Core Viewpoint - The semiconductor equipment manufacturer DISCO is experiencing significant growth driven by the increasing demand for precision processing equipment, particularly due to the rise of generative AI and high-bandwidth memory (HBM) technology [1][2][3]. Group 1: DISCO's Performance - DISCO's non-consolidated shipment amount for the first quarter of fiscal year 2025 is expected to reach 93 billion yen, marking an 8.5% year-on-year increase and achieving the fifth consecutive quarter of growth [1][2]. - The company has revised its revenue forecast for the first quarter of fiscal year 2025 from 75 billion yen to 89.9 billion yen, reflecting a 19.9% increase [5][6]. - The operating income forecast has been adjusted from 23.8 billion yen to 34.5 billion yen, indicating a 44.9% increase [6]. Group 2: HBM and AI Demand - HBM technology is crucial for the development of generative AI, as it meets the need for rapid data access and storage, thus driving the sales of semiconductor manufacturing equipment [3][9]. - The demand for HBM is not only benefiting DISCO but also numerous semiconductor backend equipment manufacturers, showcasing significant market potential [3][9]. Group 3: Industry Trends - The global market for TCB (Thermal Compression Bonding) equipment used in HBM packaging is projected to grow from approximately $460 million in 2024 to over $1.5 billion by 2027, with a compound annual growth rate exceeding 50% [33][34]. - Companies like Hanmi Semiconductor and ASMPT are emerging as key players in the HBM TCB equipment market, with Hanmi Semiconductor achieving record sales and significant profit growth [34][35]. - The competitive landscape is evolving, with multiple companies, including K&S and Zeus, also making strides in the HBM equipment sector, indicating a shift from a single dominant player to a more diversified market [43][52].

Core Viewpoint - The semiconductor equipment manufacturer DISCO is experiencing significant growth driven by the increasing demand for high-bandwidth memory (HBM) due to the rise of generative AI, with a record shipment amount expected in the first quarter of fiscal year 2025 [1][3][4]. Group 1: DISCO's Performance and Market Position - DISCO's non-consolidated shipment amount for the first quarter of fiscal year 2025 is projected to reach 93 billion yen, marking an 8.5% year-over-year increase and surpassing the previous record of 90.8 billion yen in the third quarter of fiscal year 2024 [1][2]. - The company has revised its revenue forecast for the first quarter of fiscal year 2025 from 75 billion yen to 89.9 billion yen, indicating a 19.9% increase, and its operating income forecast has been adjusted from 23.8 billion yen to 34.5 billion yen, reflecting a 44.9% increase [4][5]. - DISCO holds a 20% market share in the advanced packaging sector, benefiting from strong demand for precision processing equipment [4]. Group 2: HBM Technology and Its Impact - HBM is identified as a key technology supporting the development of generative AI, with its high bandwidth and low power consumption making it essential for rapid data access [3][8]. - The demand for HBM is not only benefiting DISCO but also driving significant revenue growth for various semiconductor equipment manufacturers, indicating a robust market potential [3][8]. - The rise of HBM technology is pushing semiconductor manufacturers to adopt advanced packaging techniques, such as 3D stacking, to meet the performance and efficiency demands of AI applications [8][12]. Group 3: Industry Trends and Future Outlook - The global market for TCB (thermal compression bonding) equipment used in HBM packaging is expected to grow rapidly, with projections indicating an increase from approximately $460 million in 2024 to over $1.5 billion by 2027, reflecting a compound annual growth rate of over 50% [32]. - Companies like Hanmi Semiconductor and ASMPT are emerging as key players in the TCB market, with Hanmi Semiconductor reporting a 252% increase in sales and a significant order from Micron for TCB machines [33][45]. - The competitive landscape is evolving, with multiple companies, including K&S and ASMPT, actively developing advanced packaging technologies to capitalize on the growing demand for HBM and AI applications [53][45].

申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 2024年，HBM成为半导体产业最炙手可热的产品之一。 随着AI大模型和高性能计算的狂飙突进，英伟达等巨头对HBM的需求水涨船高，内存厂的HBM订单早 已售卖一空，尤其是SK海力士，其在HBM市场占有率高达70%，更是赚得盆满钵满。 然而，就在这股浪潮背后，名为"TCB（Thermal Compression Bonding）键合机"的设备，正在悄然决定 HBM产业链的上限，不论是SK海力士，还是美光三星，都在过去一年时间里加大了设备方面的投入， 也让更多设备厂商有机会吃上这波AI红利。 什么是TCB？ 先来了解一下目前HBM芯片的键合技术。在传统的倒装芯片键合中，芯片被"翻转"，以便其焊料凸块 （也称为 C4 凸块）与半导体基板上的接合焊盘对齐。整个组件被放置在回流炉中，并根据焊料材料均 匀加热至 200ºC-250ºC 左右。焊料凸块熔化，在接合和基板之间形成电气互连。 随着互连密度的增加和间距缩小到 50µm 以下，倒装芯片工艺面临一些挑战。由于整个芯片封装都放入 烤箱中，芯片和基板会因热量而以不同的速率膨胀（即不同的热膨胀系数，CTE），从而产 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 2024年，HBM成为半导体产业最炙⼿可热的产品之⼀。 随着AI⼤模型和⾼性能计算的狂飙突进，英伟达等巨头对HBM的需求⽔涨船⾼，内存⼚的HBM订 单早已售卖⼀空，尤其是SK海⼒⼠，其在HBM市场占有率⾼达70%，更是赚得盆满钵满。 然⽽，就在这股浪潮背后，名为"TCB（Thermal Compression Bonding）键合机"的设备， 正在悄然决定HBM产业链的上限，不论是SK海⼒⼠，还是美光三星，都在过去⼀年时间⾥加⼤了 设备⽅⾯的投⼊，也让更多设备⼚商有机会吃上这波AI红利。 什么是TCB？ 先来了解⼀下⽬前HBM芯⽚的键合技术。在传统的倒装芯⽚键合中，芯⽚被"翻转"，以便其焊 料凸块（也称为 C 凸块）与半导体基板上的接合焊盘对⻬。整个组件被放置在回流炉中，并根据 焊料材料均匀加热⾄ ºC-ºC 左右。焊料凸块熔化，在接合和基板之间形成电⽓互连。 随着互连密度的增加和间距缩⼩到 µm 以下，倒装芯⽚⼯艺⾯临⼀些挑战。由于整个芯⽚封装 都放⼊烤箱中，芯⽚和基板会因热量⽽以不同的速率膨胀（即不同的热膨胀系数，CTE），从⽽产 ⽣变形，导致互连出现故障。然后， ...