的发展,智能技术的应用边界在不断延伸。高通与奇瑞捷途携手,基于骁龙数字底盘,将智能网联汽车——纵横G700车型打造成一个移 动智能空间,支持多屏联动、复杂图形处理和AI功能。自2023年以来,在智能网联汽车领域,骁龙数字底盘已支持中国汽车品牌推出210多款车型。高通与 众多中国车企的合作,从数字座舱扩展至智能驾驶,协力推动中国汽车产业从"电动化"向"智能化"跃迁。 11月5日,第八届中国国际进口博览会在上海国家会展中心拉开帷幕。"全勤生"高通公司第八次如约而至,携手合作伙伴亮相进博会技术装备展区。今 年,高通展台以"我们一起 成就人人向前"为主题,展示了在前沿技术与协同创新赋能下,高通与中国产业"新朋老友"的最新合作成果。 高通公司中国区董事长孟樸表示:"连续八年参与进博会,从5G起步到如今5G与AI在多个领域的深度融合,进博会见证了高通在技术上的持续创新,也 展现了我们携手中国产业伙伴所取得的丰硕合作成果。今年,恰逢高通成立40年、进入中国30年,未来我们期待进一步扩大高通在中国的'朋友圈',通过持 续技术创新与生态合作,为中国创新生态注入更多活力。" 在本届进博会的高通展台上,参观者可以看到1 ...
高通:携手生态伙伴共建智能未来
高通公司中国区董事长孟樸表示:"连续八年参与进博会,从5G起步到如今5G与AI在多个领域的深度融 合,进博会见证了高通在技术上的持续创新,也展现了我们携手中国产业伙伴所取得的合作成果。今 年,恰逢高通成立40年、进入中国30年,未来我们期待进一步扩大高通在中国的'朋友圈',通过持续技 术创新与生态合作,为中国创新生态注入更多活力。" 11月5日,第八届进博会拉开帷幕。作为"全勤生"的高通公司携手合作伙伴亮相技术装备展区,展示了 在前沿技术与协同创新赋能下,高通与中国产业"新朋老友"的最新合作成果。 随着人工智能(AI)+连接赋能千行百业,智能应用从电子消费领域拓展至更多行业场景。今年2月发布的 全新品牌"高通跃龙",涵盖工业物联网、蜂窝基础设施和工业连接解决方案。据介绍,本次展台上的宇 树人形机器人、零售终端等,则是高通跃龙赋能行业的具体应用。 在孟樸看来,全球正处于新一轮科技革命和产业变革的关键节点。人工智能、5G、物联网、边缘计算 等前沿技术,正在深刻改变人们的生活方式、生产模式和社会结构。尤其是AI与5G、6G等技术的加速 融合,正推动各行各业迈向智能化、数字化的新阶段。 "从边缘智能到6G未来,从个人 ...
深圳国际电子展暨嵌入式展elexcon开幕,高通、瑞萨等企业嘉宾带来精彩分享!
半导体行业观察· 2025-08-27 01:33
Core Viewpoint - The 22nd Shenzhen International Electronics Exhibition and Embedded Exhibition (elexcon2025) focuses on "All for AI, All for Green," emphasizing embedded AI, edge computing, and related technologies to support industry development in the AI era [1][3]. Group 1: Event Overview - The exhibition features over 400 global exhibitors from the embedded and electronic technology sectors, including major companies like Qualcomm, Renesas, and NXP [8]. - The event includes more than 15 forums covering hot topics such as AI computing power, smart cockpits, and advanced packaging [8]. - The first day attracted over 10,000 professional visitors for networking and learning opportunities [8]. Group 2: Keynote Highlights - Qualcomm's product marketing director, Li Dalong, delivered a keynote on the role of AI, computing, and connectivity technologies in driving industry transformation, highlighting Qualcomm's new brand, "Qualcomm Leap Dragon," launched in February 2025 [3][5]. - The Leap Dragon product line includes industrial-grade products designed for extreme environments, capable of operating in temperatures from -40°C to 125°C, with a maximum AI performance of 100 TOPS [5]. Group 3: Industry Collaboration - Qualcomm has partnered with over 70 collaborators to create an IoT application case collection, showcasing more than 150 successful cases of Chinese companies expanding into overseas markets [6]. - The company aims to support Chinese enterprises in their international ventures through these successful case studies [6]. Group 4: Interactive Activities - The "Kaifa Gala" event attracted over 10,000 engineers for learning and interaction, featuring numerous new technology demos and free development boards provided by vendors [10].
高通连续三年参展链博会 以技术创新携手伙伴共筑智能互联未来
Huan Qiu Wang· 2025-07-16 10:45
Group 1 - Qualcomm showcased its cutting-edge technologies in various fields including 5G Advanced, AI, smartphones, PCs, automotive, XR, and IoT at the third China International Supply Chain Promotion Expo [1][3] - The company aims to deepen collaboration with Chinese partners, leveraging 5G-A and AI technologies to promote cross-industry and cross-regional ecosystem synergy [3][11] - Qualcomm's "Wireless Care" initiative provided 5G-A network services at the expo, utilizing 26GHz high-frequency spectrum to support high-bandwidth applications and seamless Wi-Fi coverage [3][6] Group 2 - In the PC sector, ASUS and Lenovo's AI PCs highlighted the capabilities of the Snapdragon X Elite platform, with over 85 AI PC devices launched and expectations to exceed 100 by next year [6] - The XR field featured products from Xiaomi, Thunderbird, Yingmu, and PICO, showcasing immersive experiences powered by Snapdragon platforms [6][7] - In the automotive sector, the Ideal MEGA vehicle, equipped with the fourth-generation Snapdragon cockpit platform, demonstrated advanced graphics processing and AI capabilities for enhanced user interaction [7][9] Group 3 - Qualcomm's new enterprise brand "Qualcomm Leap" was introduced, showcasing applications in robotics, industrial, agricultural, and retail sectors, highlighting the company's strengths in edge AI and low-power computing [9] - The company emphasizes the importance of open collaboration in the global supply chain and aims to continue deepening partnerships to achieve technological innovation and industry application integration [11]