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鲁股观察 | 山东资本市场2025半年报:硬科技特色、青睐港股
Xin Lang Cai Jing· 2025-07-10 08:29
文 | 周涛 2025年上半年,中国IPO市场在经历阶段性调整后迎来复苏曙光。截至6月末,A股与港股合计新增上市 公司94家,其中,A股共有51只新股上市,首发募集资金规模达373.55亿元,与2024年相比,新股数量 同比增加约16%,融资总额同比增加约15%。 94家新增上市公司中,山东贡献3家——威高血净(603014.SH)、新恒汇(301678.SZ)两家公司登陆 A股,南山铝业国际(02610.HK)则挺进了港股。 值得一提的是,山东目前仍有多家公司处于发行排队期,另有8家公司向港交所递交上市申请,资本市 场的"山东板块"正加速扩容。 硬科技鲁企上市突围 5月19日,山东威高血液净化制品股份有限公司(以下简称"威高血净",股票代码:603014.SH)正式登 陆上交所主板,发行价26.5元/股,募资10.9亿元。 截至5月19日收盘,公司股价报41.41元/股,较发行价26.5元上涨56.26%,总市值达170.36亿元,盘中最 高触及49.99元,市值一度突破200亿元。威高血净的上市,标志着国产替代战略在医疗领域的深化,也 为投资者开辟了新的增长赛道。 在当前IPO整体节奏放缓的背景下,威高血 ...
新恒汇收盘下跌4.17%,滚动市盈率67.02倍,总市值123.85亿元
Jin Rong Jie· 2025-07-04 10:33
从行业市盈率排名来看,公司所处的半导体行业市盈率平均100.04倍,行业中值67.24倍,新恒汇排名第 106位。 7月4日,新恒汇今日收盘51.7元,下跌4.17%,滚动市盈率PE(当前股价与前四季度每股收益总和的比 值)达到67.02倍,总市值123.85亿元。 资金流向方面,7月4日,新恒汇主力资金净流出5792.08万元,近5日总体呈流出状态,5日共流出 23903.13万元。 新恒汇电子股份有限公司的主营业务是芯片封装材料的研发、生产、销售与封装测试服务。公司的主要 产品是智能卡业务、蚀刻引线框架、物联网eSIM芯片封测。发行人拥有一批经验丰富的研发及生产团 队,主持制订了"集成电路(IC)卡封装框架"国家标准(GB/T39842-2021);发行人是"中国半导体行 业协会金融安全IC卡芯片迁移产业促进联盟"成员单位,曾荣获党政机要密码科学技术进步奖励评审委 员会颁发的"金融领域国产密码技术研究与应用示范科技进步一等奖(省部级)";发行人"超大规模集 成电路用高精度引线框架研发及产业化项目"入选2019年度山东省重点研发计划,"高精度蚀刻引线框架 生产项目"入选2020年度山东省重大项目。 最新一期 ...
中国联通携手华大电子成立eSIM安全联合研究中心
Zhong Guo Chan Ye Jing Ji Xin Xi Wang· 2025-07-02 22:06
在安全生态建设方面,华大电子与产业链上下游企业紧密合作,共同研判eSIM技术前沿趋势,孵化创 新应用场景,推动eSIM技术在更多垂直领域落地应用,为用户提供安全便捷的智能互联体验,助力 eSIM技术的持续发展和创新。 eSIM安全联合研究中心的成立,标志着中国联通深化"AI+5g+eSIM"产业合作的新起点,也开启了探索 eSIM与多技术融合创新的新路径。通过安全协同的技术研究体系,推动eSIM技术以更安全、更高效的 方式应用于各行业领域。(联华) 双方将围绕eSIM全产业链安全需求,依托华大电子在eSIM芯片与嵌入式安全技术领域的长期积累,结 合中国联通在平台、网络与标准资源上的优势,重点开展eSIM芯片、操作系统、平台系统与终端设备 间的安全适配,构建端到端连接体系,制定全链路风险控制策略,筑牢数字通信安全防线。同时,为消 费电子、车联网、工业互联网等提供高安全、高可靠安全芯片产品及一站式解决方案。 在技术创新方面,探索eSIM个人化过程中的高安全写入机制,突破传统安全机制瓶颈;同时推动行业 标准适配应用,加速实现eSIM技术在不同场景、不同设备间的互联互通与生态融合。 近日,中国联通携手华大电子正式宣布 ...
紫光同芯邹重人:中国eSIM芯片首次实现大规模国际化商用
Jing Ji Guan Cha Bao· 2025-06-26 08:25
邹重人表示,eSIM之所以快速商业化落地,主要因其解决了产业链存在的痛点。 其解释称,从用户的角度,采用eSIM技术可以让用户选择运营商和套餐时更为便捷;对于运营商而 言,无需通过线下实体门店、实体卡发展用户,可大幅降低获客成本。 据GSMA Intelligence预测,2025年底全球将约有10亿eSIM智能手机连接,2030年将增长至69亿。邹重 人指出,未来,无论是手机、平板电脑还是各种AI专用终端,都可能嵌入eSIM芯片,以实现更高效地 连接和数据传输。 邹重人同时在会议上透露,紫光同芯新一代eSIM产品实现三大技术突破,包括:MEP多Profile同时激 活,支持运营商动态切换;OS Patch更新机制确保安全迭代;多证书体系兼容GSMA国际标准与国密算 法,打破地域限制,使国产eSIM芯片真正做到"一芯通全球"。 科技新品速递 经济观察网讯 近期,紫光同芯常务副总裁邹重人在2025 MWC上海世界移动通信大会上透露,紫光同芯 的eSIM产品在全球众多国家和地区实现商用,广泛应用于移动通信终端、可穿戴设备、汽车电子、物 联网终端等领域。 他表示,这是中国eSIM芯片第一次实现如此大规模的国际化商用 ...
IPO要闻汇 | 新增18家受理企业,本周1只新股申购
Cai Jing Wang· 2025-06-23 08:39
IPO Review and Registration Progress - 18 IPO applications were accepted last week, with Zhaoxin Integrated aiming to raise over 4 billion yuan [2][5] - Companies planning to list on the Sci-Tech Innovation Board include Chipmi Technology and Zhaoxin Integrated, while E-Tech plans to list on the Shanghai Main Board [2][5] - Chipmi Technology's revenue for 2022-2024 is projected to be 42 million, 130 million, and 208 million yuan, with net profits of 1.73 million, 36.39 million, and 68.94 million yuan respectively [5] - Zhaoxin Integrated has not yet achieved profitability, with revenues of 340 million, 555 million, and 889 million yuan, and net losses of 727 million, 676 million, and 951 million yuan during the same period [5] New Stock Issuance and Listing Dynamics - Two new stocks were listed last week, with Xinhenghui's first-day increase exceeding 229% [13] - Huazhi Jie, with an issue price of 19.88 yuan per share, closed at 53.87 yuan, marking a 170.98% increase on its first day [14] - Xinhenghui, with an issue price of 12.8 yuan per share, closed at 42.12 yuan, reflecting a 229.06% increase [16] - This week, Yitang Co. plans to raise 3 billion yuan through its IPO, focusing on semiconductor equipment [17] Policy and Regulatory Trends - The China Securities Regulatory Commission (CSRC) is seeking public opinion on the revised classification evaluation system for securities companies [18] - The Shenzhen Stock Exchange reported 129 cases of abnormal trading behavior, taking self-regulatory measures [18]
新恒汇上市首日涨229.06%,“芯片首富”虞仁荣资本版图再扩张
Cai Jing Wang· 2025-06-20 10:39
Core Viewpoint - New Henghui (301678.SZ), an integrated circuit packaging company, successfully went public on the ChiNext board, with its stock price surging significantly on the first day of trading, reflecting strong investor interest and confidence in the company’s growth potential [1][2]. Company Overview - New Henghui specializes in the research, production, sales, and testing services of chip packaging materials, with a focus on smart card business, which accounted for approximately 69.28% of its main business revenue in recent years [2]. - The company reported revenues of 6.84 billion yuan, 7.67 billion yuan, and 8.42 billion yuan for the years 2022 to 2024, with net profits increasing from 1.1 billion yuan to 1.86 billion yuan during the same period [2]. Financial Performance - In Q1 2025, New Henghui achieved a revenue of 2.41 billion yuan, representing a year-on-year growth of 24.7%, while net profit slightly decreased by 2.26% to 0.51 billion yuan [2]. - The smart card business has been the primary revenue source, but it is projected to decline by 3.6% in 2024 due to market conditions and increased competition [3]. Business Expansion - New Henghui plans to enhance its etched lead frame business, with an IPO fundraising target of 5.19 billion yuan aimed at projects that will increase production capacity significantly [3]. - The company anticipates that the new high-density QFN/DFN packaging materials project could lead to a substantial increase in revenue from the etched lead frame business, potentially surpassing that of the smart card business [3]. Leadership and Ownership - The company is led by Yu Renrong, a prominent figure in the semiconductor industry, who holds 31.94% of the shares, making him the largest shareholder [4]. - The second-largest shareholder, Ren Zhijun, holds 19.31% of the shares and has played a crucial role in the company's strategic restructuring and growth [4]. Debt and Financial Arrangements - Ren Zhijun's acquisition of shares was financed through a loan from Yu Renrong, leading to significant debt obligations, which have raised regulatory inquiries regarding the clarity of share ownership [5]. - Post-IPO, Ren Zhijun plans to use dividends from the company to repay the loan, with arrangements in place for potential share transfers to settle remaining debts [5].
新恒汇上市募资7.67亿首日涨229% 净利增速远超营收
Zhong Guo Jing Ji Wang· 2025-06-20 09:40
Core Points - New Henghui Electronics Co., Ltd. (stock code "301678") was listed on the Shenzhen Stock Exchange's ChiNext board, closing at 42.12 yuan with a rise of 229.06% and a total market capitalization of 10.09 billion yuan [1] - The company specializes in integrated circuit services, including research, production, sales, and testing of chip packaging materials, with key business segments in smart cards, etched lead frames, and IoT eSIM chip testing [1] - Major shareholders include Yu Renrong and Ren Zhijun, holding 31.94% and 19.31% of shares respectively, with Yu serving as a director and Ren as chairman [1] Business Performance - The company reported main business revenues of 410.02 million yuan, 380.54 million yuan, 531.69 million yuan, and 280.08 million yuan over the reporting periods, with corresponding gross profit margins of 35.27%, 30.56%, 33.76%, and 29.18% [4] - The gross profit margins for etched lead frames and IoT eSIM chip products were negative at -20.73% and -31.85% respectively in the first half of 2022 [4] - Revenue projections indicate a 23.14% increase from 2022 to 2024, with net profit expected to grow by 67.44% in the same period [9] Financial Highlights - The total amount raised from the public offering was 766.58 million yuan, with a net amount of 681.97 million yuan, exceeding the original plan by 16.33 million yuan [6] - The company anticipates revenues of 95.62 million yuan and net profits of 19.55 million yuan for the year 2025, reflecting growth rates of 13.56% and 5.10% respectively [10] - For the first half of 2025, expected revenues range from 43 million to 46.5 million yuan, with net profits projected between 10.18 million and 10.95 million yuan, indicating growth rates of 0.78% to 8.40% [10]
又一封测企业登陆创业板,新恒汇开盘大涨290.62%
Huan Qiu Shi Bao· 2025-06-20 02:17
截至2024年6月30日,发行人拥有已授权专利59项,其中发明专利32项。 根据股权关系架构,虞仁荣、任志军为新恒汇的控股股东及共同实际控制人。虞仁荣直接持有新恒汇31.41%的股份,通过冯源 绘芯间接持有新恒汇0.53%的股份,合计持有新恒汇31.94%股份,为新恒汇的第一大股东,并担任公司董事;任志军直接持有新 恒汇16.21%的股份,通过共青城志林堂间接持有新恒汇3.10%的股份,合计持有新恒汇19.31%的股份,为新恒汇的第二大股东, 并担任公司董事长。 6月20日,芯片封装材料与封装测试服务提供商新恒汇正式登陆创业板,开盘股价一度涨至50元/股,较发行价上涨290.62%,截 至发稿股价仍高达44.52元,较发行价上涨247.11%。 资料显示,新恒汇是一家集芯片封装材料的研发、生产、销售与封装测试服务于一体的集成电路企业,主要业务包括智能卡业 务、蚀刻引线框架业务以及物联网eSIM芯片封测业务。 智能卡业务是发行人的传统核心业务,主要包括智能卡芯片关键封装材料柔性引线框架产品的研发、生产和销售,以及主要依 靠自产的柔性引线框架向客户提供智能卡模块产品或模块封装服务。报告期内,发行人的主要收入和利润 ...
N新恒汇今日上市 开盘上涨290.63%
Zheng Quan Shi Bao Wang· 2025-06-20 01:54
| 代码 | 简称 | 上市日期 | 发行价(元) | 发行市盈率(倍) | 首日开盘涨跌幅(%) | 所属行业 | | --- | --- | --- | --- | --- | --- | --- | | 301678 | N新恒汇 | 2025.06.20 | 12.80 | 17.76 | 290.63 | 电子 | | 603400 | N华之杰 | 2025.06.20 | 19.88 | 13.05 | 206.84 | 机械设备 | | 603382 | 海阳科技 | 2025.06.12 | 11.50 | 12.69 | 186.96 | 基础化工 | | 688775 | 影石创新 | 2025.06.11 | 47.27 | 20.04 | 285.02 | 电子 | | 920027 | 交大铁发 | 2025.06.10 | 8.81 | 12.94 | 284.79 | 机械设备 | | 301590 | 优优绿能 | 2025.06.05 | 89.60 | 15.37 | 67.42 | 电力设备 | | 603049 | 中策橡胶 | 2025.06.05 | 46.50 ...
6月20日投资早报|顺丰控股5月速运物流业务收入同比增长13.36%,康达新材拟收购中科华微不低于51%的股权,今日两只新股上市
Sou Hu Cai Jing· 2025-06-20 00:35
【隔夜行情】 •周四(2025年6月19日),A股三大指数集体下跌,截至收盘,截至收盘,沪指报3362.11点,跌 0.79%;深成指报10051.97点,跌1.21%;创指报2026.82点,跌1.36%。两市成交额约12506.38亿元,较 前一个交易日放量约595.5亿元。 信通电子,证券代码001388,发行价格16.42元/股,发行市盈率20.52倍;公司是一家以电力、通信等特 定行业为核心服务目标的工业物联网智能终端及系统解决方案提供商;主要产品包括输电线路智能巡检 系统、变电站智能辅控系统、移动智能终端等,其中输电线路智能巡检系统类产品收入占比最高,是其 主要收入来源。 【重要新闻】 【上海国智技术揭牌 新一代全市场资管服务平台在沪启动建设】6月19日,今日,上海国智技术有限公 司(简称"上海国智技术")在2025陆家嘴论坛上揭牌,上海市委常委、常务副市长吴伟出席活动并为公 司揭牌。交通银行行长张宝江、上海市政府副秘书长刘平出席仪式。上海国智技术由国泰海通、中国太 保、浦发银行、中保投资公司等市属金融机构、交通银行以及华锐技术、界面智通财经、阶跃星辰等金 融科技、信息服务、财经数据领军企业,共同 ...