据了解，该系统采用ACM专利申请保护的水平电镀技术，并支持铜、镍、锡银及金等多材质电镀工 艺。其中，铜电镀腔体配备了专为高凸柱应用设计的高速电镀桨叶，能够实现超过300微米的凸柱高 度。Ultra ECP ap-p设备采用四边密封干式接触卡盘以提升可靠性，配备电镀腔内清洗功能以最大限度 减少不同电镀腔之间的化学交叉污染，并采用水平电镀设计——通过同步旋转卡盘与旋转矩形电场实现 卓越的膜厚均匀性。 今日，盛美上海宣布，已向领先的面板制造客户成功交付首台面板级先进封装电镀设备Ultra ECP ap- p。 据介绍，Ultra ECP ap-p是面向大面板市场的首台商用面板级铜电镀系统，支持凸柱、凸块和再分布层 （RDL）工艺中的电镀环节。该系统实现了可与传统圆形晶圆工艺相媲美的面板处理性能，使制造商能 够更加高效地满足严苛的器件要求。 盛美上海总经理王坚表示："成功交付Ultra ECP ap-p订单彰显了凭借差异化创新，我们有能力提供高性 能面板电镀解决方案，以帮助客户加速推进扇出型面板级封装技术蓝图，同时巩固我们在先进封装生态 体系里的重要地位。随着市场对新一代器件需求的增长，面板级封装提供了大规模生产所需 ...

Group 1: Technology Developments - Alibaba's Tongyi team has open-sourced three major models, including Qwen3-Omni, Qwen3-TTS, and Qwen-Image-Edit-2509, enhancing capabilities in multimodal processing and voice generation [2] - Wayve, a UK autonomous driving startup, confirmed Nvidia's intention to invest up to $500 million (approximately 3.6 billion RMB) in its next funding round, marking a significant investment in the autonomous driving sector [3] - Zhiyuan Robotics has open-sourced the GO-1 model, the first general-purpose embodied intelligence model using the ViLLA architecture, improving task understanding and execution capabilities [4] Group 2: Corporate Changes and Investments - Lei Jun, founder of Xiaomi, explained the delay of the annual speech to September, aligning it with the launch of the Xiaomi 17 series flagship [5] - Wan Biao, former vice chairman of Honor, has been appointed as the global CEO of AESC, a battery technology company, indicating a strategic upgrade and global expansion for the company [8] - Zhejiang Xiantong plans to invest 40 million RMB in Haohai Starry Sky to establish a joint venture for robot production, aiming to enhance its business in the robotics sector [22] Group 3: Financial Activities - YF Communication announced a share buyback plan of 75 million to 150 million RMB, intending to reduce registered capital [13] - Zhongwei Company plans to establish a semiconductor fund with a target size of 1.5 billion RMB, focusing on semiconductor and emerging strategic fields [14] - Shanghai Zhanxin Technology completed a C-round financing exceeding 1 billion RMB, aimed at expanding its silicon carbide production capacity and enhancing product competitiveness [21]

Group 1 - Alibaba's Tongyi team has open-sourced three major models, including Qwen3-Omni, Qwen3-TTS, and Qwen-Image-Edit-2509, enhancing capabilities in multimodal processing and image editing [2] - Wayve, a UK autonomous driving startup, confirmed Nvidia's intention to invest up to $500 million (approximately 3.6 billion yuan) in its next funding round, marking a significant investment in the autonomous driving sector [3] - Zhiyuan Robotics announced the open-sourcing of its GO-1 model, the first general-purpose embodied intelligence model using the ViLLA architecture, improving task understanding and execution for robots [4] Group 2 - Xiaomi's founder Lei Jun explained the delay of the annual speech, which was pushed from June to September to coincide with the launch of the Xiaomi 17 series [5] - AESC appointed Wan Biao, former Vice Chairman of Honor, as the global CEO, indicating a strategic upgrade and global expansion for the battery technology company [8] - Mercedes-Benz and ByteDance have formed a strategic partnership to accelerate the integration of AI technologies across various business areas, with a new electric vehicle model set to launch soon [8] Group 3 - BOSS Zhipin reported on its efforts to combat inappropriate job postings and harassment, having banned 2,000 accounts in a recent crackdown [12] - YF Communication announced a plan to repurchase shares worth between 75 million and 150 million yuan, with a maximum repurchase price of 40.53 yuan per share [13] - Zhongwei Company plans to establish a semiconductor fund with a target size of 1.5 billion yuan, focusing on semiconductor and emerging strategic sectors [14] Group 4 - MediaTek expressed intentions to utilize TSMC's Arizona facility for chip production, responding to U.S. customer demands and potential semiconductor tariffs [15] - Shengmei Shanghai delivered its first KrF process front-end coating and developing equipment to a leading logic wafer manufacturer in China [16] - Visionox announced a project investment of approximately 5 billion yuan for a new display industry innovation center in Kunshan [17] Group 5 - Chuling Information disclosed indirect holdings of approximately 0.0229% in Moer Thread through its investment in a fund focused on digital economy [18] - Dongshan Precision is planning to issue H-shares and list on the Hong Kong Stock Exchange to enhance its international presence [19] - Avita Technology is preparing to submit its IPO application to the Hong Kong Stock Exchange in Q4, aiming for a listing in Q2 of the following year [20] Group 6 - Shanghai Zhanchin Electronics completed its C-round financing, raising over 1 billion yuan to expand its silicon carbide production capacity and enhance product competitiveness [21] - Zhejiang Xiantong plans to invest 40 million yuan in Haohai Starry Sky to establish a joint venture for robot manufacturing [22] - Hualing Cable intends to acquire control of San Zhu Intelligent for up to 270 million yuan, aiming to enhance its capabilities in robotics and high-frequency transmission [23] - Jinzi Ham's subsidiary plans to invest up to 300 million yuan in Zhongzheng Microelectronics, focusing on the optical module sector [24] - Xingmai Innovation secured 1 billion yuan in financing to enhance technology development and expand global sales channels [25]