证券日报网讯 1月22日，中天精装（002989）在互动平台回答投资者提问时表示，公司参股企业科睿斯 半导体科技（东阳）有限公司主营FCBGA高端封装基板业务，产品应用于TPU/CPU/GPU/AI芯片等高 算力芯片的封装，是HBM存储芯片的封装材料。目前科睿斯首款高端FCBGA封装基板样品已顺利完成 生产并交付入库，正推动客户检测与认证流程。公司持续关注和支持参股企业经营发展，如出现对外投 资重大进展、资本运作计划、对公司有重大影响的事项，将及时履行信息披露义务。 ...

（编辑 袁冠琳） 证券日报网讯 1月22日，中天精装在互动平台回答投资者提问时表示，科睿斯半导体科技（东阳）有限 公司系公司参股企业，穿透计算的持股比例合计为27.99%，不属于公司合并报表范围内企业。科睿斯 主营FCBGA高端封装基板业务，产品应用于TPU/CPU/GPU/AI芯片等高算力芯片的封装。目前科睿斯 首款高端FCBGA封装基板样品已顺利完成生产并交付入库，正推动客户检测与认证流程。公司将持续 关注和支持参控股企业经营发展，根据《深圳证券交易所股票上市规则》《公司章程》等相关规定及时 履行必要的信息披露义务。 ...

Core Viewpoint - The company Zhongtian Precision Decoration announced its involvement in a semiconductor packaging business through its equity stake in CoreSys Semiconductor Technology (Dongyang) Co., Ltd, which focuses on FCBGA high-end packaging substrates for high-performance chips [1] Group 1: Company Developments - CoreSys is set to launch its first phase of production in September 2025, focusing on packaging for TPU, CPU, GPU, and AI chips [1] - The company is currently in the process of creating samples for certain clients, with progress reported as smooth [1] - Zhongtian Precision Decoration will continue to monitor and support the operational development of its equity stake in CoreSys, committing to timely information disclosure regarding any significant external investment or capital operation plans that may impact the company [1]

Group 1 - The core viewpoint of the article is that Zhongtian Precision (002989) has announced its involvement in a semiconductor technology company, Kerius Semiconductor Technology (Dongyang) Co., Ltd., which specializes in high-end FCBGA packaging substrate business [1] - Kerius's products are applied in the packaging of high-performance chips such as TPU, CPU, GPU, and AI chips [1] - The first phase of the project is set to commence production in September 2025, and Kerius is currently in the process of prototyping for some clients, with progress reported to be smooth [1]

Core Viewpoint - Zhongtian Precision Decoration (002989) announced that its affiliated company, Core Semiconductor Technology (Dongyang) Co., Ltd., focuses on FCBGA high-end packaging substrate business, which is essential for high-performance chips like TPU, CPU, GPU, and AI chips [1] Group 1 - The project (Phase 1) is set to commence production on September 27, 2025, and is currently in the process of sampling for some clients, with all progress reported to be smooth [1] - Core Semiconductor's main business does not involve quantum technology [1]

Financial Performance - The company reported a cumulative revenue of 212 million yuan and a net loss of 62 million yuan for the first three quarters of 2025 [1] - Operating cash flow was 274 million yuan, with total assets at 2.358 billion yuan and net assets at 1.572 billion yuan as of the end of Q3 2025 [1] Business Strategy and Outlook - The company is maintaining its strategic focus on the semiconductor industry while stabilizing its decoration and renovation business [2][3] - There is confidence in achieving revenue targets for 2025, with no anticipated uncontrollable risks [2] - The company aims to enhance operational efficiency through organizational reforms and asset turnover improvements [2][3] Shareholder and Market Concerns - The company is actively managing its market value and is focused on maintaining shareholder rights amid stock price fluctuations [4][5] - There are no current plans for stock buybacks, but the company is committed to transparent communication regarding significant developments [4][5] Investments and Partnerships - The company has invested in several semiconductor-related firms, including a 27.99% stake in CoreSys Semiconductor Technology [8][9] - Ongoing projects include the FCBGA high-end packaging substrate project, which commenced production on September 27, 2025 [9][10] - The company is exploring further investments in the semiconductor sector to strengthen its business portfolio [6][10] Corporate Governance - The board of directors currently consists of 9 members, with one employee representative to be elected [3] - There are no disclosed plans for significant shareholding changes among major shareholders [5][6]

Core Viewpoint - Zhongtian Jingzhuang (002989.SZ) announced that its investee, Core Semiconductor Technology (Dongyang) Co., Ltd., has successfully launched the first phase of its FCBGA high-end packaging substrate project on September 27, 2025, which is intended for packaging high-performance chips used in CPUs, GPUs, AI, and automotive applications [1] Group 1 - The FCBGA project is aimed at high-performance chip packaging, indicating a strategic focus on advanced technology sectors [1] - The company will continue to monitor the operational developments of its investee and will fulfill its information disclosure obligations if there are significant investment progress or impactful events [1]