Group 1 - The A-share market saw all three major indices rise, with the Shanghai Composite Index increasing by 0.37%, driven by gains in sectors such as computers, media, and non-ferrous metals, while banks and conglomerates experienced declines [1] - The chip technology sector showed strong performance, with the Chip ETF (159995.SZ) rising by 1.23%, and notable increases in component stocks such as Haiguang Information (+5.76%), Longxin Zhongke (+5.08%), and Lanke Technology (+3.47%) [1] Group 2 - NVIDIA's founder and CEO Jensen Huang announced the launch of the Rubin platform at CES 2026, which consists of six new chips designed for building extraordinary AI supercomputers, including VeraCPU, RubinGPU, and NVLink6 switch [3] - According to Cinda Securities, the launch of the Rubin platform marks a new era in AI computing power, with a complete transformation of global computing facilities towards the "AI factory" paradigm [3] - The Rubin platform's collaborative design is expected to significantly enhance performance, with potential increases in value across multiple segments such as computing power, storage, and infrastructure investment [3] - The Chip ETF (159995) tracks the National Chip Index, comprising 30 leading companies in the A-share chip industry, including SMIC, Cambricon, and Changdian Technology [3]

Group 1 - The humanoid robot industry is expected to enter a sales growth phase, with significant developments anticipated in 2026 as the design and structure of humanoid robots converge from their current diversity [2] - Tesla's Optimus 3 is projected to become a global reference point once launched, with the industry moving towards more standardized designs [2] - By the end of 2025, humanoid robots are expected to be finalized for specific factory applications, leading to increased sales as the industry matures and prices decline [2] Group 2 - NVIDIA is requesting suppliers to develop a new microchannel liquid cooling plate (MLCP) technology due to the high power consumption of its AI platforms, which may exceed 2000W [3] - The MLCP technology integrates the metal cover on the chip with a liquid cooling plate, improving heat dissipation efficiency and reducing size [3] - The expected thermal power of the Rubin GPU has increased from 1.8kW to 2.3kW, necessitating the introduction of MLCP by mid-2026 to maintain cooling efficiency [3]