Group 1 - The high-end copper-clad laminate (CCL) market is experiencing structural opportunities due to the rapid increase in AI server shipments and the upgrade of ordinary server CCLs [1][2] - The demand for high-performance servers is continuously expanding, driven by the increasing number of layers required in server iterations and the growing need for high-speed CCLs [2][3] Group 2 - Electronic resin significantly impacts the performance of copper-clad laminates, with the focus on reducing dielectric loss by minimizing the content of polar functional groups in the resin [3] - Commonly used resins in high-end CCLs include biphenyl resin, polyphenylene ether resin, and hydrocarbon resin, with hydrocarbon resin being a key development focus due to its excellent properties [3] Group 3 - The dielectric performance of glass fiber and the polarization rate of its components are closely related, with companies adjusting glass formulations to balance electrical performance and processing difficulty [4] - The next generation of glass fiber is expected to use quartz fiber, which will significantly enhance properties but also increase processing difficulty [4]

Investment Rating - The report rates the industry as "Outperform" compared to the market, marking its first rating [2]. Core Insights - The printed circuit board (PCB) is widely used in the electronics field, with electrical performance being a key indicator for PCB iteration. It is referred to as the "mother of electronic products" [3]. - The demand for high-end copper-clad laminates (CCL) is driven by the rapid deployment of AI applications and increased capital expenditure by tech giants in AI servers. The shipment of AI servers is expected to rise significantly, with a notable increase in the number of CCL layers required for high-performance servers [3]. - Electronic resins play a crucial role in the performance of CCLs, with various types of resins being used, including biphenyl resin, polyphenylene ether resin, and hydrocarbon resin, the latter showing significant development potential [3]. - The properties of glass fiber and fillers significantly impact the characteristics of CCLs, with domestic companies expected to enter the supply chain rapidly [3]. - Investment recommendations highlight that Shengquan Group has successfully developed polyphenylene ether (PPO/PPE) resin and established a fully automated production line with a capacity of 1,300 tons per year [3]. Summary by Sections 1. PCB Industry Chain Overview - The PCB serves as a key electronic interconnection component, with its upstream primarily consisting of copper foil, glass fiber cloth, and resin. CCL is an important intermediate product in PCB manufacturing [9][12]. 2. High-End PCB Downstream Demand - The global AI infrastructure market is projected to grow from $27.94 billion in 2024 to $32.98 billion in 2025, with a compound annual growth rate (CAGR) of 18.01% from 2025 to 2033 [32]. - The shipment of AI servers is expected to reach 2.131 million units in 2025, reflecting a year-on-year growth of 27.6% [32]. - The demand for high-speed PCBs is increasing due to the high data transmission speed requirements of AI servers, with some high-end AI servers already utilizing M8-level CCLs [40]. 3. PCB Resins - Electronic resins are the only organic materials in CCL production that can be designed for specific properties, significantly affecting the dielectric performance and environmental stability of the boards [57][59]. - Commonly used resins include epoxy resin, cyanate ester resin, and hydrocarbon resin, with hydrocarbon resin currently being a hot development area due to its excellent properties [80]. 4. PCB Glass Fiber - Glass fiber is a key material in PCB manufacturing, with electronic-grade glass fiber being a high-end product that provides excellent thermal and chemical resistance [96]. - The report categorizes electronic cloth into high-end, mid-range, and low-end based on thickness and functionality, with specific applications tailored to different performance requirements [94][96].