Investment Rating - The report rates the industry as "Outperform" compared to the market, marking its first rating [2]. Core Insights - The printed circuit board (PCB) is widely used in the electronics field, with electrical performance being a key indicator for PCB iteration. It is referred to as the "mother of electronic products" [3]. - The demand for high-end copper-clad laminates (CCL) is driven by the rapid deployment of AI applications and increased capital expenditure by tech giants in AI servers. The shipment of AI servers is expected to rise significantly, with a notable increase in the number of CCL layers required for high-performance servers [3]. - Electronic resins play a crucial role in the performance of CCLs, with various types of resins being used, including biphenyl resin, polyphenylene ether resin, and hydrocarbon resin, the latter showing significant development potential [3]. - The properties of glass fiber and fillers significantly impact the characteristics of CCLs, with domestic companies expected to enter the supply chain rapidly [3]. - Investment recommendations highlight that Shengquan Group has successfully developed polyphenylene ether (PPO/PPE) resin and established a fully automated production line with a capacity of 1,300 tons per year [3]. Summary by Sections 1. PCB Industry Chain Overview - The PCB serves as a key electronic interconnection component, with its upstream primarily consisting of copper foil, glass fiber cloth, and resin. CCL is an important intermediate product in PCB manufacturing [9][12]. 2. High-End PCB Downstream Demand - The global AI infrastructure market is projected to grow from $27.94 billion in 2024 to $32.98 billion in 2025, with a compound annual growth rate (CAGR) of 18.01% from 2025 to 2033 [32]. - The shipment of AI servers is expected to reach 2.131 million units in 2025, reflecting a year-on-year growth of 27.6% [32]. - The demand for high-speed PCBs is increasing due to the high data transmission speed requirements of AI servers, with some high-end AI servers already utilizing M8-level CCLs [40]. 3. PCB Resins - Electronic resins are the only organic materials in CCL production that can be designed for specific properties, significantly affecting the dielectric performance and environmental stability of the boards [57][59]. - Commonly used resins include epoxy resin, cyanate ester resin, and hydrocarbon resin, with hydrocarbon resin currently being a hot development area due to its excellent properties [80]. 4. PCB Glass Fiber - Glass fiber is a key material in PCB manufacturing, with electronic-grade glass fiber being a high-end product that provides excellent thermal and chemical resistance [96]. - The report categorizes electronic cloth into high-end, mid-range, and low-end based on thickness and functionality, with specific applications tailored to different performance requirements [94][96].

Investment Rating - The report maintains a "Positive" outlook on the high-speed copper-clad laminate resin materials industry [5]. Core Viewpoints - The demand for high-speed resin materials is driven by the explosive growth of AI servers, which require advanced materials to meet higher electrical performance standards [7][10]. - Domestic resin manufacturers are positioned to capitalize on the opportunities presented by the AI server market, with companies like Dongcai Technology and Shengquan Group leading the way in high-end electronic resin production [3][11]. Summary by Sections 1. Introduction - The development of AI models necessitates high-performance hardware, leading to increased demand for advanced materials. Traditional epoxy resins are inadequate for the electrical performance required by AI servers, prompting the shift to low-dielectric resins such as BMI, PPO, and hydrocarbon resins [10][11]. 2. AI Server Volume and Upgrades - The global AI server shipment is projected to grow by approximately 46% in 2024, with further growth expected in 2025. This surge will drive demand for high-speed copper-clad laminates and, consequently, high-end electronic resins [12][29]. 2.1. Performance Requirements Driving Material Upgrades - AI servers require materials that minimize signal loss and energy dissipation, leading to a preference for low Dk and Df materials. The shift from traditional epoxy resins to advanced materials is essential for meeting these performance standards [15][22]. 2.2. Demand Space Estimation for High-Speed Resins - The estimated market size for high-speed resin materials is projected to reach around 3 billion yuan by 2026, driven by the increasing demand from AI servers and upgraded server platforms [28][29]. 2.3. Opportunities from Industry Concentration and Market Changes - The concentration of the copper-clad laminate industry in mainland China presents opportunities for domestic resin suppliers to enter and expand in the market, especially as the demand for high-speed laminates grows [31][32]. 3. High-End Electronic Resins with High Technical Barriers - The high-end electronic resin market is characterized by significant technical barriers, with leading companies in Japan and the US currently dominating the sector. However, domestic companies are making strides in developing competitive products [40][41]. 3.1. BMI Resins: Domestic Companies Making Progress - Domestic manufacturers like Dongcai Technology and Shengquan Group are advancing in the production of BMI resins, with significant capacity and growth projections [49][50]. 3.2. PPO Resins: Awaiting Demand from M7 and M8 High-Speed Boards - The development of PPO resins is crucial as demand for M7 and M8 high-speed boards increases, with domestic companies actively working on improving production capabilities [51][64].