计量软件是一种几何测量、评估、检测和管理软件，可以提高测量操作的性能和产量。 计量软件全球市场总体规模 据 QYResearch 调研团队最新报告"全球计量软件市场报告 2025-2031 "显示，预计 2030 年全球计量软件市场规模将达到 10.6 亿美元 ，未来几年年复合增长率 CAGR 为 5.1% 。 根据 QYResearch 头部企业研究中心调研，全球范围内计量软件生产商主要包括 Hexagon 、 Carl Zeiss 、 InnovMetric 、 Ametek 、 FARO Technologies 、 Metrologic Group 、 Xi'an High-Tech AEH 、 Renishaw 、 Quality Vision International (QVI) 、 Verisurf Software 等。 2024 年，全球前五大厂商占有大约 84.0% 的市场份额。 就产品类型而言，目前 Cloud-based 是最主要的细分产品，占据大约 82.4% 的份额。 就产品应用而言，目前 Automotive 是最主要的需求来源，占据大约 28.2% 的份额。 主要驱动因素 D ...

全光交换 (OCS) 交换机是一种在光域内直接进行光信号交换的设备，无需进行光 - 电 - 光转换。光学电路交换 (OCS) 是一种光网络技术，它允许 在光信号层面直接进行路由和切换，而无需将其转换为电信号。这种技术通过在光纤之间建立直接连接，实现数据的高速传输，避免了传统电子 交换机带来的瓶颈。 01 全光交换(OCS)交换机行业目前现状分析 多技术路线并行突破，MEMS与硅光成主流方向 AI算力驱动市场扩张，数据中心成核心场景 OCS市场呈现高速增长态势，主要受AI集群和高性能计算需求推动。谷歌TPU v5集群通过OCS构建3D环面拓扑，显著提升训练效率与集群可用 性，验证了OCS在低延迟、高带宽场景中的价值。数据中心短距互联成为主要应用领域，同时电信骨干网、工业控制等场景同步发展。尽管仍处 于商业化初期，OCS已被视为下一代智能网络的关键基础设施。 国际厂商主导市场，国内厂商加速技术突破 全球OCS市场呈现双轨竞争格局：Coherent、Google、Calient、Lumentum等国际厂商凭借技术积累占据主导地位，其产品在电信级长距场景中不 可替代。国内厂商则通过技术创新和产能提升快速崛起。 光交换 ...

Review SEM 设备也称为缺陷复检设备（ DR-SEM ），属于电子束检测设备类别。电子束检测设备除了 DR-SEM 外，还包括了电子束缺陷检测设 备 (EBI) 。 Review SEM 设备是一种集成了传统扫描电子显微镜（ SEM ）成像功能与自动化缺陷复查系统的高端设备，广泛应用于半导体晶圆制造、光掩模 （ Photomask ）检测以及高精密器件生产中的质量控制环节。该设备能够对检测设备（如检测机、缺陷检测系统）预先标记出的微缺陷进行高分 辨率图像采集与自动识别，实现对缺陷类型、尺寸、形貌的分类、分析和记录。与普通 SEM 相比， Review SEM 通常具备自动导航、高通量图像 采集、 AI 缺陷分类、与 FAB 生产系统联动等功能，是晶圆厂中缺陷源头追溯、工艺优化和良率提升不可或缺的关键工具。注：本文中国市场仅 统计中国大陆，中国台湾地区单独统计。 Review SEM设备行业背景与发展历史 行业背景 Review SEM（Review Scanning Electron Microscope，复检扫描电子显微镜）是半导体制造流程中缺陷分析与工艺监控的关键设备。它不直接用于 生产，但对制程 ...

金属管内光纤是一种将光纤封装在金属管内的技术，其主要目的是保护光纤免受机械损伤及湿度、温度波动、化学腐蚀等环境因素的影响。这种金属管通常采 用不锈钢或其他耐腐蚀材料制成，管内填充缓冲材料以增强光纤的柔韧性和抗拉强度。该技术广泛应用于通信、传感和工业领域，尤其适用于对光纤可靠性和 使用寿命要求严苛的恶劣环境。 金属管内光纤 全球市场总体规模 根据 QYResearch 最新调研报告显示，预计 2030 年全球金属管内光纤市场规模将达到 356.51 百万美元，未来几年年复合增长率 CAGR 为 4.82% 。 就产品应用而言，因电力通信系统建设带来的巨大需求， OPGW （光纤复合架空地线）和 OPPC （光纤复合架空相线）仍然是最大的下游市场，占有 44.74% 份额。 就产品类型而言，因材质成本，以及环境适应性较强，大多数的下游应用会选择 304 不锈钢材质。 全球范围内，金属管内光纤核心厂商主要包括 AFL 、江苏中天科技股份有限公司、江苏通光电子线缆股份有限公司、长飞光纤光缆股份有限公司、 Prysmian Group 、亨通集团等，产品属于市场集中度较为集中，市场主要分布在欧美、以中国占主要份额的亚太 ...

液体软管卷盘是一种专门用于高效存储、管理和部署输送液体用柔性软管的工业或消防设备，其核心设计通过整合卷筒、旋转机构、软管导向装置及 安全组件，实现软管的快速收放、防缠绕和长期耐用。通常由金属（如镀锌钢、铝合金）或工程塑料构成的坚固框架提供支撑，内部配备弹簧自动回 卷或手动曲柄驱动的旋转系统，可适配不同材质的软管（如橡胶、 PVC 或聚氨酯），并集成防漏接头、压力调节阀及紧急制动装置以满足水、油、 化学品等介质的输送需求；消防专用型号还可能包含耐高温涂层、快速解锁机构及符合行业标准的接口设计。其应用场景覆盖工业生产线冷却液循 环、农业灌溉、油库装卸及消防灭火等领域，优势在于节省空间、减少软管磨损、提升作业效率，同时通过外罩或锁定功能避免意外松脱，部分高端 型号还支持定制化压力等级、软管长度和防爆认证，以适应化工厂、海上平台等严苛工况。 液体软管卷盘 全球市场总体规模 根据 QYResearch 最新调研报告显示， 预计 2030 年全球液体软管卷盘市场规模将达到 569.73 百万美元 ，未来几年年复合增长率 CAGR 为 4.5 % 。 就产品类型而言，开放式液体软管卷盘因适用的环境更多，占全球分类的 71. ...

聚晶金刚石刀具是 PCD 刀具的简称。聚晶金刚石 (PCD) 是一种合成金刚石产品，采用先进的技术将精选的金刚石颗粒与金属胎体烧结在一起。金刚石和胎体 在高温高压下烧结在一起，形成硬度均匀、各向耐磨的 PCD 刀具毛坯。 PCD 金刚石层随后被粘合到碳化钨基体上，从而提供强度和可钎焊的基底，以便与其 他金属进行粘合。 基于QYResearch最新报告 "全球 PCD 切割工具市场报告 2025-2031 " ，全球PCD切割工具市场核心数据与格局如下： 全球范围内 PCD 切割工具生产商主要包括 Sandvik Group 、 Kyocera 、上海名古屋、 Kennametal 、 Sumitomo Electric 、 Shenzhen Junt 、郑钻、 Union Tool 、 Mapal 、 Asahi Diamond Industrial 等。 2024 年，全球前十强厂商占有大约 61.0% 的市场份额。 一、 市场规模与增长（宏观前景） 2031年市场规模 ：预计将达到 13.9亿美元 2025-2031年复合年增长率 (CAGR) ： 5.5% 表明市场处于稳定且健康的增长通道。 二、 竞争 ...

Core Viewpoint - The article discusses the growth and trends in the PVDF lithium battery binder market, highlighting its importance in the lithium-ion battery industry and the expected market dynamics through 2031 [11][14][18]. Group 1: Market Overview - PVDF is the most commonly used binder in lithium-ion batteries, crucial for enhancing the contact between active materials and conductive agents, directly affecting battery capacity, lifespan, and safety [2]. - The global PVDF lithium battery binder market is projected to reach 4.767 billion yuan in 2024 and 12.101 billion yuan by 2031, with a compound annual growth rate (CAGR) of 16.51% from 2025 to 2031 [14]. - China dominates the market, accounting for approximately 78.88% of the global market size in 2024, expected to reach 78.93% by 2031 [16]. Group 2: Production and Consumption - Major producers of PVDF lithium battery binders include Wu Yu, Syensqo, and Arkema, with the first tier of manufacturers holding about 33.24% of the market share in 2024 [17]. - The production method of PVDF binders primarily involves suspension polymerization, which allows for higher resin quality compared to emulsion polymerization [5]. - The market is currently experiencing overcapacity due to rapid expansion in production, leading to increased competition and price pressure [18]. Group 3: Application Segments - The primary applications of PVDF lithium battery binders are in digital batteries, energy storage batteries, and power batteries, with power batteries expected to hold a market share of approximately 74.09% in 2024 [6][10]. - The energy storage sector is gaining attention as a strategic support for the transition of energy structures and the transformation of electricity production and consumption [9]. Group 4: Policy and Industry Trends - The article outlines the Chinese government's policies aimed at promoting high-quality development in the fine chemical industry, which includes the PVDF sector [19]. - The "anti-involution" policy introduced in 2025 aims to curb low-price competition and encourage technological innovation within the lithium battery industry [21][23].

Core Viewpoint - The article discusses the current state and future trends of the chip alloy resistor market, highlighting its significance in modern electronic devices, particularly in automotive applications driven by the rise of electric vehicles and smart technologies [1][3][8]. Group 1: Current Market Analysis - The chip alloy resistor market is predominantly concentrated in the Greater China region, with an expected combined market share of 88.77% in 2024 [3]. - The automotive sector is a major growth driver, with increasing demand for high-reliability, high-current capacity alloy resistors due to the rise of electric vehicles and smart driving technologies [3][8]. - The global market size for alloy resistors is projected to reach approximately $670 million in 2024, with an expected growth to $1.215 billion by 2031, reflecting a compound annual growth rate (CAGR) of 9.16% from 2025 to 2031 [6][7]. Group 2: Competitive Landscape - The global alloy resistor market exhibits a clear tiered competitive structure, with the top five manufacturers holding over 46% of the market share [12]. - Leading companies such as Isabellenhütte and QianKun Technology dominate the automotive-grade resistor segment, while Junwei Electronics focuses on consumer electronics [4][12]. Group 3: Development Trends - There is a trend towards ultra-high precision and low resistance values, with advancements in micro-ohm level resistors (±0.1mΩ) and precision of ±0.02% [5]. - The demand for miniaturization and lightweight components is driving the evolution of resistors towards smaller packaging sizes, such as 0201 (0.6×0.3mm) and even 01005 (0.4×0.2mm) [5]. - High reliability and adaptability to extreme conditions are becoming essential, particularly for electric vehicles requiring resistors to maintain ±0.5% temperature drift under high voltage fast charging scenarios [5]. Group 4: Policy Analysis - Various government policies support the development of high-quality electronic components, emphasizing the importance of new electronic materials and components in national economic planning [13][14]. - The focus on fostering specialized small and medium enterprises in the electronics sector is part of a broader strategy to enhance innovation and competitiveness in the industry [13][14].

Core Viewpoint - The edge AI chip market is expected to reach a size of $9.52 billion by 2031, with a compound annual growth rate (CAGR) of 18.3% from 2025 to 2031 [1][3]. Market Drivers - The rapid growth in demand for low-latency real-time intelligent processing is the main driver of the edge AI chip market. The limitations of traditional cloud computing in terms of bandwidth, latency, and privacy are pushing AI processing capabilities to the edge devices [3][4]. Market Composition - Edge AI chips are categorized into product types such as audio and sound processing, machine vision, and sensor data analysis, with machine vision holding a dominant market share of approximately 81.6% in 2024 [4][5]. - The automotive sector is the largest demand source for edge AI chips, accounting for about 55.7% of revenue in 2024 [5]. Key Players - Major global manufacturers of edge AI chips include NVIDIA, Ambarella, Horizon Robotics, Intel, AMD, Xilinx, NXP, Qualcomm, Google, and STMicroelectronics, with the top ten companies holding around 79.0% of the market share in 2024 [3][9]. Applications - Edge AI chips are widely used in various applications, including automotive, robotics, smart manufacturing, smart cities, and security monitoring [5][9]. Research Insights - The report provides comprehensive market analysis and trend forecasts, focusing on the overall scale of the global edge AI chip industry, market share, and rankings of major companies, as well as key statistical indicators such as production capacity, sales volume, revenue, pricing, and market share over the past and next five years [8][11].

超声波焊接是一种利用超声波频率的机械振动能量，使两种材料（通常是塑料或金属）在接触面上摩擦生热，从而达到熔融连接的技术。 超声波焊接机 全球市场总体规模 据 QYResearch 调研团队最新报告"全球超声波焊接机市场报告 2025-2031 "显示，预计 2031 年全球超声波焊接机市场规模将达到 11.4 亿美 元，未来几年年复合增长率 CAGR 为 4.2% 。 全球范围内， 超声波焊接机 主要生产商包括 Branson (Emerson) 、 Herrmann 、 MS Ultrasonic 、 Telsonic 、 Crest Group 等，其中十大厂商 占有大约 70.0 % 的市场份额。 就产品类型而言，目前塑料超声波焊接机是最主要的细分产品，占据大约 77.4% 的份额。 | 报告指标 | 详细信息 | | --- | --- | | | Branson (Emerson), Herrmann, MS Ultrasonic, Telsonic, Crest Group, | | | Schunk, Dukane, Ultrasonic Engineering Co.,Ltd, SONOTRO ...