半导体迈入2纳米制程世代之际，业界传出，三星近期喊出2纳米报价每片2万美元（约新台币60万 元），比台积电（2330）牌价3万美元（约新台币90万元）便宜33%，相当于打六七折抢市，争取英伟 达、高通、特斯拉等大厂下单，要挖台积电墙脚。 特斯拉已于7月宣布，与三星签署价值22.8兆韩元（约165亿美元、新台币5,000亿元）的长期芯片供应合 约，将透过三星第二代2纳米制程，生产特斯拉AI6芯片，用于全自动驾驶（FSD）系统与资料中心，这 笔订单被外界视为三星试图借助新制程，在高速运算领域PK台积电的关键一役。 另外，三星也积极布建美国2纳米产能，预计明年底月产能将达1.6万至1.7万片，争取更多美系客户下 单。 面对三星来势汹汹，台积电2纳米将如期在2025下半年进入量产。台积电先前透露，2纳米量产曲线与3 纳米相似，在持续强化的策略下，台积电也推出2纳米家族延伸的N2P制程技术，具备更佳的效能及功 耗优势，为智慧手机高速运算应用提供支持，预计2026下半年量产。 台积电2纳米将如期于下半年量产，手握苹果、超微、联发科、高通等大客户订单，涵盖智慧手机芯片 和电脑中央处理器（CPU）等高速运算领域。三星目前2纳 ...

Core Viewpoint - The article highlights the challenges faced by TSMC in establishing a semiconductor manufacturing facility in Arizona, emphasizing regulatory hurdles that may limit its production capacity to only 7% of the U.S. semiconductor needs [3]. Group 1: TSMC's Arizona Facility - U.S. Treasury Secretary warned that TSMC's $40 billion facility in Arizona may only produce 7% of the U.S. semiconductor requirements due to local regulatory challenges [3]. - The construction of the facility is reportedly slowed down by regulatory obstacles, which complicate the building process [3]. - TSMC plans to have its second factory operational by 2027, with 30% of its advanced 2nm capacity expected to come from this Arizona facility [3]. Group 2: TSMC's Advanced Process Technology - TSMC is set to begin mass production of its 2nm process technology in the second half of this year, with expectations that the design tape-outs will exceed those of the 3nm and 5nm processes in the first two years [4]. - The 2nm process technology offers a 10% to 15% speed increase at the same power consumption or a 25% to 30% reduction in power consumption at the same speed, with a chip density increase of over 15% [4]. - Future plans include the introduction of the N2P process technology, which will provide better performance and power efficiency, scheduled for mass production in the second half of 2026 [4]. Group 3: Upcoming Process Developments - TSMC's roadmap includes the A16 process, which will enhance speed by 8% to 10% at the same power consumption or reduce power consumption by 15% to 20% at the same speed, with a chip density increase of 7% to 10% [5]. - The A16 process is designed for high-performance computing (HPC) products and is expected to enter mass production in the second half of 2026 [5].