公众号记得加星标⭐️，第一时间看推送不会错过。 8月26日，由博闻创意会展主办的 第22届深圳国际电子展暨嵌入式展（elexcon2025）在深圳 （福田）会展中心隆重开幕！ 作为中国电子与嵌入式技术领域的专业大展，本届展会以 "All for AI, All for Green" 为主题，聚 焦嵌入式AI与边缘计算、存储、功率半导体、电源、元器件以及SiP/先进封装等方向，旨在为AI时代 相关行业的发展提供全栈技术与供应链支持，也为工程师和技术决策者提供了绝佳的学习交流机会。 展会开幕当天同步举办了 2025第七届中国嵌入式技术大会。 作为嵌入式行业标杆年度大会，本届大 会邀请了高通、瑞萨、arm、NXP、雷赛智能、火山引擎等众多嵌入式领域重磅嘉宾，围绕嵌入式 AI、边缘AI、端测AI、具身智能等热门议题作主题演讲。 在软件层面，高通跃龙不仅支持零售、机器人等不同行业的多种操作系统和软件架构，还为长生命周 期产品的开发和运维提供支持。同时，高通还提供完整的开发方案和AI工具链，帮助客户迅速构建属 于自己的解决方案。 此外，李大龙强调，高通积极携手合作伙伴共建行业生态，已连续四年发布物联网应用案例集，与超 过 ...

Group 1 - Qualcomm showcased its cutting-edge technologies in various fields including 5G Advanced, AI, smartphones, PCs, automotive, XR, and IoT at the third China International Supply Chain Promotion Expo [1][3] - The company aims to deepen collaboration with Chinese partners, leveraging 5G-A and AI technologies to promote cross-industry and cross-regional ecosystem synergy [3][11] - Qualcomm's "Wireless Care" initiative provided 5G-A network services at the expo, utilizing 26GHz high-frequency spectrum to support high-bandwidth applications and seamless Wi-Fi coverage [3][6] Group 2 - In the PC sector, ASUS and Lenovo's AI PCs highlighted the capabilities of the Snapdragon X Elite platform, with over 85 AI PC devices launched and expectations to exceed 100 by next year [6] - The XR field featured products from Xiaomi, Thunderbird, Yingmu, and PICO, showcasing immersive experiences powered by Snapdragon platforms [6][7] - In the automotive sector, the Ideal MEGA vehicle, equipped with the fourth-generation Snapdragon cockpit platform, demonstrated advanced graphics processing and AI capabilities for enhanced user interaction [7][9] Group 3 - Qualcomm's new enterprise brand "Qualcomm Leap" was introduced, showcasing applications in robotics, industrial, agricultural, and retail sectors, highlighting the company's strengths in edge AI and low-power computing [9] - The company emphasizes the importance of open collaboration in the global supply chain and aims to continue deepening partnerships to achieve technological innovation and industry application integration [11]