Core Insights - The company conducted a specific institutional research meeting with 40 institutions, discussing various business developments and financial performance for the first half of 2025 [1] Group 1: PCB Business Performance - The PCB business saw revenue growth driven by demand for AI accelerator cards and increased market share in data centers, with significant contributions from 400G and above high-speed switches and optical modules [1][2] - The gross margin for the PCB segment improved due to increased revenue scale, high capacity utilization, and optimized product structure [1][2] Group 2: Packaging Substrate Business - The packaging substrate business generated a main revenue of 1.74 billion yuan, a year-on-year increase of 9.03%, but the gross margin decreased by 10.31 percentage points to 15.15% due to rising costs from raw materials and capacity ramp-up challenges [1] - The revenue growth in this segment was attributed to capturing opportunities in the domestic storage market [1] Group 3: Capacity Utilization and Expansion Plans - The overall capacity utilization for the PCB business is at a relatively high level due to increased demand in computing and automotive electronics [3] - New capacity is being added through technological upgrades at existing factories and the construction of new facilities in Nantong and Thailand, with the Nantong Phase IV project expected to be operational in Q4 2023 [3] Group 4: Guangzhou Packaging Substrate Project - The Guangzhou packaging substrate project is progressing with its first phase expected to be operational in Q4 2023, currently in the ramp-up stage with some bulk orders being fulfilled [4] Group 5: HDI Technology Application - The company possesses HDI technology capabilities, which enable high-density wiring for PCB products, particularly in mid-to-high-end applications within the communication sector [5] Group 6: Electronic Assembly Business Strategy - The electronic assembly business is positioned as a downstream segment of PCB manufacturing, focusing on communication and leveraging a one-stop platform to enhance customer value and loyalty [6]

Group 1 - The demand for high-end PCBs, such as AI servers and switches, is surging, driven by the release of Nvidia's GB200 and ASIC chips, which further stimulates industry growth [1] - The global AI server PCB market is expected to reach 19 billion yuan by 2025, with a compound annual growth rate (CAGR) exceeding 30% from 2023 to 2028 [1] - Domestic leading manufacturers, such as Shenyin Technology and Huitian Technology, are capturing market share due to their technological advantages, with some companies achieving capacity utilization rates exceeding 95% [1] Group 2 - Companies like Shenyin Electronics and Guanghua Technology are projected to see significant profit increases, with Shenyin Electronics' net profit expected to rise by 432%-471% year-on-year [2] - The demand for high-end PCBs is rapidly increasing due to AI computing power, leading to a notable supply-demand gap in AI PCBs this year [2] - CITIC Securities forecasts that the supply-demand ratio for global AI PCBs will be between 80% and 103% by 2026, indicating a tight supply situation [2] Group 3 - Kinsus Interconnect Technology's performance is expected to benefit from the recovery in copper-clad laminate demand, with price increases supporting its performance [3] - Kinsus Group is focusing on the entire PCB industry chain, developing a research center for copper-clad laminates and successfully creating various high-frequency and high-speed products for AI server GPU motherboards [3]