证券日报网讯1月8日，华正新材（603186）在互动平台回答投资者提问时表示，公司多款高端覆铜板实 现量产并取得相应的营收，部分产品正在积极推进客户认证。 ...

华正新材在互动平台表示，公司多款高端覆铜板实现量产并取得相应的营收，部分产品正在积极推进客 户认证。 ...

证券日报网讯12月29日，美联新材（300586）在互动平台回答投资者提问时表示，公司控股孙公司辉虹 科技生产的EX电子材料即碳氢树脂材料是新一代的高传输率电子材料，数据传输速度快，信号损耗 低，在15GHz下的介电常数(Dk)为2.54，介电损耗(Df)为0.0006，性能指标达到国际领先水平，是生产高 端覆铜板(印制电路板的重要基础材料)的重要新材料，主要应用于高频覆铜板的电绝缘层，终端应用于 算力中心、机器人、智驾、通信领域及半导体芯片封装领域。 ...

您好，公司多款高端覆铜板实现量产并取得相应的营收，同时公司注重新产品研发，以研发能力打造作 为公司发展的核心推动力，积极布局技术前沿领域，公司拥有可在服务器、数据中心、交换机、光模块 等领域应用的全系列高速覆铜板产品。感谢您对公司的关注！ 查看更多董秘问答>> 免责声明：本信息由新浪财经从公开信息中摘录，不构成任何投资建议；新浪财经不保证数据的准确 性，内容仅供参考。 来源：问董秘 投资者提问： 您好！公司的高端覆铜板产品最高级别能到几级，是否进入了英伟达供应链？谢谢！ 董秘回答(华正新材SH603186)： ...

Group 1: Financial Performance and Market Position - The price of titanium dioxide has decreased while raw material costs, particularly sulfur, have increased significantly [2][3] - The gross profit margin for Meilian is only 11%, compared to over 20% for competitors Ningbo Color Masterbatch and Baolidi, indicating weaker profitability [2][3] - The company aims to enhance product competitiveness through the completion of the Dazhou project, which is expected to start trial production in September 2026 [3] Group 2: Project Developments and Strategic Partnerships - The Dazhou project benefits from local natural gas and sulfur resources, providing a cost advantage in titanium dioxide production [3] - The company has established a partnership with Starry Sodium Electric for a 10 billion yuan collaboration, focusing on sodium-ion battery projects [3][5] - The EX electronic materials have passed HBM stacking packaging verification, with applications primarily in overseas supply chains [4][6] Group 3: Production Capacity and Future Plans - The production capacity for EX electronic materials is currently 200 tons, with plans for expansion based on PCB industry developments [6][7] - The company is actively pursuing cost reduction and efficiency improvement strategies to enhance sales revenue in the second half of the year [6] - The new energy and polymer materials project in Xuanhan County is still under construction and has not yet generated trial production revenue [6][7] Group 4: Product Applications and Market Potential - The EX electronic materials are crucial for high-speed data transmission and are being applied in AI servers, communication fields, and semiconductor packaging [6] - The company’s Prussian blue cathode materials are progressing well, with plans for mass production and sales in the near future [6][7] - The EX materials have been successfully applied in NVIDIA's supply chain for AI servers [6][7]

Core Insights - The company reported a significant increase in both revenue and profit for the first half of 2025, with revenue reaching 2.095 billion yuan, a year-on-year growth of 7.88%, and net profit attributable to shareholders soaring by 327.86% to 42.669 million yuan [1] Group 1: Business Performance - The core business of copper-clad laminates (CCL) has been a key driver of revenue growth, with increased sales volume contributing to the overall performance [2] - The company is actively targeting high-end applications in AI servers and automotive electronics, leading to a notable increase in the sales proportion of high-end copper-clad laminates [2] - The company has successfully developed and sold low-loss materials for high-speed copper-clad laminates, which have gained recognition from major international chip manufacturers [2] Group 2: New Growth Areas - The semiconductor packaging materials business has emerged as a new growth highlight, with stable orders for BT packaging materials in various applications, promoting domestic substitution through cost-effective solutions [3] - The company is advancing the development of composite materials and film materials, achieving breakthroughs in medical equipment and expanding into new application areas such as energy storage and lightweight logistics [3] Group 3: R&D and Operational Efficiency - The company has increased its R&D investment to 94.87 million yuan, a year-on-year growth of 4.79%, focusing on high-end copper-clad laminates and semiconductor packaging materials [4] - The company is enhancing production and operational efficiency through digital upgrades and optimization of its SAP system, which supports cost control and efficiency improvements [4] - The company is planning a copper-clad laminate production base in Thailand with an investment of up to 60 million USD, aiming to expand its overseas market presence [4]

Core Viewpoint - Meilian New Materials (300586) has developed a new generation of high-frequency, high-speed, and high-transmission electronic materials through its subsidiary, Huihong Technology, which enhances data transmission speed and reduces signal loss [1] Group 1: Product Development - The EX electronic material, which is a type of polyolefin resin, is crucial for producing high-end copper-clad laminates (CCL), an essential material for printed circuit boards [1] - The new material is primarily used in the electrical insulation layer of high-frequency and high-speed copper-clad laminates [1] Group 2: Application Areas - The end applications of this new material include the robotics sector, indicating its potential in advanced technological fields [1]

Group 1 - The core viewpoint of the article highlights that Meilian New Materials' subsidiary, Huihong Technology, produces EX electronic materials, which are essential for high-end copper-clad laminates [2] - EX electronic materials are primarily used in the dielectric layer of high-frequency copper-clad laminates, indicating their significance in the PCB manufacturing process [2] - Copper-clad laminates are identified as a fundamental core material in PCB manufacturing, positioning EX electronic materials in the upstream segment of the PCB industry chain [2]

Core Viewpoint - Meilian New Materials announced that its subsidiary, Huihong Technology, produces EX electronic materials, which are a new generation of high-frequency, high-speed, and high-transmission-rate electronic materials [2] Company Summary - Huihong Technology's EX electronic materials, specifically polyolefin resin materials, enable faster data transmission and lower signal loss [2] - These materials are crucial for the production of high-end copper-clad laminates (CCL), which are essential for printed circuit boards [2] - The primary applications of these materials include high-frequency and high-speed copper-clad laminates' electrical insulation layers, with end uses in computing centers, robotics, intelligent driving, communication fields, and semiconductor chip packaging [2]

Group 1 - The high-end copper-clad laminate (CCL) market is experiencing structural opportunities due to the rapid increase in AI server shipments and the upgrade of ordinary server CCLs [1][2] - The demand for high-performance servers is continuously expanding, driven by the increasing number of layers required in server iterations and the growing need for high-speed CCLs [2][3] Group 2 - Electronic resin significantly impacts the performance of copper-clad laminates, with the focus on reducing dielectric loss by minimizing the content of polar functional groups in the resin [3] - Commonly used resins in high-end CCLs include biphenyl resin, polyphenylene ether resin, and hydrocarbon resin, with hydrocarbon resin being a key development focus due to its excellent properties [3] Group 3 - The dielectric performance of glass fiber and the polarization rate of its components are closely related, with companies adjusting glass formulations to balance electrical performance and processing difficulty [4] - The next generation of glass fiber is expected to use quartz fiber, which will significantly enhance properties but also increase processing difficulty [4]