Summary of Key Points from Conference Call Industry Overview - The conference call focuses on the domestic AI computing power market and its growth, particularly in relation to Chinese companies and their advancements in AI chip technology [1][2][4]. Core Insights and Arguments - **Growing Demand for Domestic Computing Power**: There is a significant increase in demand for domestic AI applications, with major companies like ByteDance showing positive changes in multimodal video generation and other AI applications. Active user numbers and API call intensity are on the rise, indicating a sustained growth trend in domestic computing power demand [2][4]. - **Supply Chain Developments**: Domestic companies are increasingly adopting locally sourced supply chains for AI chips, which is expected to accelerate performance releases for related companies by 2026. The advancements in domestic manufacturing capabilities, including advanced process and packaging, are crucial for this trend [2][4]. - **New Chip Roadmaps**: Companies like Huawei have clear roadmaps for new chip releases, including the 950PR and 950DT in 2026 and the 960 chip in 2027, showcasing the continuous improvement in domestic chip capabilities [1][4]. - **Impact of Global Players**: The entry of OpenAI into the hardware market is significant, with plans to launch new products by 2026 and expectations of generating $50 billion in revenue by 2030. This move aims to retain user data, reduce cloud computing costs, and change human-computer interaction through new product forms like wearables and smart speakers [1][7][8]. Additional Important Insights - **Consumer Electronics Innovation**: The consumer electronics industry is expected to see a wave of innovation starting in 2025, with new products such as panoramic cameras, drones, and 3D printers emerging, driven by designer advantages and AI technology [1][11]. - **Investment Opportunities**: The domestic computing power sector is viewed positively for medium to long-term investments, with expectations of significant growth if supply chains are optimized and production capacities exceed expectations [4][5]. - **End-Side AI Hardware**: The end-side AI hardware market is gaining traction, with Meta's influence and improved sales of products like the iPhone 17 contributing to a favorable investment outlook [6][10]. - **Market Growth Projections**: The AI PCD market is projected to reach $7 billion by 2027, representing a 142% increase from 2026. This growth is driven by new technologies from companies like NVIDIA, which also presents investment opportunities for domestic hardware companies [3][15]. Conclusion - The domestic AI computing power market is poised for significant growth, driven by increasing demand from major companies, advancements in local chip manufacturing, and the entry of global players into the hardware space. The consumer electronics sector is also expected to innovate rapidly, creating further investment opportunities in the coming years [1][4][11].

Core Viewpoint - Huawei expresses confidence in providing sustainable and sufficient computing power for the long-term rapid development of artificial intelligence, leveraging its supernodes and clusters with the world's strongest computing capabilities [1][6]. Group 1: Chip Development - Huawei has announced the development progress of several self-developed chips, including the Ascend 950PR, 950DT, and Ascend 960 and 970, with the 950PR set to launch in Q1 2026 [1]. - The company is focusing on creating a "supernode + cluster" computing solution to meet the continuously growing demand for computing power, based on China's available chip manufacturing processes [3]. Group 2: Supernode Infrastructure - The supernode has become a new norm in AI infrastructure construction, with over 300 Cloud Matrix 384 supernodes deployed [3]. - Huawei has released the Atlas 950 SuperPoD and Atlas 960 SuperPoD supernodes, supporting 8192 and 15488 Ascend cards respectively, showcasing global leadership in key metrics such as card scale, total computing power, memory capacity, and interconnect bandwidth [5]. Group 3: Technological Innovations - Huawei has introduced the world's first general-purpose computing supernode, TaiShan 950 SuperPoD, which, combined with the GaussDB distributed database, aims to replace various large and small machines as well as Exadata database integrated machines [6]. - The company has overcome significant challenges in large-scale supernode interconnect technology, launching the UnifiedBus interconnect protocol, with plans to open the Lingqu 2.0 technology specifications in the future [6].

Core Viewpoint - Huawei's rotating chairman Xu Zhijun announced the evolution and goals of the Ascend chip series at the Huawei Connect Conference on September 18, highlighting the company's commitment to advancing its chip technology in the coming years [1] Group 1 - Over the next three years, Huawei has planned multiple Ascend chips, including the 950PR, 950DT, and Ascend 960 and 970 [1] - The 950PR chip is set to be launched in the first quarter of 2026 and will feature Huawei's self-developed HBM (High Bandwidth Memory) [1]

华为轮值董事长徐直军在华为全联接大会上首次公布昇腾芯片演进和目标。未来三年，华为规划昇腾多款芯片，包括950PR，950DT以及昇腾960和970。其中950PR将在2026年第一季度对外推出，采用华为自研HBM。（一财） https://t.co/LeLbac6UJo ...

Group 1 - Huawei's rotating chairman Xu Zhijun announced the evolution and goals of the Ascend chip series at the Huawei Connect Conference on September 18 [1] - Over the next three years, Huawei has planned multiple Ascend chips, including the 950PR, 950DT, and Ascend 960 and 970 [1] - The 950PR chip is set to be launched in the first quarter of 2026 and will utilize Huawei's self-developed HBM technology [1]