Core Viewpoint - Hanmi Semiconductor reported a significant increase in revenue and operating profit for Q2, driven by the sales growth of its key equipment, the Thermal Compression (TC) Bonder, which is essential for high bandwidth memory (HBM) production [2]. Group 1: Financial Performance - In Q2, Hanmi Semiconductor achieved a consolidated revenue of 180 billion KRW, representing a year-on-year growth of 45.8% [2]. - The operating profit reached 86.3 billion KRW, marking a 55.7% increase, with an operating profit margin of 47.9% [2]. Group 2: Investment and Expansion Plans - The company plans to invest 100 billion KRW in hybrid bonding technology and aims to launch hybrid bonding equipment by the end of 2027 [2]. - Hanmi Semiconductor will construct a hybrid bonding machine factory in Incheon, with an investment of 100 billion KRW, expected to be completed by the second half of next year [2]. Group 3: Product Development - Hanmi Semiconductor has commenced production of the TC Bonder 4, designed for the sixth generation of HBM (HBM4), which offers a 60% performance improvement over HBM3E while consuming only 70% of its power [3]. - The new TC Bonder 4 can stack up to 16 layers of DRAM chips, increasing the capacity from 24 GB to 32 GB per chip [3]. - The company has established a mass production system for TC Bonder 4 to support global memory manufacturers in launching HBM4 [3]. Group 4: Team Formation - A specialized team named "Silver Phoenix" has been formed, consisting of over 50 experienced engineers to support the customization, maintenance, and optimization of the TC Bonder 4 system [4].

如果您希望可以时常见面，欢迎标星收藏哦~ 2024年，HBM成为半导体产业最炙⼿可热的产品之⼀。 随着AI⼤模型和⾼性能计算的狂飙突进，英伟达等巨头对HBM的需求⽔涨船⾼，内存⼚的HBM订 单早已售卖⼀空，尤其是SK海⼒⼠，其在HBM市场占有率⾼达70%，更是赚得盆满钵满。 然⽽，就在这股浪潮背后，名为"TCB（Thermal Compression Bonding）键合机"的设备， 正在悄然决定HBM产业链的上限，不论是SK海⼒⼠，还是美光三星，都在过去⼀年时间⾥加⼤了 设备⽅⾯的投⼊，也让更多设备⼚商有机会吃上这波AI红利。 什么是TCB？ 先来了解⼀下⽬前HBM芯⽚的键合技术。在传统的倒装芯⽚键合中，芯⽚被"翻转"，以便其焊 料凸块（也称为 C 凸块）与半导体基板上的接合焊盘对⻬。整个组件被放置在回流炉中，并根据 焊料材料均匀加热⾄ ºC-ºC 左右。焊料凸块熔化，在接合和基板之间形成电⽓互连。 随着互连密度的增加和间距缩⼩到 µm 以下，倒装芯⽚⼯艺⾯临⼀些挑战。由于整个芯⽚封装 都放⼊烤箱中，芯⽚和基板会因热量⽽以不同的速率膨胀（即不同的热膨胀系数，CTE），从⽽产 ⽣变形，导致互连出现故障。然后， ...