Core Viewpoint - In 2024, TSMC has solidified its position as a leader in the semiconductor industry, driven by the explosive demand for AI-related chips, achieving significant growth in revenue and profitability while expanding its global strategic footprint [1][2][3]. Financial Performance - TSMC's consolidated revenue for 2024 reached $90 billion, a 30% increase year-on-year, with a net profit of $36.5 billion, reflecting a substantial growth of 35.9% [2]. - The gross margin was reported at 56.1%, and the operating margin reached 45.7%, both marking historical highs for the company [2]. Market Position and Client Base - TSMC holds a 34% market share in the IDM 2.0 industry, up from 28% in 2023, reinforcing its leadership in the foundry sector [2]. - The company provided 288 different process technologies to 522 clients, producing 11,878 different products, showcasing a highly diversified client base [3]. Product and Technology Development - Revenue from advanced processes of 7nm and below increased to 69%, significantly higher than the previous year's 58%, driven by demand in AI and high-performance computing [3]. - TSMC's revenue distribution by product platform shows high-performance computing products accounting for 51%, smartphones 35%, IoT 6%, automotive electronics 5%, and consumer electronics 1% [4]. Global Capacity Expansion - TSMC has established four GIGAFAB fabs in Taiwan, with an annual capacity exceeding 12.74 million 12-inch wafers, covering multiple technology nodes from 0.13 microns to 3 nanometers [13]. - The company has also made significant progress in its global manufacturing footprint, including a new fab in Arizona, USA, and a special process fab in Kumamoto, Japan [13][14]. Research and Development - TSMC invested 7.1% of its revenue in R&D in 2024, leading the foundry sector and surpassing many international tech giants [16]. - The company made key advancements in its 2nm platform, completing process definitions and entering yield improvement stages [16]. Advanced Packaging and Integration Technologies - TSMC's TSMC 3DFabric technology platform is crucial for performance enhancement in the post-Moore's Law era, focusing on system integration and advanced packaging solutions [17]. - The CoWoS technology family has been widely adopted in high-performance computing markets, particularly for integrating SoCs and high-bandwidth memory [19]. Emerging Technologies - TSMC is actively exploring new materials and extreme miniaturization techniques, including breakthroughs in carbon nanotube transistors and two-dimensional materials for future logic devices [23][24]. - The company is also developing new storage components optimized for AI edge devices, showcasing a commitment to innovation in high-density and energy-efficient storage solutions [25].

如果您希望可以时常见面，欢迎标星收藏哦~ 2024年，AI引发的芯片需求全面爆发，半导体产业结构性转型持续演进。在这一年，台积电 再次交出了一份亮眼答卷：不仅巩固了其技术领先地位，还在产能、营收、客户结构与全球 战略布局方面全面开花，成为当前全球最具战略纵深的半导体企业。 透过其刚刚发布的2024年年报，我们可以更清晰地看到：在这场以AI为主引擎的产业变革 中，台积电正以技术为根基、制造为核心、生态为延伸，持续构筑属于自己的"护城河"。 AI爆发年，台积电"稳稳赢麻" 2024年，尽管全球经济仍充满不确定性，传统消费电子市场复苏缓慢，但AI相关芯片的需求却持 续强劲，推动晶圆代工行业走出低谷，重回成长轨道。台积电成为最大受益者之一。 年报显示，2024年台积电全年合并营收达900亿美元，同比增长30%；税后净利达365亿美元，同 比大幅增长35.9%。毛利率达到56.1%，营业利益率达45.7%，皆创历史新高。 作为全球晶圆代工产业的龙头，台积电已经在业内建立起不可动摇的地位。台积电在IDM 2.0产业 （包括了封装、测试和光罩制造等更多环节）中 占据34%的市场份额 ，较2023年的28%显著提 升，进一步 ...