作者：情报员 声明：市场有风险，投资需谨慎。本文为AI基于第三方数据生成，仅供参考，不构成个人投资建议。 本文源自：市场资讯 国家知识产权局信息显示，应用材料公司取得一项名为"保持设计文档内的分层结构信息"的专利，授权 公告号CN114616597B，申请日期为2019年11月。 ...

作者：情报员 国家知识产权局信息显示，应用材料公司取得一项名为"用于半导体处理系统的底部净化"的专利，授权 公告号CN115443528B，申请日期为2021年3月。 声明：市场有风险，投资需谨慎。本文为AI基于第三方数据生成，仅供参考，不构成个人投资建议。 本文源自：市场资讯 ...

应用材料周五尾盘上涨1.1%，此前德银将其股票评级从"持有"上调至"买入"，并将目标价从275美元上 调至390美元。德银称，此次评级上调反映了德意志银行对2026年和2027年晶圆制造设备（WFE）环境 持更为乐观的看法。 责任编辑：张俊 SF065 应用材料周五尾盘上涨1.1%，此前德银将其股票评级从"持有"上调至"买入"，并将目标价从275美元上 调至390美元。德银称，此次评级上调反映了德意志银行对2026年和2027年晶圆制造设备（WFE）环境 持更为乐观的看法。 责任编辑：张俊 SF065 ...

Core Viewpoint - The State Intellectual Property Office of China has granted a patent to Applied Materials for a technology related to magnetic fixtures and substrate support components, indicating the company's ongoing innovation in the semiconductor equipment sector [1]. Group 1: Patent Details - The patent is titled "Magnetic Fixtures, Substrate Support Components, and Methods for Fixing Edge Support Frames to Workbench Frames" [1]. - The patent authorization announcement number is CN116368435B [1]. - The application date for the patent was October 2020 [1].

Core Viewpoint - The State Intellectual Property Office of China has granted a patent to Applied Materials for a method to increase the growth rate of selective epitaxial growth, with the announcement number CN114551229B and an application date of March 2016 [1] Group 1 - The patent focuses on enhancing the growth rate of selective epitaxial growth, which is significant for semiconductor manufacturing [1] - The patent was officially granted after a lengthy application process that began in March 2016 [1]

Group 1 - The core point of the article is that Applied Materials has been granted a patent for a technology titled "Disposal of Enhanced Material Structures" with the announcement number CN114446767B, which was applied for on November 2021 [1] Group 2 - The patent acquisition indicates Applied Materials' ongoing innovation and commitment to enhancing material processing technologies [1] - The patent may provide a competitive advantage in the semiconductor and materials industry, potentially impacting market dynamics [1] - The information is sourced from the National Intellectual Property Administration, highlighting the importance of intellectual property in technology sectors [1]

Group 1 - The core point of the article is that Applied Materials has obtained a patent for a technology related to "low-temperature plasma pre-cleaning for selective gap filling" [1] Group 2 - The patent was granted with the announcement number CN114930520B and the application date was June 2021 [1]

美股三大指数集体收涨，道指涨0.60%，标普500指数涨0.26%，纳指涨0.25%。芯片股在台积电亮眼财报推动下上涨，应用材料、阿斯麦涨超5%，台积电涨 超4%，英伟达涨超2%。银行股走强，贝莱德、摩根士丹利涨超5%，高盛、花旗涨超4%。 纳斯达克中国金龙指数收跌0.6%，热门中概股多数下跌，网易、携程、有道跌超2%，京东跌1.4%，百度跌0.7%，哔哩哔哩跌0.6%，阿里巴巴涨0.6%，理想 汽车、小鹏汽车、蔚来涨超1%。 ...

消息面上，台积电公布的2025年第四季度业绩显示，该公司第四季度净利润达5057亿元台币，超出市场 预期，创下公司历史上最高的季度净利润，并实现连续八个季度的利润增长。另外，公司第四季度毛利 率为62.3%，亦超出市场预期。 台积电预计，2026年第一季度营收将处于346亿美元至358亿美元区间，毛利率将处于63%至65%区间， 经营利润率将处于54%至56%区间。公司还预计，2026年全年资本支出将处于520亿美元至560亿美元区 间。 智通财经APP获悉，周四，半导体设备与材料板块盘前普涨，应用材料(AMAT.US)涨逾8%，阿斯麦 (ASML.US)涨逾7%，科磊(KLAC.US)涨近7%，台积电(TSM.US)、日月光半导体(ASX.US)涨逾5%，美 光科技(MU.US)涨近4%。 ...

Core Viewpoint - The semiconductor equipment and materials sector experienced a significant pre-market rally, driven by strong earnings reports from TSMC, which exceeded market expectations and marked a record high for quarterly net profit [1] Group 1: Company Performance - TSMC reported a net profit of NT$505.7 billion for Q4 2025, surpassing market expectations and achieving the highest quarterly net profit in the company's history [1] - The company has achieved profit growth for eight consecutive quarters, indicating strong operational performance [1] - TSMC's Q4 gross margin was 62.3%, also exceeding market expectations [1] Group 2: Future Projections - TSMC forecasts Q1 2026 revenue to be in the range of $34.6 billion to $35.8 billion, with a gross margin expected between 63% and 65% [1] - The operating margin is projected to be between 54% and 56% for the same period [1] - The company anticipates full-year capital expenditures for 2026 to be between $52 billion and $56 billion [1]