Group 1: Semiconductor Equipment Manufacturers - Companies in the semiconductor equipment sector reported smooth progress in product research and market introduction, indicating a positive outlook for future developments [1] - MicroNano's ALD (Atomic Layer Deposition) equipment has achieved industrial application in high-k materials and metal compound films, with increasing production scale [1] - New Yichang has successfully validated multiple wire bonding and testing packaging equipment, receiving market recognition and bulk orders [1] Group 2: Semiconductor Testing Equipment - YaoMai Technology is advancing in semiconductor testing equipment across three levels: silicon photonic wafer testing, IC carrier board testing, and MEMS sensor testing [2] - The silicon photonic testing equipment has been continuously delivered to overseas wafer fabs, while IC carrier board testing is in the prototype system testing phase [2] - MEMS sensor testing equipment has gained recognition from leading domestic clients, with incremental orders being secured [2] Group 3: Semiconductor Materials Manufacturers - Domestic semiconductor manufacturers are rapidly enhancing competitiveness, breaking the original global industry pattern, with expansion becoming a key focus for semiconductor materials companies [3] - ShenGong Co. plans to steadily expand production capacity for silicon components, which will drive growth in large-diameter silicon materials [3] - The company anticipates that internal demand for silicon components will actively drive growth, rather than relying solely on overseas recovery [3] Group 4: Production Expansion Plans - TianCheng Technology is expanding production capacity to meet increasing orders, planning to increase the capacity of its Jinshan plant from 30,000 tons to 40,000 tons annually [4] - A new plant in Zhuhai with an annual capacity of 30,000 tons is set to begin construction soon, targeting the South China PCB market [4] - A fully-owned subsidiary in Thailand is expected to complete a 30,000-ton plant by 2026, enhancing supply capabilities in Southeast Asia [4] Group 5: Revenue Growth Expectations - Longtu Photoresist's new products from its Zhuhai plant are expected to gradually ramp up production in the second half of the year, leading to significant year-on-year revenue growth [5] - The company aims to leverage capacity release in Zhuhai as a turning point for performance recovery through high-end process breakthroughs and customer structure upgrades [5] - Fangbang Co., as an electronic materials platform enterprise, anticipates positive performance growth with the gradual ramp-up of new products such as peelable copper and flexible copper-clad laminates [5]

本文约 5 0 0 0 字，推荐阅读时长 2 0 分钟，欢迎关注新财富公众号。 20世纪60年代，在"两弹一星"工程与"156项重点工程"宏大叙事之下，中国半导体制造设备的国产化征程悄然启动。 1965年，北京建中机器厂（国营700厂）的成立，标志着中国首次系统性布局半导体制造设备的研发。这座藏身于北京东郊的工厂，承载着突破西方技术 封锁的历史使命。在"自力更生"的号召下，国营706厂、707厂也相继落成，整体上形成覆盖单晶炉、扩散炉等原始设备体系。此后数十年间，这些国营 工厂不仅培养了中国首批半导体设备专业人才，更在真空设备、晶体生长技术等领域积累了原始技术储备。 2001年，北京电子控股有限责任公司（北京电控）对上述国营资产进行战略性整合，成立七星电子（北方华创前身），主营半导体设备及精密电子元器 件业务。同年，由北京电控联合国内高校等科研机构，共同出资设立北方微电子，专注于刻蚀机、CVD（化学气相沉积）和PVD（物理气相沉积）设备 研发。这种"制造+研发"的双轨架构，标志着中国半导体设备产业从分散走向集约化发展的开端。 0 1 新中国工业化探索的深刻烙印 中国半导体设备发展史上，2001-2010年，是 ...