格隆汇9月26日丨微导纳米(688147.SH)在互动平台表示，公司是国内领先的ALD设备供应商，相关产品 涵盖了行业所需主流ALD薄膜材料及工艺。ALD技术在45nm以下节点以及3D结构等先进半导体薄膜沉 积环节具有良好的应用前景，是半导体设备中增长最快的领域之一。公司开发的国内首台成功应用于集 成电路制造前道生产线的量产型High-k ALD设备，解决了国内集成电路突破28nm制程节点最核心工艺 之一的高介电常数（High-k）栅氧层薄膜工艺。公司持续拓展技术覆盖面，陆续研发和推出HKMG技 术、柱状电容器、金属化薄膜沉积技术及高深宽比3D NAND、3DDRAM、TSV技术等工艺解决方案， 覆盖逻辑芯片、存储芯片、先进封装、化合物半导体和新型显示（硅基OLED）中ALD技术的主要应用 场景。 ...

格隆汇9月26日丨中国西电(601179.SH)在互动平台表示，公司目前和华为暂无直接合作。 ...

格隆汇9月26日丨中国西电(601179.SH)在互动平台表示，公司具备向核电行业供应相关输配电设备的资 质和能力，积极参与核电领域相关项目合作，聚焦输配电设备的研发和制造，持续开展技术攻坚，为我 国高端装备制造业升级贡献力量。 ...

Group 1 - The company, Hangcai Co., Ltd. (688563.SH), has confirmed that its titanium alloy castings and high-temperature alloy master alloys are utilized in the CJ1000A engine [1] - The company is currently working according to the planned schedule for this engine model [1]

汇量科技(1860.HK)现跌8.24%报18.81元，暂成交5亿元，最新市值296亿元。消息面上，联交所最新权益披露资料显示，汇量科技于9月25日遭执行董事宋笑 飞在场内以每股均价20.1521港元减持19.2万股，涉资约386.92万港元。减持后，其持股比例由0.14%下降至0.13%。(格隆汇) | 股份代號: | 01860 | | --- | --- | | 上市法國名稱: | 匯量科技有限公司 | | 日期 (日 / 月 / 年): | 26/08/2025 - 26/09/202 | | 表格序號 | 大股東/董事/最高行政人員名 作出披露的 買入 / 賣出或涉及的 每股的平均價 | | | | | 持有權益的股份數目 佔已發行的有關事件的日 相關法 | | | --- | --- | --- | --- | --- | --- | --- | --- | | | | 原因 | 股份數目 | | | （請參閱上述 * 註 有投票權股期(日 / 月 / 份權益 | | | | | | | | | 월 份百分比 年) | | | | | | | | | ( %) | | | DA20250925E0 ...

格隆汇9月26日｜今日，交通运输部等7部门发布关于"人工智能+交通运输"的实施意见。其中提到，到 2027年，人工智能在交通运输行业典型场景广泛应用，综合交通运输大模型体系落地部署，普及应用一 批智能体，建成一批"人工智能+交通运输"标志性创新工程，人工智能成为引领交通运输创新发展的重 要动力。到2030年，人工智能深度融入交通运输行业，智能综合立体交通网全面推进。智慧交通与智慧 物流领域关键核心技术实现自主可控，总体水平位于世界前列，培育一批新产业、新业态，形成较为完 备的交通领域人工智能治理体系，引领交通运输高质量发展和高水平安全迈上新台阶。 ...

Core Viewpoint - The company is focusing on the development of copper powder and other high thermal conductivity materials for MIM and 3D printing processes, targeting industrial applications with strong heat dissipation needs [1] Company Summary - The company has research and development plans to continuously develop copper powder and other high thermal conductivity materials for various industrial fields [1] - Currently, the company's products are not directly used in humanoid robot thermal management modules, but the company is closely monitoring market demand to expand into related application areas [1] Industry Summary - Heat dissipation is a critical issue for humanoid robot systems, especially as they evolve towards greater intelligence and performance [1] - The development of sensors, chips, controllers, and actuators in humanoid robots will require higher heat dissipation efficiency, indicating a growing demand for high thermal conductivity materials and advanced processing methods like MIM and 3D printing [1] - The humanoid robot industry is at a stage where market opportunities and technological challenges coexist, with expectations for rapid market growth as related technologies continue to evolve [1]

Group 1 - The company Youyan Powder Materials (688456.SH) has announced that its heat dissipation copper powder is being used in the Ascend series 910 chips [1]

Group 1 - The core viewpoint is that Fuhua Co., Ltd. (603219.SH) announced on the investor interaction platform that its Pingliang robot is expected to start mass sales in 2026, targeting the grain storage sector [1] Group 2 - The application scenario for the Pingliang robot is specifically in the grain storage field, indicating a focused market strategy [1]

格隆汇9月26日丨富佳股份(603219.SH)在投资者互动平台表示，平粮机器人预计2026年开始批量销售， 应用场景为粮食仓储领域。 ...